Connectors - Catalog - Panasonic Electric Works Europe AG

Automation Controls
Group Catalog
Connectors
industrial.panasonic.com/ac/e/
2016-2017
High Current Connectors
Active Optical Connectors
TA B L E
O F
C O N T E N T S
Page
Feature of TOUGH CONTACT...................................................2
Guide for Navigating Website..................................................4
Narrow pitch Connectors
Narrow pitch Connectors Selector Chart.................................8
0.35 mm pitch
S35.........................................................................................20
A35US....................................................................................27
A35S......................................................................................32
P35S......................................................................................38
0.4 mm pitch
A4US......................................................................................44
A4S........................................................................................52
F4S........................................................................................59
P4S........................................................................................66
P4S Shield type.....................................................................75
P4...........................................................................................80
0.5 mm pitch
P5KF......................................................................................90
P5K / P5KS............................................................................96
High Current Connectors
High Current Connectors Selector Chart...............................15
A35US with power terminal..................................................105
A35P....................................................................................110
B01.......................................................................................115
L2.........................................................................................120
FPC/FFC Connectors
FPC Connectors Selector Chart............................................18
Y2B (0.2 mm pitch)..............................................................124
Y3BL (0.3 mm pitch)............................................................128
Y3B / Y3BW (0.3 mm pitch).................................................132
Y3BC (0.3 mm pitch)............................................................140
Y4BH (0.4 mm pitch)............................................................144
Y5B / Y5BW (0.5 mm pitch).................................................148
Active Optical Connector
V series................................................................................153
MID Solutions
MIPTEC................................................................................162
LDS......................................................................................164
MID Package AAM11...........................................................168
Notes on Using Narrow pitch Connectors/High Current
Connectors.............................................................................171
Notes on Using High Current Connector L2........................175
Notes on Using FPC Connectors.........................................178
Notes on Using Active Optical Connector V Series...........181
ISO14001, ISO9001, ISO/TS16949 Certificate of
Approval.................................................................................184
INDEX.....................................................................................185
Automation Controls Sales Network...................................192
ACCTB34E 201602-T
1
Putting our customers first…
High Reliability
Panasonic continually strives to increase product reliability by
working closely with our customers and meeting their stringent
design requirements.
Hence, Panasonic developed
Connectors.
The
technology address small footprint
design requirements for use in most operating environments.
Tough ... against shock impact!
Bellows contact construction able
to withstand twisting and
mechanical shock if dropped.
The high precision design curved molding provides the right
amount of spring action from the contacts which is made
possible by means of high precision-metal-processing, one
of Panasonic's core technologies.
This spring-like feature is key in many mobile devices.
 Simulation Analysis
Through extensive analysis,
the contacts are optimally
designed to bring the best
spring action. Once this is
set, the contacts are then
precision molded.
Tough ... against exposure to foreign particles and solder flux!
Patented
*Contact image of A4S
V notch contact construction improves
contact reliability (Prevents entry of foreign particles)
 Evaluation example of plastic powder
adhered on post contact surface
The amount of contact pressure (per unit area) was
dramatically increased by taking into consideration the
contact edge design. This further improves the overall
ability to resist foreign particles from entering inside the
contact area.
• 2-point contacting • Surface contact to edge contact
• Improved contact movement effect before and after V notch
passage • The combination of these effects greatly improves
contact reliability (resistance to entry of foreign matter)
 Product without notch
 V notched product
 A4S Contact Construction View
More effective in
eliminating flux and
foreign particles, and
also more effective in
keeping foreign particles
from getting inside
Cross section of the
socket side contact
Cross section of the
header side contact
Same effect as
V notch attained
by double contact.
Double contact
Patent and Design
2
Japan:
Registration of patent
(Patent No. 3726836)
Korea:
Registration of patent
(Patent No. 531938)
Taiwan:
Registration of patent
(Patent No. 1225323)
China:
Registration of patent
(Patent No. 1314171)
North America:
Registration of patent
(Patent No. 7278861)
ACCTB35E 201602-T
Withstands various
environmental conditions
series
0.35mm pitch
S35/A35US/A35S/P35S
0.4mm pitch
A4US/A4S/F4S/P4S/P4S Shield type/P4
0.5mm pitch
P5KF/P5K/P5KS
Stacking connector for high current
Four Key Points
A35US with power terminal/A35P/B01
Tough against solder rise!
Ni Barrier construction
Prevents Solder Rise
Exposed nickel is placed on mid part of socket contacts. This contact,
while being ultra low in profile, prevents solder rise.
• Influence of solder controlled in contact and contact spring parts.
• Solder remains in the terminals and stable fillet mold is possible.
 Exposed Ni barrier
portion
Cu
Ni
Au
 Solder rise after reflow
Example without Ni barrier
Example with Ni barrier
Rises past
lead and into
horizontal
area.
Ni exposure
part
Exposed
Ni portion
Solder paste coating conditions:
Metal screen thickness; 120 m; Open ratio 90% (solder amount 136% of recommended value)
Reflow conditions:
(lead-free solder conditions) temperature profile; 260C peak temperature, atmosphere;
N2 reflow (oxygen concentration 1,000 ppm)
Tough against corrosive gases!
Porosity Treatment
Resistance to Corrosion
This treatment consists of coating surface with a very thin film
to seal pinholes in the gold plating. We have developed this
porosity treatment technology, which ensures the same contact
reliability for thin gold plating as that of thick gold plating.
• Improvement in resistance to corrosion
• Improvement in insertion/ removal durability
• Improvement in contact reliability for digital signals
 Plating technology
(Porosity treatment technology)
Porosity treatment film
Pinholes
Au plating
Surrounding gas
Number of pinholes (piece/mm2)
Cross section of the
socket side contact
Limit of
solder rise.
Relationship between gold plate
thickness and number of pinholes
This shows the relationship between the
thickness of the gold plating on the nickel
plating (1 m) and the number of pinholes.
101
100
10-1
0
1
2
Gold plate thickness (m)
 Improvement of the corrosion resistance
Status of the post’s contact after the sulfur dioxide test
<Porosity-treated product>
<Conventional product>
Corroded mainly
at the pinholes.
Ni plating
Base material
ACCTB35E 201602-T
Test conditions SO2 concentration: 103 ppm, Humidity: 90 to 95% RH
Temperature: 402C Time: 145 hours
3
Guide for Navigating Website
Main Web Page of Automation Controls
You can check
discontinued products.
You can access the
FAQ 24 hours a day.
You can also send
inquiries by e-mail.
Download Center
At the download center you can
download information about products
such as product catalogs and CAD data.
* Some products are not listed.
4
ACCTB36E 201602-T
http://industrial.panasonic.com/ac/e/
Product pages
Individual product front pages and an application-based search function are provided for each product category.
Front page of connectors
Product page
 Product list
PDF catalogs and CAD data can
be downloaded*.
Correspondence data:
2D (DXF) 3D (IGES, Palasolid, STEP, PDF)
*Registration is required to download CAD data.
Specifications are displayed by part
number in an easy-to-read form.
(You can choose a product even if you only know its part number.)
 Dimensions search
(Part number, specification and application searches are also available.)
ACCTB36E 201602-T
5
CONNECTORS
Narrow Pitch Connectors
0.35 mm Pitch
FPC/FFC Connectors
P124→P152
P20→P43
Narrow Pitch Connectors
0.4 mm Pitch
Active Optical
Connectors
P153→P157
P44→P89
Narrow Pitch Connectors
0.5 mm Pitch
Technology Introduction
3D Packaging Devices
MID Solutions
P159→P170
P90→P104
High Current
Connectors
P105→P123
2
Feature of
175
Notes on Using High Current Connector L2
4
Guide for Navigating Website
178
Notes on Using FPC Connectors
8
Narrow pitch Connectors Selector Chart
181
15
High Current Connectors Selector Chart
Notes on Using Active Optical Connector
V Series
18
FPC Connectors Selector Chart
184
Notes on Using Narrow pitch Connectors/
High Current Connectors
ISO14001, ISO9001, ISO/TS16949 Certificate
of Approval
185
INDEX
171
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–6–
© Panasonic Corporation 2016
ACCTB37E 201602-T
Narrow pitch connectors
High Current Connectors
series
Narrow pitch
connectors
0.35 mm pitch
Narrow pitch
connectors
0.4 mm pitch
Narrow pitch
connectors
0.5 mm pitch
High Current
Connectors
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–7–
© Panasonic Corporation 2016
ACCTB38E 201602-T
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Narrow pitch Connectors Selector Chart
0.35 mm pitch
Terminal pitch
For board-to-FPC
Types
S35
A35US
Socket: AXG1∗∗∗
Header: AXG2∗∗∗
Socket: AXG7∗∗∗
Header: AXG8∗∗∗
Product name
Part No.
Shape
Width 1.7 mm slim and low profile two-piece type
connector
“
” construction for both high
contact reliability and good workability.
For 0.6 mm mated height, thanks to our proprietary
"Fine fitting structure", high removability with a nice
click feel is maintained while being low profile.
Features
Active optical connectors
0.6mm
0.8mm
0.6 mm Mated Height with 2.2 mm width.
Proprietary Fine Fitting Construction
A slim 2.2 mm (width) design provides space-saving
benefits.
“
” structure provides a slim and
low-profile design resistant to various environmental
conditions.
Soldering terminals enhance mounting strength.
0.6mm
Mated height
Dimensions
(short width)
(Include terminal)
Socket: 1.7mm
Header: 1.5mm
Socket: 2.2mm
Header: 1.8mm
100
MID
90
80
70
Information
No. of pins
60
60
50
50 54
40
40 44
44
40 44
30
30 34
34
30 34
20
20 24
24
20 24
10 12 16
12
10 12 16
10
6
60
50
Rated current
0.3A/pin contact (Max. 5 A at total pin contacts)
0.3A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
60V AC/DC
60V AC/DC
Ambient temperature
–55°C to +85°C
–55°C to +85°C
Insertion and removal life
30 times
30 times
Terminal shape
SMD
SMD
RoHS compliant
Compliant
Compliant
P.20
P.27
Page
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–8–
© Panasonic Corporation 2016
ACCTB39E 201602-T
A35S
P35S
Socket: AXE7∗∗∗
Header: AXE8∗∗∗
Socket: AXT1∗∗∗
Header: AXT2∗∗∗
Small size (Terminal pitch:
0.35 mm, width: 2.5 mm and Mated height: 0.8 mm)
Low-profile connector with up to 100 pin contacts
Strong resistance to adverse environments! Utilizes
“
” construction for high contact reliability.
Connectors for inspection available
Small size 0.35 mm pitch contributes to device miniaturization
Strong resistance to adverse environments!
Utilizes “
” construction for high contact
reliability.
Pattern wiring possible on PC board below connectors
Connectors for inspection available
0.8mm
1.5mm
Socket: 2.5mm
Header: 2.0mm
Socket: 3.6mm
Header: 2.35mm
High current connectors
For board-to-FPC/board-to-board
100
100
80
80
70
70
60 64
60
50 54
50
40 44
40
MID
Active optical connectors
For board-to-FPC
FPC/FFC connectors
0.35 mm pitch
Narrow pitch connectors
Narrow pitch Connectors Selector Chart
20 24
10 12 16
0.25A/pin contact (Max. 4 A at total pin contacts)
0.25A/pin contact (Max. 4 A at total pin contacts)
60V AC/DC
60V AC/DC
–55°C to +85°C
–55°C to +85°C
30 times
50 times
SMD
SMD
Compliant
Compliant
P.32
P.38
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–9–
© Panasonic Corporation 2016
ACCTB39E 201602-T
Information
30 34
Active optical connectors
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Narrow pitch Connectors Selector Chart
0.4 mm pitch
Terminal pitch
For board-to-FPC
Types
A4US
Product name
A4S
Socket: AXE1∗∗∗
Header: AXE2∗∗∗
Part No.
Socket: AXE5∗∗∗
Header: AXE6∗∗∗
Shape
Width: 2.0 mm/2.2 mm and mated height: 0.6 mm/
0.8 mm
Strong resistance to adverse environments!
Utilizes “
” construction for high
contact reliability
The slim body has a sufficient suction face
Connectors for inspection available
Features
0.6mm
0.8mm
Socket: 2.2mm
Header: 1.8mm
Socket: 2.0mm
Header: 1.8mm
2.5 mm width slim two-piece type connector
Mated heights of 0.8 and 1.0 mm are available for the
same foot pattern
Strong resistance to adverse environments!
Utilizes “
” construction for high
contact reliability
Connectors for inspection available
0.8mm
1.0mm
Mated height
Dimensions
(short width)
(Include terminal)
Socket: 2.5mm
Header: 2.0mm
100
MID
90
Information
No. of pins
80
80
80
80
70
70
70
70
60
60
60 64
60
50 54
40 44
50
50
50
50 54
40
40
40
40 44
30
30
30 34 36
30 32 34 36
30 32
20 24
20 22 24 26 28
20 24 26
10 14 18
10 12 14 16 18
10 12 14
20
10
16
Rated current
0.3A/pin contact (Max. 5 A at total pin contacts)
0.3A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
60V AC/DC
60V AC/DC
Ambient temperature
–55°C to +85°C
–55°C to +85°C
Insertion and removal life
30 times
30 times
Terminal shape
SMD
SMD
RoHS compliant
Compliant
Compliant
P.44
P.52
Page
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–10–
© Panasonic Corporation 2016
ACCTB39E 201602-T
For board-to-FPC/board-to-board
F4S
P4S
P4S shield type
Socket: AXT5∗∗∗
Header: AXT6∗∗∗
Socket: AXT3∗∗∗
Header: AXT4∗∗∗
Socket: AXT3∗∗∗∗∗
Header: AXT4∗∗∗∗∗
Low-profile connectors that form a
board-to FPC connection with 1.0 mm
and 1.2 mm mated height
Strong resistance to adverse
environments!
Utilizes “
”
construction for high contact reliability
Connectors for inspection available
1.2mm
1.5mm
2.0mm
2.5mm
Radiation noise is reduced thanks to better
grounding with multi-point ground
construction and covering using a shield plate.
“
” ensures high
resistance to various environments
Previous product can also be used on
the header side
Freedom of design is increased, because
it has the same foot pattern as the
previous standard product
1.5mm
3.0mm
Active optical connectors
1.0mm
Wide range of mated height 1.5 mm,
2.0 mm, 2.5 mm and 3.0 mm
Strong resistance to adverse
environments!
Utilizes “
”
construction for high contact reliability.
Pattern wiring possible on PC board
below connectors
Connectors for inspection available
High current connectors
For board-to-FPC
FPC/FFC connectors
0.4 mm pitch
Narrow pitch connectors
Narrow pitch Connectors Selector Chart
Socket: 3.6mm
Header: 2.35mm
100
90
90
80
80
80
70
70
70
60 64
100
100
80
80
74
60
60 64
60
50 54
50
50 54
40 42 44 48
40
40 44 46
40
40
30
36 38
30 32 34
30
30
30
20
20
30 32 34 36
20 22 24 26 28
50
20 22 24 26
10 12 14 16
10
MID
100
Socket: 3.8mm
Header: 2.35mm
38
10 16
14
0.3A/pin contact (Max. 5 A at total pin contacts) 0.3A/pin contact (Max. 5 A at total pin contacts) 0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
60V AC/DC
60V AC/DC
–55°C to +85°C
–55°C to +85°C
–55°C to +85°C
50 times
50 times
50 times
SMD
SMD
SMD
Compliant
Compliant
Compliant
P.59
P.66
P.75
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–11–
© Panasonic Corporation 2016
ACCTB39E 201602-T
Information
Socket: 3.6mm
Header: 2.6mm
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Narrow pitch Connectors Selector Chart
0.4 mm pitch
Terminal pitch
For board-to-FPC/board-to-board
Types
P4 (Without soldering terminal)
Product name
Socket: AXK7∗∗∗
Header: AXK8∗∗∗
Part No.
Active optical connectors
Socket: AXK7∗∗∗
Header: AXK8∗∗∗
Shape
Wide range of mated height 1.5 mm, 2.0 mm, 2.5
mm, 3.0 mm and 3.5 mm
Strong resistance to adverse environments!
Utilizes “
” construction for high
contact reliability
Pattern wiring possible on PC board below
connectors
Connectors for inspection available
Features
1.5mm
2.0mm
2.5mm
3.0mm
Wide range of mated height 1.5 mm, 2.0 mm, 2.5
mm, 3.0 mm and 3.5 mm
Strong resistance to adverse environments!
Utilizes “
” construction for high
contact reliability
Pattern wiring possible on PC board below
connectors
Connectors for inspection available
With soldering terminals for improved mountability
3.5mm
1.5mm
2.0mm
2.5mm
3.0mm
3.5mm
80
80
70
70
60
60
Mated height
Dimensions
(short width)
(Include terminal)
Socket: 5.1mm
Header: 3.96mm
Socket: 5.1mm
Header: 3.96mm
100
100
MID
90
No. of pins
80
80
80
80
70
70
70
70
60
60 64
60
60
60
50
50 54
50
50
50
40
40 44
40
40
40
30
Information
P4 (With soldering terminal)
80
40
40
34
30
30
30
30
20
20 22 24 26
20 24 26
20 24
20 24
20
10
14
14
14
30 34
40
34
10
Rated current
0.3A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
60V AC/DC
Ambient temperature
–55°C to +85°C
Insertion and removal life
50 times
Terminal shape
SMD
RoHS compliant
Compliant
industrial.panasonic.com/ac/e/
36
20
20
12
P.80
Page
Panasonic Corporation Electromechanical Control Business Division
32
–12–
© Panasonic Corporation 2016
ACCTB39E 201602-T
0.5 mm pitch
For board-to-FPC/board-to-board
For board-to-board
P5KF
P5K
Socket: AXK5F∗∗∗
Header: AXK6F∗∗∗
Socket: AXK5∗∗∗
Header: AXK6∗∗∗
2.0mm
2.5mm
3.0mm
3.5mm
Active optical connectors
1.5mm
The mated heights are 3.0 mm and 3.5 mm
Strong resistance to adverse environments!
Utilizes “
” construction for high contact
reliability
FPC/FFC connectors
The mated height is the 1.5 mm, 2.0 mm and 2.5 mm
Strong resistance to adverse environments!
Utilizes “
” construction for high contact
reliability
Pattern wiring possible on PC board below connectors
High current connectors
Narrow pitch connectors
Narrow pitch Connectors Selector Chart
100
100
100 120
100 120
80
80
80
80
80
70
70
70
70
70
60
60
60
60
60
50
50
50
50
50
40
40
40
40
40
30 32 34
30 34
30 34
30
30 34
20 22 24 26
20 22 24 26
20 22 24
20 22
20 22
10 12 14 16 18
10 12 14 16 18
10 12 14 16
0.5A/pin contact (Max. 10 A at total pin contacts)
0.5A/pin contact (Max. 10 A at total pin contacts)
60V AC/DC
60V AC/DC
–55°C to +85°C
–55°C to +85°C
50 times
50 times
SMD
SMD
Compliant
Compliant
P.90
P.96
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–13–
© Panasonic Corporation 2016
ACCTB39E 201602-T
MID
Socket: 5.8mm
Header: 4.6mm
Information
Socket: 5.8mm
Header: 3.3mm
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Narrow pitch Connectors Selector Chart
0.5 mm pitch
Terminal pitch
For board-to-board
Types
P5KS
Product name
Socket: AXK5S∗∗∗
Header: AXK6S∗∗∗
Part No.
Shape
Wide range of mated height (4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm, 7.0 mm, 8.0 mm, and 9.0
mm)
Strong resistance to adverse environments! Utilizes “
” construction for high contact
reliability
Features
Active optical connectors
4.0mm
4.5mm
5.0mm
5.5mm
6.5mm
7.0mm
8.0mm
9.0mm
Mated height
Dimensions
(short width)
(Include terminal)
Socket: 5.4mm
Header: 5.0mm
100
100
100
100
100
100
100
100
100
100
80
80
80
80
80
80
80
80
80
80
70
70
70
70
70
70
70
70
70
70
60
60
60
60
60
60
60
60
60
60
50
50
50
50
50
50
50
50
50
50
40
40
40
40
40
40
40
40
40
40
30
30 34
30 34 36
30 34
30 34
30
30
30
30
30
20
20 24
20 24
20 24
20 24
20
20
20
20
20
MID
90
No. of pins
Information
6.0mm
10
Rated current
0.5A/pin contact (Max. 16 A at total pin contacts)
60V AC/DC
Rated voltage
Ambient temperature
–55°C to +85°C
Insertion and removal life
50 times
Terminal shape
SMD
RoHS compliant
Compliant
P.96
Page
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–14–
© Panasonic Corporation 2016
ACCTB39E 201602-T
Connector for board-to-FPC
Types
Product name
Part No.
A35US with power terminal
A35P
B01
Socket: AXG7∗∗∗J∗
Header: AXG8∗∗∗J∗
Socket: AXF5A∗∗∗
Header: AXF6A∗∗∗
Socket: AXF36∗500
Header: AXF46∗500
Shape
Supports 3A power terminals
Power terminal type make pin
reduction possible
“
” structure
provides a slim and low-profile
design resistant to various
environmental conditions.
0.6 mm mated height with 2.2 mm
width.
0.6mm
0.8mm
0.6mm/0.8mm
Socket: 2.2mm
Header: 1.8mm
Socket: 2.5mm
Header: 2.0mm
Socket: 2.4mm
Header: 1.8mm
Active optical connectors
Features
High current rating 5 A (using 1.25 High current rating: 6A (3A/pin × 2
A/pin × 8 pins)
pins)
Support of high current means
Low profile but high removal force
number of pins can be reduced.
Helps make mobile devices
Increased design freedom (pin
thinner thanks to its low profile
layout and multiple high current
height of 0.6mm/0.8mm.
lines)
Mated height: 0.8 mm and width:
2.5 mm
Mated height
Dimensions
(short width)
(Include terminal)
100
100
80
70
70
60
60
60 64
50
50
50 54
40
40 44
40 44
30
30 34
30 34
20
20 24
20 24
10
10 12 16
10 12 16
6
1.5 A/pin contact × 4 pin contacts or 1.25 A/pin
contact × 8 pin contacts (as power contact)
3.0A/pin contact (Power terminal)
0.5 A/pin contact (as signal contact)
0.3A/pin contact (Signal terminal)
(Max. 12 A at total pin contacts)
Rated current
3.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
(Max. 5 A at total pin contacts)
Rated voltage
60V AC/DC
30V AC/DC
30V AC/DC
Ambient temperature
–55°C to +85°C
–55°C to +85°C
–55°C to +85°C
Insertion and removal life
30 times
30 times
30 times
Terminal shape
SMD
SMD
SMD
RoHS compliant
Compliant
Compliant
Compliant
P.105
P.110
P.115
Page
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–15–
© Panasonic Corporation 2016
ACCTB91E 201602-T
Information
80
MID
90
No. of pins
High current connectors
0.8 mm pitch
FPC/FFC connectors
0.35 mm pitch
Terminal pitch
Narrow pitch connectors
High Current Connectors Selector Chart
Narrow pitch connectors
High current connectors
FPC/FFC connectors
Active optical connectors
MID
Information
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–16–
© Panasonic Corporation 2016
FPC Connector
Series
0.2 mm pitch
0.3 mm pitch
0.4 mm pitch
(Impedance
matching type)
0.5 mm pitch
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–17–
© Panasonic Corporation 2016
ACCTB41E 201602-T
High current connectors
Narrow pitch connectors
FPC Connectors Selector Chart
Contact pitch
0.2mm pitch
Product name
Y2B
Y3BL
Y3B
Y3BW
AYF21∗∗35
AYF35∗∗25
AYF33∗∗35
AYF33∗∗65
Part No.
Shape
Slim (width: 3.15 mm)
and low profile design
Double top and bottom
contacts
Wiring patterns can be
placed underneath the
connector
FPC/FFC connectors
Features
Active optical connectors
0.3mm pitch
Lock structure
Low profile (0.6 mm) and
slim design
Compatible with FPC 0.2
mm thickness
High durability assured
with proprietary
soldering terminals
Wiring patterns can be
placed underneath the
connector
Back lock
Slim (width: 3.15 mm) and low profile design
Double top and bottom contacts
Wiring patterns can be placed underneath the
connector
Y3BW features lock holding type
1. With a structure that temporarily holds the FPC
2. Higher FPC holding force
Back lock
Back lock
Compatibility with
FPC/FFC
FPC
FPC
FPC
Applicable FPC/FFC
thickness
0.2mm
0.2mm
0.2mm
Top and bottom double contacts
Top contact
Top and bottom double contacts
Contact pitch
0.2mm
0.3mm
0.3mm
Terminal pitch
0.4mm
0.6mm
0.6mm
Mounting height
0.9mm
0.6mm
0.9mm
3.15mm (Including lever)
2.95mm
3.35mm (Including lever)
2.95mm
3.15mm (Including lever)
2.95mm
Contact structure
Dimensions
(width)
MID
70
Information
No. of pins
71
60
61
50
51
51
51
40
41
45
41 45
30
31
20
23
10
61
31
23
39
25
11
2 to 9
27
15
7
51
31 33 35 37 39
21 23 25 27
25
11 13
11
7
15 17
8
9
Rated current
0.2A/pin contact
(Max. 5A at total pin contacts)
0.2A/pin contact
0.2A/pin contact
Rated voltage
50V AC/DC
50V AC/DC
50V AC/DC
Ambient temperature
–55°C to +85°C
–55°C to +85°C
–55°C to +85°C
Insertion and removal life
20 times
20 times
20 times
Terminal shape
SMD
SMD
SMD
RoHS compliant
Compliant
Compliant
Compliant
P.124
P.128
P.132
Page
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–18–
© Panasonic Corporation 2016
ACCTB42E 201602-T
Y3BC
Y4BH
Y5B
Y5BW
AYF36∗∗∗35
AYF4∗∗∗35
AYF53∗∗35
AYF53∗∗65T
Double top and bottom
contacts
Slim (width: 3.5 mm) and low
profile design
Wiring patterns can be placed
underneath the connector
Lever open/close operation
is possible without FPC
inserted
Differential impedance matching
(100, 90, 85 Ω) compliant with
various high-speed transmission
standards
Double top and bottom contacts
Easy-to-handle back lock structure
Man-hours of assembly time can be
reduced by delivering the
connectors with their levers opened
Low profile, space saving back lock type with improved lever
operability
Top and bottom double contacts structure
Wiring patterns can be placed underneath the connector
Y5BW features lock holding type
1. With a structure that temporarily holds the FPC
2. Higher FPC holding force
Back lock
FPC
FPC
0.2mm
0.3mm
Back lock
FPC/FFC
FPC
0.3mm
Top and bottom double contacts Top and bottom double contacts
Active optical connectors
Back lock
0.5mm pitch
Top and bottom double contacts
0.4mm
0.5mm
0.6mm
0.4mm
0.5mm
1.0mm
1.0mm
1.0mm
3.5mm (Including lever)
3.2mm
3.7mm (Including lever)
3.2mm
3.7mm (Including lever)
3.2mm
31
50
50
40
40 42
40 48
30 32 34
30 32 38
24 28
22 26 28
10 12 14 16
10 12 14
39
25
4
5
6
8
2
0.2A/pin contact
0.3A/pin contact
0.5A/pin contact
50V AC/DC
50V AC/DC
50V AC/DC
–55°C to +85°C
–55°C to +85°C
–55°C to +85°C
20 times
20 times
20 times
SMD
SMD
SMD
Compliant
Compliant
Compliant
P.140
P.144
P.148
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–19–
© Panasonic Corporation 2016
3
4
6
8
ACCTB42E 201602-T
Information
MID
0.3mm
High current connectors
0.4mm pitch
FPC/FFC connectors
0.3mm pitch
Narrow pitch connectors
FPC Connectors Selector Chart
Narrow pitch connectors S35 (0.35mm pitch)
S35
Narrow Pitch Connectors
(0.35mm pitch)
FEATURES
1. Width 1.7 mm slim and low profile
two-piece type connector
Mated height 0.6 mm
Smaller compared to A35US
• Width: Approx. 33% down
2. Proprietary “
construction for both high contact
reliability and good workability.
(h = 0.6 mm)
m
5m
1.
Socket
Mated
height
0.6mm
Socket
s)
Approx. 33%
down
S35
m
FPC/FFC connectors
8.4
)
h
itc
Width: 2.2mm (A35US)
pin
(34
5m
Header
Width: 1.7mm (S35)
1.7
mm
5
0.3
mm
(p
RoHS compliant
2-point soldering
Mated height 0.8 mm
Smaller compared to A35S/A4S
• Width: Approx. 32% down
<Mating cross section>
Mated
height
0.8mm
Active optical connector
”
<Mating cross section>
m
7m
1.
High current connectors
Narrow pitch connectors
For board-to-FPC
Approx. 32%
down
S35
s)
Header
1.5
mm
5
0.3
5
0
mm
) 7.7
tch
mm
mm
(pi
(34
pin
(h = 0.8 mm)
Width: 1.7mm (S35)
Width: 2.5mm (A35S/A4S)
Socket
s)
8.3
)
tch
1.7
m
mm
(pi
(34
pin
5m
0.3
2-point soldering
s)
Header
m
MID
)
1.5
m
mm
ch
pit
(34
pin
0m
7.6
(
5m
0.3
Information
3. For 0.6 mm mated height, thanks to
our proprietary “Fine fitting structure”,
high removability with a nice click feel
is maintained while being low profile.
APPLICATIONS
All types of board-to-FPC connection
applications for miniature mobile
devices such as wearable devices.
–20–
ACCTB66E 201602-T
Narrow pitch connectors S35 (0.35mm pitch)
1
4
4
AXG
2
2
1: Socket
2: Header
Number of pins (2 digits)
Number of pins (2 digits)
Mated height
<Socket>/<Header>
1: 0.6 mm
Mated height
<Socket>/<Header>
2: 0.8 mm
Functions
4: Without positioning bosses / Fine fitting structure
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
PRODUCT TYPES
Mated height
0.6mm
0.8mm
Number of pins
6
10
12
16
20
24
30
34
40
44
50
54
60
12
24
34
44
Part number
Socket
AXG106144
AXG110144
AXG112144
AXG116144
AXG120144
AXG124144
AXG130144
AXG134144
AXG140144
AXG144144
AXG150144
AXG154144
AXG160144
AXG112224
AXG124224
AXG134224
AXG144224
Packing
Header
AXG206144
AXG210144
AXG212144
AXG216144
AXG220144
AXG224144
AXG230144
AXG234144
AXG240144
AXG244144
AXG250144
AXG254144
AXG260144
AXG212224
AXG224224
AXG234224
AXG244224
Inner carton (1-reel)
Outer carton
15,000 pieces
30,000 pieces
15,000 pieces
30,000 pieces
Information
MID
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
4
High current connectors
AXG
1: Socket
2: Header
FPC/FFC connectors
■ Mated height: 0.8mm
Active optical connector
■ Mated height: 0.6mm
Narrow pitch connectors
ORDERING INFORMATION
–21–
ACCTB66E 201602-T
Narrow pitch connectors S35 (0.35mm pitch)
High current connectors
Narrow pitch connectors
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
Max. 0.3 A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (Initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Ambient temperature
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for 1 min.
Using 250V DC megger (applied for 1 min.)
According to the contact resistance measurement method of
JIS C 5402
• h = 0.6 mm 20 or less pins: Max. 26.0N, pin contact
Over 22 pins: Max. 1. 300 N/pin contact × pin
contacts (Initial stage)
• h = 0.8 mm Max. 1. 300 N/pin contact × pin contacts
(Initial stage)
Min. 0.215N/pin contact × pin contacts
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
No icing or condensation.
Infrared reflow soldering
Soldering iron
No icing or condensation.
Active optical connector
FPC/FFC connectors
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(Header and socket mated)
Environmental
characteristics
Humidity resistance
(Header and socket mated)
Salt water spray resistance
(Header and socket mated)
H2S resistance
(Header and socket mated)
Lifetime
characteristics
Insertion and removal life
Unit weight
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
Humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
Salt water concentration 5%±1%
Conformed to JEIDA-38-1984
After 48 hours
Bath temperature 40°C±2°C,
Contact resistance: Max. 90mΩ
Gas concentration 3 ppm ±1 ppm,
Humidity 75% to 80% R.H.
Repeated insertion and removal cycles of max. 200 times/
30 times
hour
34 pin contacts Socket h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g
Header h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g
Part name
Material
Molded portion
Heat resistant plastic (LCP resin)
(UL94V-0)
Contact and Post
Copper alloy
Surface treatment
—
Contact portion (Main): Au plating (Min. 0.1μm) over nickel
Contact portion (Sub): Au plating (Min. 0. 05μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
Information
MID
2. Material and surface treatment
–22–
ACCTB66E 201602-T
Narrow pitch connectors S35 (0.35mm pitch)
Narrow pitch connectors
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.6 mm)
A
B±0.1
0.35±0.05
0.12±0.03
Terminal coplanarity
0.59
0.08
1.64
(Contact and soldering terminals)
Dimension table (mm)
(0.825)
Z (Note 1)
0.24±0.03
C±0.1
0.46
1.70
Y (Note 1)
General tolerance: ±0.2
Number of pins/
dimension
6
3.55
0.70
2.95
10
12
16
20
24
30
34
40
44
50
54
60
4.25
4.60
5.30
6.00
6.70
7.75
8.45
9.50
10.20
11.25
11.95
13.00
1.40
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
3.65
4.00
4.70
5.40
6.10
7.15
7.85
8.90
9.60
10.65
11.35
12.40
B
C
A
B
C
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Header (Mated height: 0.6 mm)
A
B±0.1
0.35±0.05
0.12±0.03
Terminal coplanarity
0.46
1.12
0.62 (Suction face)
CAD Data
0.08
(Post and soldering terminals)
Dimension table (mm)
1.50
Soldering terminals
2.85
0.70
2.10
10
12
16
20
24
30
34
40
44
50
54
60
3.55
3.90
4.60
5.30
6.00
7.05
7.75
8.80
9.50
10.55
11.25
12.30
1.40
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
2.80
3.15
3.85
4.55
5.25
6.30
7.00
8.05
8.75
9.80
10.50
11.55
A
General tolerance: ±0.2
Information
0.76
0.12±0.03
C±0.1
(0.37)
Soldering terminals
Number of pins/
dimension
6
Active optical connector
0.40 (Suction face)
CAD Data
High current connectors
CAD Data
FPC/FFC connectors
The CAD data of the products with a
MID
DIMENSIONS (Unit: mm)
–23–
ACCTB66E 201602-T
Narrow pitch connectors S35 (0.35mm pitch)
CAD Data
0.50 (Suction face)
A
B±0.1
0.35±0.05
0.12±0.03
Terminal coplanarity
0.79
0.08
(Contact and soldering terminals)
X
1.64
Narrow pitch connectors
Socket (Mated height: 0.8 mm)
High current connectors
X
(0.80)
Dimension table (mm)
0.46
1.70
Y (Note 1)
Z (Note 1)
0.24±0.03
C±0.1
Number of pins/
dimension
12
4.45
1.75
3.85
24
34
44
6.55
8.30
10.05
3.85
5.60
7.35
5.95
7.70
9.45
B
C
A
B
C
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Header (Mated height: 0.8 mm)
0.62 (Suction face)
CAD Data
Terminal coplanarity
A
B±0.1
0.35±0.05
0.12±0.03
0.65
0.08
(Post and soldering terminals)
X
1.12
Active optical connector
FPC/FFC connectors
General tolerance: ±0.2
X
Soldering terminals
MID
0.12
C±0.1
1.50
Soldering terminals
(0.36)
0.78
Dimension table (mm)
Number of pins/
dimension
12
3.75
1.75
3.15
24
34
44
5.85
7.60
9.35
3.85
5.60
7.35
5.25
7.00
8.75
A
General tolerance: ±0.2
Socket
Header
0.80±0.1
Header
0.60±0.1
Information
Socket and Header are mated
Socket
–24–
ACCTB66E 201602-T
Narrow pitch connectors S35 (0.35mm pitch)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(C±1)
Label
Top cover tape
380 dia.
(4.0)
Leading direction after packaging
(A +0.3
−0.1 )
(B)
1.75
(2.0)
Embossed carrier tape
Embossed mounting-hole
4.0
Taping reel
.1
+0 0
5
1.
a.
di
High current connectors
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Socket: 0.6mm and 0.8mm
Header: 0.6mm and 0.8mm
Number of pins
Max. 30
34 to 60
Max. 34
40 to 60
Type of taping
Tape I
Tape I
Tape I
Tape I
A
16.0
24.0
16.0
24.0
B
7.5
11.5
7.5
11.5
C
17.4
25.4
17.4
25.4
Quantity per reel
15,000
15,000
15,000
15,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for S35
Direction
of tape progress
Socket
Header
Information
MID
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Active optical connector
Type/Mated height
FPC/FFC connectors
• Dimension table (Unit: mm)
–25–
ACCTB66E 201602-T
Narrow pitch connectors S35 (0.35mm pitch)
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
• Socket (Mated height: 0.6 mm and 0.8 mm)
Recommended PC board pattern (TOP VIEW)
0.35±0.03
1.80±0.03
0.70±0.03
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.85±0.01
0.28±0.01
1.35±0.01
0.70±0.01
1.80±0.01
(0.31)
0.18±0.01
(0.40)
1.80±0.01
1.00±0.01
2.00±0.01
1.38±0.01
(0.31)
0.18±0.01
1.18±0.01
0.35±0.01
0.35±0.01
(0.40)
1.00±0.03
: Insulation area
0.28±0.03
: Insulation area
1.35±0.03
2.00±0.01
(0.40)
(0.40)
0.85±0.03
1.20±0.01
0.66±0.03
1.00±0.03
1.80±0.03
2.00±0.03
1.20±0.03
(0.40)
0.20±0.03
0.20±0.03
0.35±0.03
0.20±0.03
MID
Active optical connector
• Header (Mated height: 0.6 mm and 0.8 mm)
Recommended PC board pattern (TOP VIEW)
FPC/FFC connectors
High current connectors
Narrow pitch connectors
NOTES
Please refer to the latest product
specifications when designing your
product.
Information
Regarding cautions for use, please
refer to page 171.
–26–
ACCTB66E 201602-T
FEATURES
1. 0.6 mm Mated Height with 2.2 mm
width.
2. Proprietary Fine Fitting
Construction
Our proprietary design provides a
comfortable and “tact” feel while
providing a secure connection.
1.
2m
m
Socket
Top view
8m
m
Header
Soldering terminals
at each corner
Fine Fitting structure
RoHS compliant
2.2
High unmating force is maintained
while soldering terminals on socket
and header are held in place.
Soldering terminal
on header
Soldering terminalt
on socket
Socket
2.
Proprietary Fine Fitting
construction
5
0.3
mm
mm
)
0
6.0
mm
(20
pin
Header
Bottom view
Cross section showing mating
with soldering terminals
3. A slim 2.2 mm (width) design
provides space-saving benefits. The
actual footprint is reduced by 20%,
when compared to a 40 pin A4S.
4. “
” structure
provides a slim and low-profile design
resistant to various environmental
conditions.
5. Soldering terminals enhance
mounting strength.
Soldering terminals
at each corner
)
1.
8
0
5.3
m
m
mm
(20
pin
Fine Fitting structure
APPLICATIONS
Board-to-FPC connections in hand
held devices that require compact
design and enhanced functionality.
High current connectors
A35US
FPC/FFC connectors
Narrow Pitch Connectors
(0.35mm pitch)
Active optical connector
For board-to-FPC
Narrow pitch connectors
Narrow pitch connectors A35US (0.35mm pitch)
ORDERING INFORMATION
AXG
0
4
MID
7: Socket
8: Header
Number of pins (2 digits)
Mated height
<Socket>/<Header>
0: 0.6 mm
Information
Functions
4: Without positioning bosses / Fine fitting construction
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
–27–
ACCTB65E 201602-T
Narrow pitch connectors A35US (0.35mm pitch)
High current connectors
Narrow pitch connectors
PRODUCT TYPES
Mated height
Number of pins
0.6mm
10
12
16
20
24
30
34
40
44
50
60
Part number
Socket
AXG710047
AXG712047
AXG716047
AXG720047
AXG724047
AXG730047
AXG734047
AXG740047
AXG744047
AXG750047
AXG760047
Packing
Header
AXG810044
AXG812044
AXG816044
AXG820044
AXG824044
AXG830044
AXG834044
AXG840044
AXG844044
AXG850044
AXG860044
Inner carton (1-reel)
Outer carton
10,000 pieces
20,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
FPC/FFC connectors
1. Characteristics
Electrical
characteristics
Active optical connector
Mechanical
characteristics
Specifications
0.30A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 1.300N/pin contact × pin contacts (initial)
Min. 0.215N/pin contact × pin contacts
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.20N/pin contact
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
MID
Environmental
characteristics
Information
Item
Rated current
Rated voltage
Lifetime
characteristics
Unit weight
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Humidity resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Saltwater spray resistance
(header and socket mated)
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
H2S resistance
(header and socket mated)
48 hours, contact resistance max. 90mΩ
Insertion and removal life
30 times
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
60 pin contacts Socket: 0.02g Header: 0.01g
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating
–28–
ACCTB65E 201602-T
Narrow pitch connectors A35US (0.35mm pitch)
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Narrow pitch connectors
The CAD data of the products with a
Socket (Mated height: 0.6 mm)
Terminal coplanarity
A
B±0.1
0.35±0.05
0.12±0.03
0.59
0.08
(Contact and Metal bracket)
Dimension table (mm)
(0.68)
Z (Note)
0.30±0.03
C±0.1
0.66
2.20
Y (Note)
Number of pins/
dimension
10
A
B
C
4.25
1.40
3.45
12
16
20
24
30
34
40
44
50
60
4.60
5.30
6.00
6.70
7.75
8.45
9.50
10.20
11.25
13.00
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
10.15
3.80
4.50
5.20
5.90
6.95
7.65
8.70
9.40
10.45
12.20
B
C
FPC/FFC connectors
2.20
1.96
0.60 (Suction face)
CAD Data
High current connectors
DIMENSIONS (Unit: mm)
General tolerance: ±0.2
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 0.6 mm)
0.08
(Post and Metal bracket)
1.42
0.08±0.03
C±0.1
0.48
0.32
1.28
Soldering terminals
Soldering terminals
Dimension table (mm)
Number of pins/
dimension
10
3.55
1.40
3.17
12
16
20
24
30
34
40
44
50
60
3.90
4.60
5.30
6.00
7.05
7.75
8.80
9.50
10.55
12.30
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
10.15
3.52
4.22
4.92
5.62
6.67
7.37
8.42
9.12
10.17
11.92
A
MID
0.46
Active optical connector
Terminal coplanarity
A
B±0.1
0.35±0.05
0.12±0.03
1.80
0.80 (Suction face)
CAD Data
Information
General tolerance: ±0.2
Header
0.60±0.1
Socket and Header are mated
Socket
–29–
ACCTB65E 201602-T
Narrow pitch connectors A35US (0.35mm pitch)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(A +0.3
−0.1 )
(C±1)
Label
380 dia.
Top cover tape
(4.0)
Leading direction after packaging
(B)
(1.75)
Embossed carrier tape
(2.0)
Embossed mounting-hole
4.0
Taping reel
.1
+0 0
5
1.
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
a.
di
FPC/FFC connectors
• Dimension table (Unit: mm)
Type/Mated height
Number of pins
Max. 30
34 to 60
Max. 34
40 to 60
Socket
Header
Type of taping
Tape I
Tape I
Tape I
Tape I
A
16.0
24.0
16.0
24.0
C
17.4
25.4
17.4
25.4
Quantity per reel
10,000
10,000
10,000
10,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for A35US
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Information
MID
Active optical connector
B
7.5
11.5
7.5
11.5
–30–
ACCTB65E 201602-T
Narrow pitch connectors A35US (0.35mm pitch)
(0.39)
0.20±0.01
0.885±0.01
Regarding cautions for use, please
refer to page 171.
Information
MID
Please refer to the latest product
specifications when designing your
product.
FPC/FFC connectors
1.42±0.01
(0.39)
(0.39)
0.35±0.01
0.18±0.01
Active optical connector
0.60±0.01
1.325±0.01
1.48±0.01
15
0.
C
8×
0.35±0.01
0.18±0.01
0.70±0.01
Metal mask thickness: When 100μm
(Signal terminal opening ratio: 70%)
(Power terminal opening ratio: 77%)
(0.39)
1.82±0.01
2.60±0.01
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
2.50±0.01
1.80±0.01
(0.35)
Recommended metal mask pattern
High current connectors
: Insulation
area
0.26±0.03
1.045±0.03
: Insulation
area
(0.50)
0.90±0.03
1.20±0.03
2.20±0.03
0.35±0.03
0.20±0.03
2.20±0.01
0.60±0.03
1.325±0.03
1.48±0.03
15
0.
×C
0.35±0.03
0.20±0.03
0.70±0.03
Recommended PC board pattern (TOP VIEW)
(0.50)
0.20±0.03
1.60±0.03
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
2.50±0.03
1.04±0.03
(0.73)
• Socket (Mated height: 0.6 mm)
12
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Narrow pitch connectors
NOTES
–31–
ACCTB65E 201602-T
Narrow pitch connectors A35S (0.35mm pitch)
A35S
Narrow pitch connectors
(0.35mm pitch)
FEATURES
1. Small size (Terminal pitch: 0.35 mm,
width: 2.5 mm and Mated height: 0.8
mm)
When mated, the footprint is reduced by
approx. 10% from A4S (60 pin contacts),
contributing to the functionality
enhancement and size reduction of end
equipment.
2. “
” ensures
high resistance to various
environments in lieu of its spacesaving footprint.
Ni barrier
construction
Bellows contact
construction
(Against solder rise!)
(Against dropping!)
m
Socket
0m
2.
m
5m
2.
High current connectors
Narrow pitch connectors
For board-to-FPC
Header
Suction face: 0.7mm
Porosity treatment
(Against corrosive gases!)
s) n
pin 0 pi
(60 m (6
m
m 0m
.85 .5
12 S 14
4
A
2.
FPC/FFC connectors
RoHS compliant
s)
Socket
V notch and Double contact constructions
5m
(Against foreign particles and flux!)
m
Soldering terminals
at each corner
s) s)
pin pin
(60 (60
mm mm
.15 .8
12 S 13
4
A
0m
2.
Active optical connector
Suction face: 0.7mm
Header
m
Soldering terminals
at each corner
3. Low-profile connector with up to
100 pin contacts.
4. Soldering terminals at each corner
enhance mounting strength.
5. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
6. Connectors for inspection available.
APPLICATIONS
Board-to-FPC connections in mobile
equipment that requires size and
thickness reduction and functionality
enhancement.
MID
ORDERING INFORMATION
AXE
1
2
7: Narrow Pitch Connector A35S (0.35 mm pitch) Socket
8: Narrow Pitch Connector A35S (0.35 mm pitch) Header
Number of pins (2 digits)
Information
Mated height
<Socket> / <Header>
1: For mated height 0.8 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
–32–
ACCTB2E 201602-T
Narrow pitch connectors A35S (0.35mm pitch)
Packing
Header
AXE810124
AXE812124
AXE816124
AXE820124
AXE824124
AXE830124
AXE834124
AXE840124
AXE844124
AXE850124
AXE854124
AXE860124
AXE864124
AXE870124
AXE880124
AXE800124
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.25A/pin contact (Max. 4 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 100mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.165N/pin contact × pin contacts
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.20N/pin contact
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
High current connectors
0.8mm
10
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
Part number
Socket
AXE710127
AXE712127
AXE716127
AXE720127
AXE724127
AXE730127
AXE734127
AXE740127
AXE744127
AXE750127
AXE754127
AXE760127
AXE764127
AXE770127
AXE780127
AXE700127
FPC/FFC connectors
Number of pins
Active optical connector
Mated height
Narrow pitch connectors
PRODUCT TYPES
Soldering iron
No icing or condensation.
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 100mΩ
Insertion and removal life
30 times
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
60 pin contacts Socket: 0.03 g Header: 0.02 g
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
–33–
ACCTB2E 201602-T
Information
Environmental
characteristics
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
MID
Conformed to MIL-STD-202F, method 107G
Narrow pitch connectors A35S (0.35mm pitch)
The CAD data of the products with a
CAD Data
CAD Data
Terminal coplanarity
A
0.77
B±0.1
0.35±0.05
0.08
(Contact and soldering terminals)
High current connectors
2.50
2.20
0.12±0.03
(0.90)
2.50
Y note
1.06
Z note
0.30±0.03
C±0.1
General tolerance: ±0.2
Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected.
Dimension table (mm)
Number of pins/
dimension
10
4.10
1.40
3.00
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
4.45
5.15
5.85
6.55
7.60
8.30
9.35
10.05
11.10
11.80
12.85
13.55
14.60
16.35
19.85
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
10.85
11.90
13.65
17.15
3.35
4.05
4.75
5.45
6.50
7.20
8.25
8.95
10.00
10.70
11.75
12.45
13.50
15.25
18.75
A
B
C
Header (Mated height: 0.8 mm)
0.70 (Suction face)
CAD Data
Terminal coplanarity
0.65
A
0.08
B±0.1
(Post and soldering terminals)
0.35±0.05
0.12±0.03
2.00
Dimension table (mm)
0.84
0.12±0.03
(0.31)
MID
1.46
Soldering terminals
Soldering terminals
1.42
Active optical connector
FPC/FFC connectors
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.8 mm)
0.70 (Suction face)
Narrow pitch connectors
DIMENSIONS (Unit: mm)
C±0.1
General tolerance: ±0.2
Number of pins/
dimension
10
A
B
C
3.40
1.40
2.80
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
3.75
4.45
5.15
5.85
6.90
7.60
8.65
9.35
10.40
11.10
12.15
12.85
13.90
15.65
19.15
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
10.85
11.90
13.65
17.15
3.15
3.85
4.55
5.25
6.30
7.00
8.05
8.75
9.80
10.50
11.55
12.25
13.30
15.05
18.55
Header
0.80±0.1
Information
• Socket and Header are mated
Socket
–34–
ACCTB2E 201602-T
Narrow pitch connectors A35S (0.35mm pitch)
(D±1)
Label
Top cover tape
Embossed mounting-hole
8.0
8.0
Taping reel
1.
1.
5 +0
5 +0
0 .1
0 .1
di
di
a.
a.
• Dimension table (Unit: mm)
Type/Mated height
Common for sockets and headers
Number of pins
10 to 24
30 to 80
100
Type of taping
Tape I
Tape I
Tape II
A
16.0
24.0
32.0
B
—
—
28.4
C
7.5
11.5
14.2
D
17.4
25.4
33.4
Quantity per reel
5,000
5,000
5,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for A35S
Direction
of tape progress
Socket
Header
Information
MID
Note: There is no indication on this product regarding top-bottom or left-right orientation.
High current connectors
Embossed carrier tape
(2.0)
(4.0)
(C)
(1.75)
(2.0)
Leading direction after packaging
(C)
(1.75)
FPC/FFC connectors
(A±0.3)
(B)
380 dia.
Tape II
(A +0.3
−0.1 )
(4.0)
Tape I
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Active optical connector
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
–35–
ACCTB2E 201602-T
Narrow pitch connectors A35S (0.35mm pitch)
FPC/FFC connectors
Header
m
Socket
0m
2.
m
5m
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted.
Please avoid using for applications other
than inspection.
RoHS compliant
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
A35S
for inspection
10
✩
12
✩
16
✩
20
✩
24
✩
30
✩
34
✩
Number of pins
40
44
✩
✩
50
✩
54
✩
60
✩
64
✩
70
✩
80
✩
100
✩
Notes: 1. Please inquire about number of pins other than those shown above.
2. Please inquire with us regarding availability.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
4. Please inquire if further information is needed.
PRODUCT TYPES
Socket
Specifications
Without positioning bosses
Part No.
AXE7E∗∗26
Header
Specifications
Without positioning bosses
Part No.
AXE8E∗∗26
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
Information
MID
Active optical connector
A35S
Connectors for
inspection usage
(0.35mm pitch)
2.
High current connectors
Narrow pitch connectors
For board-to-FPC
–36–
ACCTB2E 201602-T
Narrow pitch connectors A35S (0.35mm pitch)
C
30
0.
0.90±0.01
1.35±0.01
Please refer to the latest product
specifications when designing your
product.
Information
MID
Active optical connector
Regarding cautions for use, please
refer to page 171.
0.45±0.01
0.70±0.01
High current connectors
0.35±0.01
0.18±0.01
(0.50)
1.30±0.01
2.30±0.01
0.60±0.01
(0.53)
0.18±0.01
1.66±0.01
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
(0.39)
2.02±0.01
2.80±0.01
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 70%)
2.90±0.01
1.60±0.01
(0.65)
Recommended metal mask pattern
0.35±0.01
2.40±0.03
(0.65)
0.70±0.03
: Insulation
area
FPC/FFC connectors
1.35±0.03
0.45±0.03
30
0.
0.90±0.03
1.10±0.03
0.60±0.03
0.35±0.03
0.20±0.03
(0.53)
1.66±0.03
1.90±0.03
(0.50)
0.35±0.03
0.20±0.03
0.20±0.03
Recommended PC board pattern (TOP VIEW)
1.06±0.03
(0.92)
• Header (Mated height: 0.8 mm)
Recommended PC board pattern (TOP VIEW)
2.90±0.03
• Socket (Mated height: 0.8 mm)
C
Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Narrow pitch connectors
NOTES
–37–
ACCTB2E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
P35S
Narrow pitch connectors
(0.35mm pitch)
FEATURES
1. Small size 0.35 mm pitch
contributes to device miniaturization.
Smaller compared to P4S (40 pins):
Socket — 11% smaller,
Header — 12% smaller
3. Greater flexibility in connector
placement.
Pattern wiring to the connector bottom is
made possible with a molded covering on
the undersurface of the connector.
Soldering terminals
at each corner
<Socket>
<Header>
Socket
m
m
Socket
35
2.
m
6m
3.
High current connectors
Narrow pitch connectors
For board-to-board For board-to-FPC
Header
9.55 (40 pins)
Active optical connector
FPC/FFC connectors
3.60
Soldering terminals
at each corner
RoHS compliant
Header
Soldering
terminals
at each
corner
Insulation
Insulation
area
area
Connector bottom:
Create any thru-hole
and pattern wiring.
Soldering
terminals
at each
corner
4. Connectors for inspection available
8.73 (40 pins)
2.35
APPLICATIONS
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
ORDERING INFORMATION
AXT
1
2
4
1: Narrow Pitch Connector P35S (0.35 mm pitch) Socket
2: Narrow Pitch Connector P35S (0.35 mm pitch) Header
Information
MID
Number of pins (2 digits)
Mated height
<Socket>/<Header>
1: For mated height 1.5 mm
Functions
<Socket>/<Header>
2: No pickup cover, without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
4: Ni plating on base, Au plating on surface
–38–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
Mated height
Number of pins
1.5mm
40
50
60
70
80
100
Part number
Socket
AXT140124
AXT150124
AXT160124
AXT170124
AXT180124
AXT100124
Packing
Header
AXT240124
AXT250124
AXT260124
AXT270124
AXT280124
AXT200124
Inner carton (1-reel)
Outer carton
3,000 pieces
6,000 pieces
Narrow pitch connectors
PRODUCT TYPES
1. Characteristics
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 100mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.0588N/pin contact × pin contacts
Soldering heat resistance
Storage temperature
Conditions
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.981N/pin contact
–55°C to +85°C
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. or 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Lifetime
characteristics
Unit weight
Thermal shock resistance
(header and socket mated)
5 cycles, insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 100mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Temperature 40°C±2°C, humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Temperature 35°C±2°C, saltwater concentration 5%±1%
Temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of
max. 200 times/hours
Active optical connector
Mechanical
characteristics
Specifications
0.25A/pin contact (Max. 4 A at total pin contacts)
60V AC/DC
MID
Electrical
characteristics
Item
Rated current
Rated voltage
FPC/FFC connectors
SPECIFICATIONS
High current connectors
Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
50 pin contacts Socket: 0.06 g Header: 0.03 g
2. Material and surface treatment
Contact and Post
Material
LCP resin (UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals portion;
Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal)
Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal)
–39–
ACCTB87E 201602-T
Information
Part name
Molded portion
Narrow pitch connectors P35S (0.35mm pitch)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
1. Socket (Mated height: 1.5mm)
CAD Data
A
Terminal coplanarity
0.08
(Contact and
soldering terminals)
1.45
0.70 (Suction face)
0.35±0.05
(0.50)
2.60
3.00
0.12±0.03
(0.66)
Y (Note)
3.60
1.80
FPC/FFC connectors
Dimension table (mm)
0.55
0.30±0.03
C±0.1
(0.90)
Z (Note)
General tolerance: ±0.2
Number of pins/
dimension
40
9.55
6.65
8.35
50
60
70
80
100
11.30
13.05
14.80
16.55
20.05
8.40
10.15
11.90
13.65
17.15
10.10
11.85
13.60
15.35
18.85
B
C
A
B
C
2. Header (Mated height: 1.5mm)
CAD Data
A
B±0.1
0.54 (Suction face)
20
0.35±0.05
2.35
(0.45)
0.
25
2.35
R
0.
0.12±0.03
R
MID
R
Terminal coplanarity
0.08
(Contact and
soldering terminals)
1.24
1.45
Active optical connector
3.60
B±0.1
High current connectors
Narrow pitch connectors
DIMENSIONS (Unit: mm)
0.
1.49
0.12±0.03
0.84
(0.33)
Information
Soldering terminals
Soldering terminals
20
C±0.1
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension
40
8.73
6.65
8.05
50
60
70
80
10.48
12.23
13.98
15.73
8.40
10.15
11.90
13.65
9.80
11.55
13.30
15.05
100
19.23
17.15
18.55
A
Socket and Header are mated
Header
1.50±0.15
Socket
–40–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
C
1.75
2
8.0
1.
5
Top cover tape
1.75
4
Pull out direction
Pull out direction
4
Label
380 dia.
C
Taping reel
D±1
A±0.3
B
A±0.3
2
Embossed carrier tape
Embossed mounting-hole
8.0
1.
5
+0
0 .1
+0
0 .1
di
di
a.
a.
High current connectors
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for socket and header:
1.5mm
40 to 70
72 to 100
Tape I
Tape II
24.0
32.0
—
28.4
11.5
14.2
25.4
33.4
3,000
3,000
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P35S
Direction of
tape progress
Header
Information
MID
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Active optical connector
Socket
FPC/FFC connectors
Dimension table (mm)
–41–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
m
FPC/FFC connectors
m
Socket
35
2.
m
6m
Header
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted.
Please avoid using for applications other
than inspection.
RoHS compliant
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
P35S
for inspection
Number of pins
50
✩
40
✩
60
✩
70
✩
80
✩
100
✩
Notes: 1. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.)
2. Please inquire number of pins other than those shown above.
3. Please inquire us regarding availability.
4. Please keep the minimum order quantities no less than 50 pieces per lot.
5. Please inquire if further information is needed.
PRODUCT TYPES
Specifications
Socket
Part No.
AXT1E∗∗26
Specifications
Header
Part No.
AXT2E∗∗26
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
Information
MID
Active optical connector
P35S
Connectors for
inspection usage
(0.35mm pitch)
3.
High current connectors
Narrow pitch connectors
For board-to-board For board-to-FPC
–42–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
Header (Mated height: 1.5mm)
Max. 0.03 mm
Max. 0.03 mm
0.35±0.03
0.20±0.03
0.45±0.03
0.70±0.03
: Insulation area
0.70±0.01
0.85±0.01
3. If extra resistance to shock caused
by dropping is required, we
recommend using P4.
4. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.35±0.01
0.18±0.01
(0.50)
1.75±0.01
2.75±0.01
0.35±0.01
0.18±0.01
1.65±0.01
0.65±0.01
(0.50)
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
(0.53)
2.94±0.01
4.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
4.20±0.01
1.80±0.01
(1.20)
Recommended metal mask pattern
0.45±0.01
0.70±0.01
Regarding cautions for use, please
refer to page 171.
Information
MID
Active optical connector
Please refer to the latest product
specifications when designing your
product.
High current connectors
0.70±0.03
0.85±0.03
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector
Max. 0.90
(0.75)
1.45±0.03
2.95±0.03
1.65±0.03
0.65±0.03
(0.50)
0.35±0.03
0.20±0.03
Recommended PC board pattern
(TOP VIEW)
(0.80)
2.60±0.03
4.20±0.03
Recommended PC board pattern
(TOP VIEW)
FPC/FFC connectors
Socket (Mated height: 1.5mm)
1.80±0.03
(1.20)
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
Narrow pitch connectors
NOTES
–43–
ACCTB87E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
Narrow pitch connectors
(0.4mm pitch)
A4US
FEATURES
1. Slim body width of 2.0/2.2 mm
contributes to space-saving.
Soldering terminals
at each corner
Suction face
2. “
” ensures
high resistance to various
environments in lieu of its spacesaving footprint.
Ni barrier
construction
Bellows contact
construction
(Against solder rise!)
(Against dropping!)
s)
m
m
8m
0m
Socket
1.
2.
High current connectors
Narrow pitch connectors
For board-to-FPC
in
0p
Header
2.
.5
12
0/
2.
mm
(5
Porosity treatment
Socket
2m
(Against corrosive gases!)
m
RoHS compliant
FPC/FFC connectors
Soldering terminals
at each corner
Suction face
V notch and Double contact constructions
(Against foreign particles and flux!)
)
m
(50
s
pin
m
1.8
1
1.
Header
8m
m
Active optical connector
Unit: mm
Mated height
0.6
0.8
✩
–
–
✩
0.6
0.6
0.7
0.7
Width (socket)
2.2
2.0
Socket
Header
Suction
face
3. Soldering terminals at each corner
enhance mounting strength.
4. For 0.6 mm mated height, thanks to
our proprietary “Fine fitting structure”,
high removability with a nice click feel
is maintained while being low profile.
5. Connectors for inspection available
APPLICATIONS
Board-to-FPC connections in mobile
equipment that requires size and
thickness reduction and functionality
enhancement.
ORDERING INFORMATION
MID
■ Mated height: 0.6 mm
AXE
0
4
D
1: Socket
2: Header
Number of pins (2 digits)
Information
Mated height
<Socket>/<Header>
0: 0.6 mm
Functions
4: Without positioning bosses / Fine fitting construction
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
Package
D: Embossed packaging (4 mm pitch)
(Inner carton (1-reel): 10,000 pieces, Outer carton: 2-reel)
–44–
ACCTB85E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
AXE
2
Narrow pitch connectors
■ Mated height: 0.8 mm
D
1: Socket
2: Header
Number of pins (2 digits)
High current connectors
Mated height
<Socket>
5: 0.8 mm mated height
<Header>
1: 0.8 mm mated height
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
Mated height
0.6mm
0.8mm
Number of pins
16
30
40
50
10
14
18
20
24
30
34
36
40
50
60
70
80
Part number
Socket
AXE116047D
AXE130047D
AXE140047D
AXE150047D
AXE110527D
AXE114527D
AXE118527D
AXE120527D
AXE124527D
AXE130527D
AXE134527D
AXE136527D
AXE140527D
AXE150527D
AXE160527D
AXE170527D
AXE180527D
Packing
Header
AXE216044D
AXE230044D
AXE240044D
AXE250044D
AXE210124D
AXE214124D
AXE218124D
AXE220124D
AXE224124D
AXE230124D
AXE234124D
AXE236124D
AXE240124D
AXE250124D
AXE260124D
AXE270124D
AXE280124D
Inner carton (1-reel)
Outer carton
10,000 pieces
20,000 pieces
Information
MID
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
Active optical connector
PRODUCT TYPES
FPC/FFC connectors
Package
D: Embossed packaging (4 mm pitch)
–45–
ACCTB85E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
High current connectors
Narrow pitch connectors
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.30A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 90mΩ
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Composite insertion force
Max. 0.981N/pin contacts × pin contacts (initial)
Composite removal force
h = 0.6mm: Min. 0.215N/pin contact × pin contacts
h = 0.8mm: Min. 0.165N/pin contact × pin contacts
Contact holding force
(Socket contact)
Ambient temperature
Soldering heat resistance
Storage temperature
Conditions
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.20N/pin contact
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
FPC/FFC connectors
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Active optical connector
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Lifetime
characteristics
Insertion and removal life
Unit weight
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
24 hours, insulation resistance min. 100MΩ,
Bath temperature 35°C±2°C,
contact resistance max. 90mΩ
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
48 hours, contact resistance max. 90mΩ
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
30 times
hours
50 pin contacts Socket (h = 0.6mm: 0.02g, h = 0.8mm: 0.03g)
Header (h = 0.6mm: 0.01g, h = 0.8mm: 0.01g)
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Information
MID
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
–46–
ACCTB85E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
Narrow pitch connectors
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.6 mm)
0.60 (Suction face)
CAD Data
Terminal coplanarity
A
B±0.1
0.40±0.05
0.15±0.03
0.59
0.08
(0.35)
1.50
1.96
2.20
(Contact and
soldering terminals)
(0.68)
Dimension table (mm)
2.20
Y (Note)
0.66
Z (Note)
0.30±0.03
C±0.1
General tolerance: ±0.2
Number of pins/
dimension
16
A
B
C
5.70
2.80
4.90
30
40
50
8.50
10.50
12.50
5.60
7.60
9.60
7.70
9.70
11.70
B
C
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 0.6 mm)
Terminal coplanarity
0.46
Active optical connector
0.08
(Post and
soldering terminals)
0.08±0.03
C±0.1
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension
16
5.00
2.80
4.62
30
40
50
7.80
9.80
11.80
5.60
7.60
9.60
7.42
9.42
11.42
A
Information
Soldering terminals
0.48
0.32
1.28
Soldering terminals
(0.40)
1.00
1.80
A
B±0.1
0.40±0.05
0.15±0.03
1.42
0.80 (Suction face)
CAD Data
High current connectors
CAD Data
FPC/FFC connectors
The CAD data of the products with a
MID
DIMENSIONS (Unit: mm)
–47–
ACCTB85E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
0.60 (Suction face)
CAD Data
0.77
0.08
(Contact and
soldering terminals)
Dimension table (mm)
(0.80)
0.30±0.03
C±0.1
1.24
2.00
Y (Note)
Z (Note)
General tolerance: ±0.2
Number of pins/
dimension
10
4.50
1.60
3.60
14
18
20
24
30
34
36
40
50
60
70
80
5.30
6.10
6.50
7.30
8.50
9.30
9.70
10.50
12.50
14.50
16.50
18.50
2.40
3.20
3.60
4.40
5.60
6.40
6.80
7.60
9.60
11.60
13.60
15.60
4.40
5.20
5.60
6.40
7.60
8.40
8.80
9.60
11.60
13.60
15.60
17.60
B
C
A
B
C
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 0.8 mm)
A
B±0.1
0.40±0.05
0.15±0.03
Terminal coplanarity
0.65
0.08
(Post and
soldering terminals)
1.28
0.70 (Suction face)
CAD Data
Active optical connector
FPC/FFC connectors
Terminal coplanarity
A
B±0.1
0.40±0.05
0.15±0.03
1.90
High current connectors
Narrow pitch connectors
Socket (Mated height: 0.8 mm)
Dimension table (mm)
MID
0.15±0.03
C±0.1
(0.54)
(0.72)
1.80
Soldering terminals
Soldering terminals
General tolerance: ±0.2
Number of pins/
dimension
10
3.80
1.60
3.20
14
18
20
24
30
34
36
40
50
60
70
80
4.60
5.40
5.80
6.60
7.80
8.60
9.00
9.80
11.80
13.80
15.80
17.80
2.40
3.20
3.60
4.40
5.60
6.40
6.80
7.60
9.60
11.60
13.60
15.60
4.00
4.80
5.20
6.00
7.20
8.00
8.40
9.20
11.20
13.20
15.20
17.20
A
Socket
Header
0.80±0.1
Information
Header
0.60±0.1
Socket and Header are mated
Socket
–48–
ACCTB85E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
Tape I
Tape II
(A +0.3
−0.1 )
(A±0.3)
(B)
(D±1)
Label
(C)
(1.75)
1.
5
380 dia.
(4.0)
(2.0)
Embossed carrier tape
Embossed mounting-hole
Taping reel
4.0
(4.0)
(2.0)
Top cover tape
4.0
Leading direction after packaging
(C)
(1.75)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
1.
5
+0
0 .1
di
+0
0 .1
di
a.
a.
High current connectors
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for sockets and headers:
0.6mm
Max. 24
30 to 50
Tape I
Tape I
16.0
24.0
—
—
7.5
11.5
17.4
25.4
10,000
10,000
Common for sockets and headers:
0.8mm
Max. 24
30 to 60
70, 80
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
10,000
10,000
10,000
• Connector orientation with respect to embossed tape feeding direction
Type
FPC/FFC connectors
• Dimension table (Unit: mm)
Common for A4US (Mated height: 0.6/0.8 mm)
Socket
Header
Information
MID
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Active optical connector
Direction
of tape progress
–49–
ACCTB85E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
m
FPC/FFC connectors
Header
8m
m
Socket
1.
0m
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted.
Please avoid using for applications other
than inspection.
RoHS compliant
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
A4US for inspection
Mated height: 0.8mm
10
✩
14
✩
18
✩
20
✩
24
✩
30
✩
Number of pins
34
36
✩
✩
40
✩
50
✩
60
✩
70
✩
80
✩
Notes: 1. Please inquire about number of pins other than those shown above.
2. Please inquire with us regarding availability.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
4. Please inquire if further information is needed.
PRODUCT TYPES
Specifications
Socket
Part No.
AXE1E∗∗16D
Specifications
Header
Part No.
AXE2E∗∗16D
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
Information
MID
Active optical connector
A4US
Connectors for
inspection usage
(0.4mm pitch)
2.
High current connectors
Narrow pitch connectors
For board-to-FPC
–50–
ACCTB85E 201602-T
Narrow pitch connectors A4US (0.4mm pitch)
: Insulation area
: Insulation area
0.60±0.01
1.35±0.01
(0.40)
1.40±0.01
0.40±0.01
0.20±0.01
(0.39)
1.48±0.01
0.26±0.01
1.07±0.01
30
0.
C
Active optical connector
2.20±0.03
0.90±0.03
0.23±0.03
(0.65)
0.40±0.03
(0.85)
2.20±0.03
0.50±0.03
0.20±0.03
1.50±0.03
0.40±0.03
0.23±0.03
(0.45)
(0.68)
Recommended PC board pattern (TOP VIEW)
1.04±0.03
• Header (Mated height: 0.8 mm)
Recommended PC board pattern (TOP VIEW)
2.40±0.01
• 0.8 mm Socket
0.80±0.03
0.28±0.03
: Insulation area
MID
2.07±0.01
0.20±0.01
(0.52)
0.40±0.01
(0.76)
2.07±0.01
0.20±0.01
0.55±0.01
0.40±0.01
(0.36)
1.58±0.01
2.30±0.01
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 73%)
(0.68)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
1.03±0.01
0.80±0.03
Recommended metal mask pattern
1.04±0.01
2.40±0.01
1.45±0.03
30
0.
C
0.80±0.01
1.45±0.01
0.23±0.01
0.80±0.01
Regarding cautions for use, please
refer to page 171.
For other details, please verify with the
product specification sheets.
–51–
ACCTB85E 201602-T
Information
15
0.
C
2.60±0.01
8×
0.40±0.01
0.20±0.01
0.70±0.01
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
(0.40)
1.80±0.01
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
2.50±0.01
1.80±0.01
(0.35)
Recommended metal mask pattern
High current connectors
0.26±0.03
1.07±0.03
FPC/FFC connectors
0.60±0.03
1.35±0.03
2.20±0.01
0.40±0.03
0.23±0.03
1.48±0.03
0.70±0.03
(0.39)
15
0.
×C
0.40±0.03
0.23±0.03
(0.50)
0.90±0.03
1.20±0.03
2.20±0.03
Recommended PC board pattern (TOP VIEW)
(0.50)
0.20±0.03
1.60±0.03
2.60±0.03
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
2.50±0.03
1.04±0.03
(0.73)
• 0.6 mm Socket
12
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
3. See the common “NOTES FOR
USE” on the next page for other points
to be noted.
Narrow pitch connectors
NOTES
Narrow pitch connectors A4S (0.4mm pitch)
A4S
Narrow pitch connectors
(0.4mm pitch)
FEATURES
m
m
Socket
0m
2.
5m
2.
High current connectors
Narrow pitch connectors
For board-to-FPC
1. Width 2.5 mm slim two-piece type
connector
Compact and slim structure contributes
overall miniaturization of product design.
<Compared to F4S (40 pins, when
mated)>
• Width: 30% down
• Footprint: 30% down
Header
2. “
” ensures
high resistance to various
environments in lieu of slim and low
profile body
Ni barrier
construction
Bellows contact
construction
(Against solder rise!)
(Against dropping!)
F4S
1.0
A4S
Porosity treatment
0.8
(Against corrosive gases!)
RoHS compliant
2.5
Active optical connector
FPC/FFC connectors
3.6
V notch and Double contact constructions
(Against foreign particles and flux!)
3. Mated heights of 0.8 and 1.0 mm are
available for the same foot pattern.
4. Connectors for inspection available
APPLICATIONS
Board-to-FPC connections of mobile
equipment (cellular phones, smart
phones, laptops, and portable music
players, etc.)
ORDERING INFORMATION
AXE
2
MID
5: Narrow Pitch Connector A4S (0.4 mm pitch) Socket
6: Narrow Pitch Connector A4S (0.4 mm pitch) Header
Number of pins (2 digits)
Information
Mated height
<Socket>
1: For mated height 0.8/1.0 mm
<Header>
1: For mated height 0.8 mm
2: For mated height 1.0 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
4: Ni plating on base, Au plating on surface
Package
Nil: Embossed packaging (8 mm pitch)
D: Embossed packaging (4 mm pitch)
–52–
ACCTB7E 201602-T
Narrow pitch connectors A4S (0.4mm pitch)
■ 8 mm pitch embossed packaging
1.0mm
Packing
Header
AXE610124
AXE612124
AXE614124
AXE616124
AXE618124
AXE620124
AXE622124
AXE624124
AXE626124
AXE628124
AXE630124
AXE632124
AXE634124
AXE636124
AXE640124
AXE644124
AXE650124
AXE654124
AXE660124
AXE664124
AXE670124
AXE680124
AXE610224
AXE612224
AXE614224
AXE620224
AXE624224
AXE626224
AXE630224
AXE632224
AXE640224
AXE644224
AXE650224
AXE654224
AXE660224
AXE670224
AXE680224
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
High current connectors
10
12
14
16
18
20
22
24
26
28
30
32
34
36
40
44
50
54
60
64
70
80
10
12
14
20
24
26
30
32
40
44
50
54
60
70
80
Part number
Socket
AXE510127
AXE512127
AXE514127
AXE516127
AXE518127
AXE520127
AXE522127
AXE524127
AXE526127
AXE528127
AXE530127
AXE532127
AXE534127
AXE536127
AXE540127
AXE544127
AXE550127
AXE554127
AXE560127
AXE564127
AXE570127
AXE580127
AXE510127
AXE512127
AXE514127
AXE520127
AXE524127
AXE526127
AXE530127
AXE532127
AXE540127
AXE544127
AXE550127
AXE554127
AXE560127
AXE570127
AXE580127
FPC/FFC connectors
0.8mm
Number of pins
Active optical connector
Mated height
Narrow pitch connectors
PRODUCT TYPES
MID
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
■ 4 mm pitch embossed packaging
0.8mm
Number of pins
Part number
Packing
10
Socket
AXE510127D
Header
AXE610124D
12
14
16
20
24
30
34
40
44
50
60
64
AXE512127D
AXE514127D
AXE516127D
AXE520127D
AXE524127D
AXE530127D
AXE534127D
AXE540127D
AXE544127D
AXE550127D
AXE560127D
AXE564127D
AXE612124D
AXE614124D
AXE616124D
AXE620124D
AXE624124D
AXE630124D
AXE634124D
AXE640124D
AXE644124D
AXE650124D
AXE660124D
AXE664124D
Inner carton (1-reel)
Outer carton
15,000 pieces
30,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
–53–
ACCTB7E 201602-T
Information
Mated height
Narrow pitch connectors A4S (0.4mm pitch)
High current connectors
Narrow pitch connectors
SPECIFICATIONS
Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 1.200N/pin contact × pin contacts (initial)
Min. 0.165N/pin contact × pin contacts
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.20N/pin contact
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
FPC/FFC connectors
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Active optical connector
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Insertion and removal life
30 times
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
20 pin contacts Socket: 0.02 g Header: 0.01 g
Material and surface treatment
Part name
Molded
portion
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)
Information
MID
Contact and
Post
Material
LCP resin
(UL94V-0)
–54–
ACCTB7E 201602-T
Narrow pitch connectors A4S (0.4mm pitch)
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Dimension table (mm)
Terminal coplanarity
A
B±0.1
0.40±0.05
0.15±0.03
0.77
0.08
2.50
(Contact and
soldering terminals)
2.20
CAD Data
0.70 (Suction face)
Socket (Mated height: 0.8 mm/1.0 mm)
(0.90)
Z note
0.30±0.03
C±0.1
1.06
2.50
Y note
General tolerance: ±0.2
Note: Since the soldering terminals has a single-piece construction,
sections Y and Z are electrically connected.
Number of pins/
dimension
10
4.50
1.60
3.40
12
14
16
18
20
22
24
26
28
30
32
34
36
40
44
50
54
60
64
70
80
4.90
5.30
5.70
6.10
6.50
6.90
7.30
7.70
8.10
8.50
8.90
9.30
9.70
10.50
11.30
12.50
13.30
14.50
15.30
16.50
18.50
2.00
2.40
2.80
3.20
3.60
4.00
4.40
4.80
5.20
5.60
6.00
6.40
6.80
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
3.80
4.20
4.60
5.00
5.40
5.80
6.20
6.60
7.00
7.40
7.80
8.20
8.60
9.40
10.20
11.40
12.20
13.40
14.20
15.40
17.40
B
C
A
B
C
Narrow pitch connectors
CAD Data
High current connectors
The CAD data of the products with a
FPC/FFC connectors
DIMENSIONS (Unit: mm)
2.00
(Post and
soldering terminals)
0.84
1.46
Soldering terminals
(0.31)
Soldering terminals
0.15±0.03
C±0.1
0.08
General tolerance: ±0.2
–55–
Number of pins/
dimension
10
3.80
1.60
3.20
12
14
16
18
20
22
24
26
28
30
32
34
36
40
44
50
54
60
64
70
80
4.20
4.60
5.00
5.40
5.80
6.20
6.60
7.00
7.40
7.80
8.20
8.60
9.00
9.80
10.60
11.80
12.60
13.80
14.60
15.80
17.80
2.00
2.40
2.80
3.20
3.60
4.00
4.40
4.80
5.20
5.60
6.00
6.40
6.80
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
3.60
4.00
4.40
4.80
5.20
5.60
6.00
6.40
6.80
7.20
7.60
8.00
8.40
9.20
10.00
11.20
12.00
13.20
14.00
15.20
17.20
A
ACCTB7E 201602-T
MID
0.65
Information
Dimension table (mm)
Terminal coplanarity
A
B±0.1
0.40±0.05
0.15±0.03
1.42
0.70 (Suction face)
CAD Data
Active optical connector
Header (Mated height: 0.8 mm)
Narrow pitch connectors A4S (0.4mm pitch)
0.70 (Suction face)
Dimension table (mm)
0.08
(Post and
soldering terminals)
1.42
(0.31)
0.15±0.03
C±0.1
Number of pins/
dimension
10
3.80
1.60
3.20
12
14
20
24
26
30
32
40
44
50
54
60
70
80
4.20
4.60
5.80
6.60
7.00
7.80
8.20
9.80
10.60
11.80
12.60
13.80
15.80
17.80
2.00
2.40
3.60
4.40
4.80
5.60
6.00
7.60
8.40
9.60
10.40
11.60
13.60
15.60
3.60
4.00
5.20
6.00
6.40
7.20
7.60
9.20
10.00
11.20
12.00
13.20
15.20
17.20
0.84
1.46
Soldering terminals
High current connectors
General tolerance: ±0.2
A
B
C
Header
Header
Socket
1.00±0.1
0.80±0.1
Socket and Header are mated
Socket
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
• 8 mm pitch embossed packaging
(D±1)
(A +0.3
−0.1 )
(A±0.3)
(B)
Top cover tape
(C)
(1.75)
(4.0)
(C)
(1.75)
Label
380 dia.
Tape II
(4.0)
Tape I
Embossed carrier tape
Embossed mounting-hole
(2.0)
(8.0)
(8.0)
(2.0)
Taping reel
.1
+0 0
5
1.
.1
+0 0
5
1.
Leading direction after packaging
FPC/FFC connectors
0.85
Soldering terminals
MID
Active optical connector
Terminal coplanarity
A
B±0.1
0.40±0.05
0.15±0.03
2.00
Narrow pitch connectors
Header (Mated height: 1.0 mm)
.
a
di
a.
di
Tape III
(A +0.3
−0.1 )
(2.0)
(4.0)
(C)
(1.75)
(4.0)
Leading direction after packaging
Information
• 4 mm pitch embossed packaging
1.
5
+0
0 .1
di
a.
–56–
ACCTB7E 201602-T
Dimension table (Unit: mm)
• 8 mm pitch embossed packaging
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for sockets
and headers
0.8 mm/1.0 mm
Max. 24
26 to 70
80
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
5,000
5,000
5,000
• 4 mm pitch embossed packaging
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for sockets
and headers 0.8 mm
Max. 24
30 to 64
Tape III
Tape III
16.0
24.0
—
—
7.5
11.5
17.4
25.4
15,000
15,000
High current connectors
Connector orientation with respect to embossed tape feeding direction
Type
Common for A4S
Direction
of tape progress
Socket
Narrow pitch connectors
Narrow pitch connectors A4S (0.4mm pitch)
Header
Information
MID
Active optical connector
FPC/FFC connectors
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–57–
ACCTB7E 201602-T
Narrow pitch connectors A4S (0.4mm pitch)
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted.
Please avoid using for applications other
than inspection.
RoHS compliant
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
A4S
for inspection
10
✩
12
✩
14
✩
16
✩
18
✩
20
✩
22
✩
24
✩
26
✩
28
✩
Number of pins
30
32
34
✩
✩
✩
36
✩
40
✩
44
✩
50
✩
54
✩
60
✩
64
✩
70
✩
80
✩
Notes: 1. Please inquire about number of pins other than those shown above.
2. Please inquire with us regarding availability.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
4. Please inquire if further information is needed.
PRODUCT TYPES
Socket
Specifications
Without positioning bosses
Part No.
AXE5E∗∗26
Specifications
Without positioning bosses
Header
Part No.
AXE6E∗∗26
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
NOTES
(0.65)
0.40±0.03
0.23±0.03
1.10±0.03
2.40±0.03
(0.50)
0.40±0.03
0.23±0.03
1.66±0.03
0.60±0.03
(0.53)
Recommended PC board pattern (TOP VIEW)
0.20±0.03
1.90±0.03
• Header (Mated height: 0.8mm/1.0mm)
Recommended PC board pattern (TOP VIEW)
2.90±0.03
1.06±0.03
(0.92)
• Socket (Mated height: 0.8mm/1.0mm)
C
0.
0.90±0.03
1.45±0.03
30
0.45±0.03
0.80±0.03
: Insulation area
(0.40)
0.40±0.01
0.20±0.01
0.40±0.01
0.20±0.01
1.26±0.01
2.30±0.01
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
(0.52)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 70%)
1.66±0.01
0.60±0.01
(0.53)
Recommended metal mask pattern
2.00±0.01
2.80±0.01
Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
2.90±0.01
1.60±0.01
(0.65)
FPC/FFC connectors
Active optical connector
Header
m
MID
0m
2.
Socket
m
Information
A4S
Connectors for
inspection usage
(0.4mm pitch)
5m
2.
High current connectors
Narrow pitch connectors
For board-to-FPC
C
30
0.
0.90±0.01
1.45±0.01
0.45±0.01
0.80±0.01
Regarding cautions for use, please
refer to page 171.
Please refer to the latest product
specifications when designing your
product.
–58–
ACCTB7E 201602-T
F4S
Narrow pitch connectors
(0.4mm pitch)
FEATURES
1. Space-saving (3.6 mm width)
3. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
Socket
s)
1
3.6
0
RoHS compliant
pin
Suction face: 0.8mm
Soldering terminals
at each corner
Soldering terminals
at each corner
Simple lock structure
4. Connectors for inspection available
Header
s)
0
9.8
2.6
(40
pin
APPLICATIONS
0
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
Ni barrier
construction
Bellows contact
construction
(Against solder rise!)
(Against dropping!)
• Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
• Board-to-board connection in
measuring devices and industrial
equipment, etc.
• Consumer equipment such as
handheld terminals
Porosity treatment
(Against corrosive gases!)
FPC/FFC connectors
Header
(40
Active optical connector
m
6m
2.
m
6m
3.
Socket
0
0.5
High current connectors
For board-to-FPC
Narrow pitch connectors
Narrow pitch connectors F4S (0.4mm pitch)
V notch and Double contact constructions
(Against foreign particles and flux!)
MID
ORDERING INFORMATION
AXT
2
4
5: Narrow Pitch Connector F4S (0.4 mm pitch) Socket
6: Narrow Pitch Connector F4S (0.4 mm pitch) Header
Number of pins (2 digits)
Information
Mated height
<Socket>
1: For mated height 1.0 mm
2: For mated height 1.2 mm
<Header>
1: For mated height 1.0 mm
2: For mated height 1.2 mm
Functions
<Socket, Header>
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating Surface: Au plating
Note: Please note that models with a mated height of 1.0 mm (7th digit of part number is “1”) and 1.2 mm (7th digit of part number is “2”) are not compatible.
–59–
ACCTB29E 201602-T
Narrow pitch connectors F4S (0.4mm pitch)
Mated height
1.0mm
FPC/FFC connectors
High current connectors
Narrow pitch connectors
PRODUCT TYPES
10
12
14
16
20
22
24
26
28
30
32
34
36
40
42
44
48
50
54
60
64
70
80
10
30
40
50
70
80
Part number
Socket
AXT510124
AXT512124
AXT514124
AXT516124
AXT520124
AXT522124
AXT524124
AXT526124
AXT528124
AXT530124
AXT532124
AXT534124
AXT536124
AXT540124
AXT542124
AXT544124
AXT548124
AXT550124
AXT554124
AXT560124
AXT564124
AXT570124
AXT580124
AXT510224
AXT530224
AXT540224
AXT550224
AXT570224
AXT580224
Packing
Header
AXT610124
AXT612124
AXT614124
AXT616124
AXT620124
AXT622124
AXT624124
AXT626124
AXT628124
AXT630124
AXT632124
AXT634124
AXT636124
AXT640124
AXT642124
AXT644124
AXT648124
AXT650124
AXT654124
AXT660124
AXT664124
AXT670124
AXT680124
AXT610224
AXT630224
AXT640224
AXT650224
AXT670224
AXT680224
Inner carton (1-reel)
Outer carton
3,000 pieces
6,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner-box (1-reel) units
For samples, please contact our sales office.
Information
MID
Active optical connector
1.2mm
Number of pins
–60–
ACCTB29E 201602-T
Narrow pitch connectors F4S (0.4mm pitch)
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.165N/pin contact × pin contacts
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.49N/pin contact
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
High current connectors
1. Characteristics
Narrow pitch connectors
SPECIFICATIONS
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Insertion and removal life
50 times
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
20 pin contacts Socket: 0.03 g Header: 0.01 g
2. Material and surface treatment
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)
MID
Contact and
Post
Material
LCP resin
(UL94V-0)
Information
Part name
Molded
portion
Active optical connector
Environmental
characteristics
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
FPC/FFC connectors
Conformed to MIL-STD-202F, method 107G
–61–
ACCTB29E 201602-T
Narrow pitch connectors F4S (0.4mm pitch)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 1.0 mm and 1.2 mm)
A
B±0.1
0.40±0.05
0.15±0.03
Terminal coplanarity
D
(Contact and
soldering terminals*)
(0.62)
3.60
2.36
(0.62)
0.08
3.00
0.80 (Suction face)
CAD Data
High current connectors
Narrow pitch connectors
DIMENSIONS (Unit: mm)
C0.15
2.00
FPC/FFC connectors
3.60
Y note
General tolerance: ±0.2
0.45
0.30±0.03
C±0.1
(0.80)
Z note
Mated height/
dimension
1.0mm
1.2mm
0.97
1.17
Number of pins/
dimension
10
12
14
16
20
22
24
26
28
30
32
34
36
40
42
44
48
50
54
60
64
70
80
A
B
C
4.50
4.90
5.30
5.70
6.50
6.90
7.30
7.70
8.10
8.50
8.90
9.30
9.70
10.50
10.90
11.30
12.10
12.50
13.30
14.50
15.30
16.50
18.50
1.60
2.00
2.40
2.80
3.60
4.00
4.40
4.80
5.20
5.60
6.00
6.40
6.80
7.60
8.00
8.40
9.20
9.60
10.40
11.60
12.40
13.60
15.60
3.40
3.80
4.20
4.60
5.40
5.80
6.20
6.60
7.00
7.40
7.80
8.20
8.60
9.40
9.80
10.20
11.00
11.40
12.20
13.40
14.20
15.40
17.40
Header (Mated height: 1.0 mm and 1.2 mm)
D
Terminal coplanarity
0.08
Dimension table (mm)
(0.46)
C
0.
1.86
13
1.68
2.60
5
(Post and
soldering terminals*)
.1
A
B±0.1
0.40±0.05
0.15±0.03
R0
CAD Data
0.80 (Suction face)
Active optical connector
Note: Since the soldering terminals* has a single-piece construction,
sections Y and Z are electrically connected.
D
Dimension table (mm)
MID
13
0.
C
1.90
Soldering terminals
Information
0.15±0.03
C±0.1
0.94
(0.48)
Soldering terminals*
General tolerance: ±0.2
Mated height/
dimension
1.0mm
1.2mm
D
0.83
1.01
Number of pins/
dimension
10
12
14
16
20
22
24
26
28
30
32
34
36
40
42
44
48
50
54
60
64
70
80
A
B
C
3.80
4.20
4.60
5.00
5.80
6.20
6.60
7.00
7.40
7.80
8.20
8.60
9.00
9.80
10.20
10.60
11.40
11.80
12.60
13.80
14.60
15.80
17.80
1.60
2.00
2.40
2.80
3.60
4.00
4.40
4.80
5.20
5.60
6.00
6.40
6.80
7.60
8.00
8.40
9.20
9.60
10.40
11.60
12.40
13.60
15.60
3.20
3.60
4.00
4.40
5.20
5.60
6.00
6.40
6.80
7.20
7.60
8.00
8.40
9.20
9.60
10.00
10.80
11.20
12.00
13.20
14.00
15.20
17.20
Mated height: 1.0 mm
Header
Socket
1.20±0.15
Header
Socket
1.00±0.15
• Socket and Header are mated
Mated height: 1.2 mm
–62–
ACCTB29E 201602-T
Narrow pitch connectors F4S (0.4mm pitch)
• Specifications for the plastic reel
(In accordance with EIAJET-7200B.)
D±1
A±0.3
C
Label
4
2
8.0
1.5+0.1
0 dia.
Leading direction after packaging
C
Top cover tape
1.75
380 dia.
1.75
Leading direction after packaging
Taping reel
B
4
2
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
High current connectors
• Specifications for taping
(In accordance with JIS C 0806:1990. However, not applied to
the mounting-hole pitch of some connectors.)
Tape I
Tape II
A±0.3
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for
sockets and headers:
1.0mm, 1.2mm
24 or less
26 to 70
80
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
3,000
3,000
3,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for F4S
Direction
of tape progress
Header
Information
MID
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Active optical connector
Socket
FPC/FFC connectors
• Dimension table (Unit: mm)
–63–
ACCTB29E 201602-T
Narrow pitch connectors F4S (0.4mm pitch)
FPC/FFC connectors
m
6m
2.
Socket
Header
RoHS compliant
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted.
Please avoid using for applications other
than inspection.
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
F4S
for inspection
10
✩
12
✩
14
✩
16
✩
20
✩
22
✩
24
✩
26
✩
28
✩
30
✩
Number of pins
32
34
36
✩
✩
✩
40
✩
42
✩
44
✩
48
✩
50
✩
54
✩
60
✩
64
✩
70
✩
80
✩
Notes: 1. Please inquire about number of pins other than those shown above.
2. Please inquire with us regarding availability.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
4. Please inquire if further information is needed.
5. Please note that this inspection connector cannot be connected to standard models with a stacking height of 1.2 mm (AXT5∗∗224 and AXT6∗∗224).
Please contact our sales office for a type connectable to models with a stacking height of 1.2 mm.
PRODUCT TYPES
Specifications
Socket
Part No.
AXT5E∗∗26
Specifications
Header
Part No.
AXT6E∗∗26
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
Information
MID
Active optical connector
F4S
Connectors for
inspection usage
(0.4mm pitch)
m
6m
3.
High current connectors
Narrow pitch connectors
For board-to-FPC
–64–
ACCTB29E 201602-T
Narrow pitch connectors F4S (0.4mm pitch)
: Insulation area
0.23±0.03
0.40±0.03
: Insulation area
Metal mask thickness: When 150μm
(Terminal opening ratio: 48%)
(Metal-part opening ratio: 100%)
0.80±0.01
0.45±0.01
2.06±0.01
0.75±0.01
(0.655)
0.20±0.01
0.40±0.01
0.20±0.01
0.40±0.01
Metal mask thickness: When 120μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
0.20±0.01
0.40±0.01
0.80±0.01
0.45±0.01
2.06±0.01
0.75±0.01
(0.655)
0.90±0.01
0.70±0.01
(0.52)
1.96±0.01
3.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
(0.63)
2.74±0.01
4.00±0.01
Recommended metal mask pattern
0.20±0.01
0.40±0.01
Regarding cautions for use, please
refer to page 171.
Information
Please refer to the latest product
specifications when designing your
product.
MID
4.20±0.01
1.80±0.01
(1.20)
0.90±0.01
0.70±0.01
(0.41)
2.18±0.01
3.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 150μm
(Terminal opening ratio: 48%)
(Metal-part opening ratio: 100%)
(0.51)
2.98±0.01
4.00±0.01
Recommended metal mask pattern
High current connectors
0.23±0.03
0.40±0.03
0.80±0.03
0.45±0.03
2.06±0.03
0.75±0.03
(0.655)
1.80±0.03
(1.20)
0.90±0.03
0.70±0.03
FPC/FFC connectors
Recommended PC board pattern (TOP VIEW)
Active optical connector
Recommended PC board pattern (TOP VIEW)
Max. 1.00
(0.75)
1.70±0.03
3.20±0.03
• Header
(Mated height: 1.0 mm/1.2 mm)
(0.92)
2.36±0.03
4.20±0.03
• Socket
(Mated height: 1.0 mm/1.2 mm)
4.20±0.01
1.80±0.01
(1.20)
Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Narrow pitch connectors
NOTES
–65–
ACCTB29E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
P4S
Narrow pitch connectors
(0.4mm pitch)
FEATURES
1. Space-saving (3.6 mm width)
Smaller compared to P4 with soldering
terminals (30 pins):
Socket — 38% smaller,
Header — 34% smaller
m
m
35
2.
Socket
3. Greater flexibility in connector
placement.
Pattern wiring to the connector bottom is
made possible with a molded covering on
the undersurface of the connector.
Soldering terminals
at each corner
Socket
m
6m
3.
High current connectors
Narrow pitch connectors
For board-to-board For board-to-FPC
<Socket>
<Header>
Header
8.70 (30 pins)
3.60
RoHS compliant
Soldering
terminals
at each
corner
FPC/FFC connectors
Soldering terminals
at each corner
Header
Soldering
terminals
at each
corner
4. Connectors for inspection available
5. Shield socket is also available.
7.90 (30 pins)
2.35
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
Active optical connector
Insulation
Insulation
area
area
Connector bottom:
Create any thru-hole
and pattern wiring.
APPLICATIONS
• Mobile devices, such as tablet PC,
note PC, digital still cameras (DSC)
and digital video cameras (DVC).
• Board-to-board connection in
measuring devices and industrial
equipment, etc.
• Consumer equipment such as
handheld terminals
ORDERING INFORMATION
AXT
2
4
Information
MID
3: Narrow Pitch Connector P4S (0.4 mm pitch) Socket
4: Narrow Pitch Connector P4S (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
1: For mated height 1.5 mm and 2.0 mm
2: For mated height 2.5 mm and 3.0 mm
<Header>
1: For mated height 1.5 mm and 2.5 mm
2: For mated height 2.0 mm
3: For mated height 3.0 mm
Functions
<Socket/Header>
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header> 4: Ni plating on base, Au plating on surface
–66–
ACCTB14E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
2.0mm
2.5mm
3.0mm
Packing
Header
AXT410124
AXT416124
AXT420124
AXT422124
AXT424124
AXT426124
AXT430124
AXT432124
AXT434124
AXT436124
AXT438124
AXT440124
AXT444124
AXT446124
AXT450124
AXT454124
AXT460124
AXT464124
AXT470124
AXT480124
AXT490124
AXT400124
AXT430224
AXT440224
AXT490224
AXT400224
AXT420124
AXT430124
AXT440124
AXT460124
AXT480124
AXT400124
AXT420324
AXT430324
AXT460324
AXT480324
AXT400324
Inner carton
Outer carton
3,000 pieces
6,000 pieces
High current connectors
10
16
20
22
24
26
30
32
34
36
38
40
44
46
50
54
60
64
70
80
90
100
30
40
90
100
20
30
40
60
80
100
20
30
60
80
100
Part number
Socket
AXT310124
AXT316124
AXT320124
AXT322124
AXT324124
AXT326124
AXT330124
AXT332124
AXT334124
AXT336124
AXT338124
AXT340124
AXT344124
AXT346124
AXT350124
AXT354124
AXT360124
AXT364124
AXT370124
AXT380124
AXT390124
AXT300124
AXT330124
AXT340124
AXT390124
AXT300124
AXT320224
AXT330224
AXT340224
AXT360224
AXT380224
AXT300224
AXT320224
AXT330224
AXT360224
AXT380224
AXT300224
FPC/FFC connectors
1.5mm
Number of pins
Active optical connector
Mated height
Narrow pitch connectors
PRODUCT TYPES
Information
MID
Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
2. The shield compatible products are also available for 14, 38, 50 and 74 pins with mated height of 1.5 mm.
–67–
ACCTB14E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
High current connectors
Narrow pitch connectors
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.0588N/pin contact × pin contacts
Soldering heat resistance
Storage temperature
Conditions
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA.
Using 250V DC megger
(applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.981N/pin contact
–55°C to +85°C
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. or 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
FPC/FFC connectors
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Lifetime
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Temperature 35°C±2°C,
saltwater concentration 5%±1%
Temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of
max. 200 times/hours
Mated height 1.5mm,
20 pin contacts Socket: 0.04 g Header: 0.02 g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact and Post
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals portion;
Socket: Ni plating on base, Pd + Au flash plating on surface
(Expect for front edge of terminal)
Header: Ni plating on base, Au plating on surface
(Expect for front edge of terminal)
Information
MID
Active optical connector
Saltwater spray resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
–68–
ACCTB14E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
1. Socket (Mated height: 1.5mm, 2.0mm, 2.5mm, 3.0mm)
CAD Data
Dimension table (mm)
Terminal coplanarity
0.08
(Contact and
soldering terminals)
E
0.40±0.05
3.60
2.60
(0.50)
3.00
Suction face 0.70
0.15±0.03
1.80
0.55
0.30±0.03
C±0.1
(0.90)
Z (Note)
3.60
(0.66)
Y (Note)
General tolerance: ±0.2
A
B
C
4.70
5.90
6.70
7.10
7.50
7.90
8.70
9.10
9.50
9.90
10.30
10.70
11.50
11.90
12.70
13.50
14.70
15.50
16.70
18.70
20.70
22.70
1.60
2.80
3.60
4.00
4.40
4.80
5.60
6.00
6.40
6.80
7.20
7.60
8.40
8.80
9.60
10.40
11.60
12.40
13.60
15.60
17.60
19.60
3.50
4.70
5.50
5.90
6.30
6.70
7.50
7.90
8.30
8.70
9.10
9.50
10.30
10.70
11.50
12.30
13.50
14.30
15.50
17.50
19.50
21.50
Mated height/
dimension
1.5mm
2.0mm
2.5mm
3.0mm
1.45
1.45
2.45
2.45
B
C
E
Active optical connector
A
B±0.1
Number of pins/
dimension
10
16
20
22
24
26
30
32
34
36
38
40
44
46
50
54
60
64
70
80
90
100
Narrow pitch connectors
CAD Data
High current connectors
The CAD data of the products with a
FPC/FFC connectors
DIMENSIONS (Unit: mm)
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
2. Header (Mated height: 1.5mm, 2.5mm)
CAD Data
B±0.1
0.
20
0.40±0.05
R
2.35
(0.45)
R
1.45
0.
25
2.35
R
0.15±0.03
0.
20
C±0.1
0.84
1.49
Soldering terminals
0.15±0.03
(0.33)
Soldering terminals
General tolerance: ±0.2
Number of pins/
dimension
10
3.90
1.60
3.20
16
20
22
24
26
30
32
34
36
38
40
44
46
50
54
60
64
70
80
90
100
5.10
5.90
6.30
6.70
7.10
7.90
8.30
8.70
9.10
9.50
9.90
10.70
11.10
11.90
12.70
13.90
14.70
15.90
17.90
19.90
21.90
2.80
3.60
4.00
4.40
4.80
5.60
6.00
6.40
6.80
7.20
7.60
8.40
8.80
9.60
10.40
11.60
12.40
13.60
15.60
17.60
19.60
4.40
5.20
5.60
6.00
6.40
7.20
7.60
8.00
8.40
8.80
9.20
10.00
10.40
11.20
12.00
13.20
14.00
15.20
17.20
19.20
21.20
A
Note: The soldering terminal dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different.
–69–
ACCTB14E 201602-T
Information
Suction face 0.54
Terminal coplanarity
0.08
(Post and
soldering terminals)
1.24
MID
Dimension table (mm)
A
Narrow pitch connectors P4S (0.4mm pitch)
Narrow pitch connectors
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
3. Header (Mated height: 2.0mm)
CAD Data
20
R
R
Terminal coplanarity
0.08
(Post and
soldering terminals)
0.
0.
25
R
0.
FPC/FFC connectors
20
Soldering terminals
C±0.1
0.84
2.35
(0.33)
Dimension table (mm)
0.15±0.03
Active optical connector
1.74
0.40±0.05
0.15±0.03
1.45
High current connectors
Suction face 0.54
A
B±0.1
General tolerance: ±0.2
Number of pins/
dimension
30
7.90
5.60
7.20
40
90
100
9.90
19.90
21.90
7.60
17.60
19.60
9.20
19.20
21.20
B
C
A
B
C
Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different.
4. Header (Mated height: 3.0mm)
CAD Data
0.
20
0.40±0.05
0.15±0.03
2.35
0.
25
Information
20
(0.45)
0.
R
1.45
R
Terminal coplanarity
0.08
(Post and
soldering terminals)
2.24
R
MID
Suction face 0.54
A
B±0.1
Soldering terminals
0.15±0.03
C±0.1
(0.76)
0.84
2.35
Dimension table (mm)
General tolerance: ±0.2
Number of pins/
dimension
20
5.90
3.60
5.20
30
60
80
100
7.90
13.90
17.90
21.90
5.60
11.60
15.60
19.60
7.20
13.20
17.20
21.20
A
Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different.
–70–
ACCTB14E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
Header
2.50±0.15
Socket
EMBOSSED TAPE DIMENSIONS (unit: mm)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
A±0.3
A±0.3
Label
8.0
380 dia.
(4.0)
Top cover tape
(2.0)
(2.0)
Pull out direction
(4.0)
C
1.75
Embossed carrier tape
Embossed mounting-hole
8.0
1.75
Pull out direction
Taping reel
D±1
B
C
1.5+0.1
0 dia.
1.5+0.1
0 dia.
FPC/FFC connectors
1.50±0.15
2.00±0.15
Socket
3.00±0.15
Socket
Socket
High current connectors
Header
Header
Header
Narrow pitch connectors
Socket and Header are mated
Mated height
Number of pins
Socket/Header
Type of taping
A
B
C
D
Quantity per reel
Common for socket and header:
1.5mm, 2.0mm, 2.5mm and
3.0mm
Max. 24
26 to 70
72 to 100
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
3,000
3,000
3,000
Connector orientation with respect to direction of progress of embossed tape
Type
Active optical connector
Dimension table (mm)
Common for P4S
Direction of
tape progress
Header
MID
Socket
Information
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–71–
ACCTB14E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
FPC/FFC connectors
Socket
m
m
35
2.
Header
RoHS compliant
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted. Please avoid using for
applications other than inspection.
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
P4S
for inspection
10
✩
16
✩
20
✩
22
✩
24
✩
26
✩
30
✩
32
✩
34
✩
Number of pins
36
38
✩
✩
40
✩
44
✩
50
✩
54
✩
60
✩
70
✩
80
✩
90
✩
100
✩
Notes: 1. You can use with each mated height in common.
2. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.)
3. Please inquire about number of pins other than those shown above.
4. Please inquire with us regarding availability.
5. Please keep the minimum order quantities no less than 50 pieces per lot.
6. Please inquire if further information is needed.
PRODUCT TYPES
Specifications
Socket
Part No.
AXT3E∗∗26
Specifications
Header
Part No.
AXT4E∗∗26
Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
Information
MID
Active optical connector
P4S
Connectors for
inspection usage
(0.4mm pitch)
m
6m
3.
High current connectors
Narrow pitch connectors
For board-to-board For board-to-FPC
–72–
ACCTB14E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
0.23±0.03
0.40±0.03
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 48%)
(Metal portion opening area ratio: 100%)
FPC/FFC connectors
0.95±0.01
0.70±0.01
0.20±0.01
0.40±0.01
Recommended metal mask pattern
4.00±0.01
2.90±0.01
MID
0.20±0.01
0.40±0.01
Information
4.20±0.01
1.80±0.01
(1.20)
0.95±0.01
0.70±0.01
(0.55)
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
Active optical connector
3. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
(0.44)
3.12±0.01
4.00±0.01
Max. 0.03 mm
4.20±0.01
1.80±0.01
(1.20)
Max. 0.03 mm
High current connectors
4.20±0.03
(0.80)
0.95±0.03
0.70±0.03
2.60±0.03
Recommended PC board pattern (TOP VIEW)
(1.20)
2. Keep the PC board warp no more than 0.03mm in relation
to the overall length of the connector.
• Socket (Mated height: 1.5mm, 2.0mm, 2.5mm and 3.0mm)
1.80±0.03
1. As shown below, excess force during insertion may
result in damage to the connector or removal of the solder.
Also, to prevent connector damage please confirm the
correct position before mating connectors.
Narrow pitch connectors
NOTES
–73–
ACCTB14E 201602-T
Narrow pitch connectors P4S (0.4mm pitch)
• Header (Mated height: 2.0mm, 3.0mm)
0.23±0.03
0.40±0.03
0.65±0.03
(1.15)
1.65±0.03
0.65±0.03
(0.50)
0.80±0.03
0.45±0.03
: Insulation area
Max. 0.90
(0.75)
1.45±0.03
2.95±0.03
0.80±0.03
0.45±0.03
Recommended PC board pattern (TOP VIEW)
Max. 0.90
(0.75)
1.45±0.03
2.95±0.03
Recommended PC board pattern (TOP VIEW)
0.23±0.03
0.40±0.03
: Insulation area
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 49%)
(Metal portion opening area ratio: 100%)
0.80±0.01
0.45±0.01
2.95±0.01
0.65±0.01
(1.15)
1.65±0.01
0.65±0.01
(0.50)
0.80±0.01
0.45±0.01
0.20±0.01
0.40±0.01
(0.42)
1.91±0.01
2.75±0.01
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 49%)
(Metal portion opening area ratio: 100%)
(0.42)
1.91±0.01
2.75±0.01
Recommended metal mask pattern
0.20±0.01
0.40±0.01
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
0.80±0.01
0.45±0.01
2.95±0.01
0.65±0.01
(1.15)
0.80±0.01
0.45±0.01
0.20±0.01
0.40±0.01
(0.52)
1.71±0.01
2.75±0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
(0.52)
1.71±0.01
2.75±0.01
Recommended metal mask pattern
1.65±0.01
0.65±0.01
(0.50)
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
• Header (Mated height: 1.5mm and 2.5mm)
0.20±0.01
0.40±0.01
MID
Regarding cautions for use, please
refer to page 171.
Note: The recommended PC board pattern
diagrams and metal mask pattern diagrams
for headers with mated heights of 1.5 mm/
2.5 mm and 2.0 mm/3.0 mm are different.
Information
Please refer to the latest product
specifications when designing your
product.
–74–
ACCTB14E 201602-T
Narrow pitch connectors
(0.4mm pitch)
P4S
Shield type
FEATURES
1. Radiation noise is reduced thanks
to better grounding with multi-point
ground construction and covering
using a shield plate.
Keeping the ground terminal pitch
distanced properly reduces radiation
noise.
New
m
m
35
2.
m
m
80
3.
Socket
2. “
” ensures
high resistance to various
environments.
3. Previous standard product (P4S)
can also be used on the header side.
4. Freedom of design is increased,
because it has the same foot pattern
as the previous standard product
(P4S).
Header
High current connectors
For board-to-board For board-to-FPC
Narrow pitch connectors
Narrow pitch connectors P4S Shield type (0.4mm pitch)
Multi-point ground
terminals
(every 2.4 mm pitch)
High-speed data transfer in tablet PC
and note PCs, and connectivity
applications in which certain parts
require shielding.
<Ground terminal cross-section diagram>
Active optical connector
Shield plate
Ground terminals
With the shield plate contact, ground is conducted
on both the socket and header.
ORDERING INFORMATION
AXT
1
FPC/FFC connectors
APPLICATIONS
RoHS compliant
4
MID
3: Socket (with shield)
4: Header (Common for standard / with shield)
Number of pins (2 digits)
Mated height
<Socket>
1: For mated height 1.5 mm
<Header>
1: For mated height 1.5 mm
Information
Functions
<Socket>
F: With shield plate, without positioning bosses
<Header>
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header> 4: Ni plating on base, Au plating on surface
–75–
ACCTB68E 201602-T
Narrow pitch connectors P4S Shield type (0.4mm pitch)
FPC/FFC connectors
High current connectors
Narrow pitch connectors
PRODUCT TYPES
Number of pins
1.5mm
14 (Signal: 10/GND: 4)
38 (Signal: 30/GND: 8)
50 (Signal: 40/GND: 10)
74 (Signal: 60/GND: 14)
Socket
AXT3141F4
AXT3381F4
AXT3501F4
AXT3741F4
Packing
Header
AXT414124
AXT438124
AXT450124
AXT474124
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
Max. 0.3 A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 minute
Min. 1,000MΩ (Initial stage)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Max. 0.981N/pin contact × pin contacts (Initial stage)
Min. 0.0588N/pin contact × pin contacts
According to the contact resistance measurement method
of JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
Measure maximum force when the terminal of an end is
pulled out in axial direction.
No icing or condensation.
Min. 0.981N/pin contact
Shield plate holding force
Min. 0.490N
Ambient temperature
–55°C to +85°C
Storage temperature
Conditions
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA.
Using 250V DC megger (applied for 1 minute)
Insulation resistance
Soldering heat resistance
Active optical connector
Part number
Mated height
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. or 350°C within 3 sec.
–55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(Header and socket mated)
Environmental
characteristics
Humidity resistance
(Header and socket mated)
MID
Salt water spray resistance
(Header and socket mated)
Lifetime
characteristics
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
H2S resistance
(Header and socket mated)
After 48 hours
Contact resistance: Max. 90mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
Humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
Salt water concentration 5%±1%
Conformed to JEIDA-38-1984
Bath temperature 40°C±2°C,
Gas concentration 3 ppm ±1 ppm,
Humidity 75% to 80% R.H.
Repeated insertion and removal cycles of
max. 200 times/hour
38 pin contacts: Socket 0.07g, Header 0.03g
50 pin contacts: Socket 0.09g, Header 0.04g
74 pin contacts: Socket 0.12g, Header 0.05g
Unit weight
Information
2. Material and surface treatment
Part name
Molded portion
Contact and Post,
Shield plate,
Soldering terminal
Material
Surface treatment
Heat resistant plastic
(UL 94V-0)
Copper alloy
—
Contact / Post; Contact portion: Au plating over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Shield plate; Contact portion: Au plating over nickel
Terminal portion: Au plating over nickel
Soldering terminal portion (socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminal portion (header): Au plating over nickel (except for top of the terminal)
–76–
ACCTB68E 201602-T
Narrow pitch connectors P4S Shield type (0.4mm pitch)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Narrow pitch connectors
DIMENSIONS (Unit: mm)
1. Socket (Mated height: 1.5mm)
0.70 (Suction face)
CAD Data
A
B±0.1
Terminal coplanarity
1.45
0.40±0.05
0.15±0.03
0.08
High current connectors
3.54
(Contact, shield plate and soldering terminals)
C0.2
Note 2
GND terminal
every pitch 2.40
(Connect to GND pad)
(0.66)
1.80
3.80
Y Note 1
C±0.1
Dimension table (mm)
General tolerance: ±0.2
Notes: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
2. Because the Ground terminals are the unified structure, they are connected electrically.
Number of pins/dimension
14 (Signal: 10/GND: 4)
38 (Signal: 30/GND: 8)
50 (Signal: 40/GND: 10)
74 (Signal: 60/GND: 14)
A
5.50
10.30
12.70
17.50
B
2.40
7.20
9.60
14.40
C
4.30
9.10
11.50
16.30
A
4.70
9.50
11.90
16.70
B
2.40
7.20
9.60
14.40
C
4.00
8.80
11.20
16.00
FPC/FFC connectors
0.30±0.03
0.65
(1.00)
Z Note 1
2. Header (Mated height: 1.5mm)
0.54 (Suction face)
1.24
0.08
0.
R
(0.45)
25
2.35
R
0.
20
(Post and soldering terminals)
1.45
every pitch 2.40
(Connect to GND pad)
R
Terminal coplanarity
A
B±0.1
0.40±0.05
0.15±0.03
Active optical connector
CAD Data
0.
MID
20
Dimension table (mm)
Number of pins/dimension
14 (Signal: 10/GND: 4)
38 (Signal: 30/GND: 8)
50 (Signal: 40/GND: 10)
74 (Signal: 60/GND: 14)
General tolerance: ±0.2
Header
1.50±0.15
Socket and Header are mated
Socket
–77–
ACCTB68E 201602-T
Information
1.49
Soldering terminals
C±0.1
0.84
0.15±0.03
(0.33)
Soldering terminals
Narrow pitch connectors P4S Shield type (0.4mm pitch)
FPC/FFC connectors
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
(A±0.3)
(B)
(D±1)
Top cover tape
Embossed carrier tape
Embossed mounting-hole
8.0
8.0
Taping reel
1.
1.
5 +0
5 +0
0 .1
0 .1
di
di
a.
a.
Dimension table (mm)
Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for socket and header:
1.5mm
14
38 and 50
74
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
3,000
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P4S Shield type
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Information
MID
Active optical connector
Label
(2.0)
(2.0)
(4.0)
(C)
(1.75)
380 dia.
Tape II
(A +0.3
−0.1 )
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(4.0)
Tape I
(C)
(1.75)
Leading direction after packaging
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
–78–
ACCTB68E 201602-T
Narrow pitch connectors P4S Shield type (0.4mm pitch)
• Header (Mated height: 1.5 mm)
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
(0.50)
2.95±0.03
Max. 0.90
(0.75)
Information
(0.50)
0.65±0.01
0.20±0.01
0.40±0.01
(0.52)
0.80±0.01
0.45±0.01
1.65±0.01
(1.20)
(0.55)
0.95±0.01
1.71±0.01
Metal mask thickness: When 120μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
4.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
2.90±0.01
Recommended metal mask pattern
0.70±0.01
2.75±0.01
1.91±0.01
(0.42)
0.20±0.01
0.40±0.01
MID
0.20±0.01
0.40±0.01
0.65±0.01
(0.44)
0.80±0.01
0.45±0.01
1.65±0.01
(1.20)
1.80±0.01
4.20±0.01
4.00±0.01
Metal mask thickness: When 150μm
(Terminal opening ratio: 49%)
(Metal-part opening ratio: 100%)
3.12±0.01
Recommended metal mask pattern
Metal mask thickness: When 150μm
(Terminal opening ratio: 48%)
(Metal-part opening ratio: 100%)
0.95±0.01
1.80±0.01
: Connect to GND
(every 2.4 mm pitch)
0.40±0.03
Recommended metal mask pattern
0.70±0.01
4.20±0.01
0.23±0.03
: Connect to GND
(every 2.4 mm pitch)
0.40±0.03
: Connect to GND
2.40
: Connect to GND
0.23±0.03
2.75±0.01
2.40
(0.50)
: Insulation area
1.45±0.03
0.80±0.03
0.45±0.03
1.65±0.03
0.65±0.03
(1.20)
1.80±0.03
(0.80)
0.70±0.03
4.20±0.03
2.60±0.03
0.95±0.03
0.20±0.01
0.40±0.01
Regarding cautions for use, please
refer to page 171.
Please refer to the latest product
specifications when designing your
product.
–79–
FPC/FFC connectors
• Socket (Mated height: 1.5 mm)
Active optical connector
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
High current connectors
Narrow pitch connectors
NOTES
ACCTB68E 201602-T
Narrow pitch connectors P4 (0.4mm pitch)
P4
Narrow pitch connectors
(0.4mm pitch)
FEATURES
• Without soldering terminals
m
m
Socket
96
3.
m
1m
5.
High current connectors
Narrow pitch connectors
For board-to-board For board-to-FPC
Header
• With soldering terminals
1. 0.4 mm pitch and mated heights of
1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and
3.5 mm.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. Constructed with impact dispersion
keys inside the body to disperse
shocks when dropped.
5. Contributes to improved mating
1) Guides are provided to take up any
position shift and facilitate insertion.
Insertion guide
Impact dispersion key
Active optical connector
m
m
Socket
96
MID
2) Simple lock structure provides tactile
feedback to ensure excellent mating/
unmating operation feel.
3.
m
1m
5.
FPC/FFC connectors
Socket
Header
Header side
contact
RoHS compliant
Header
A high level of shock resistance is
ensured by dispersing impact over the
four locations where the socket
indentations and header protrusions are
mated together.
Note: The following number of pins are not supported
due to suction surface factors.
• Without soldering terminals: 18 pins or less
• With soldering terminals: 22 pins or less
4. Construction makes designing
devices easier.
The lower connector bottom surface
construction prevents contact and shorts
between the PCB and metal terminals.
This enables freedom in pattern wiring,
helping to make PCB’s smaller.
<Socket>
<Header>
Insulation area
Insulation area
Socket side
contact
6. Design facilitates efficient
mounting.
Features a terminal flatness of 0.08 mm,
construction resistant to creeping flux,
and design that allows visual inspection
of the soldered part.
7. Connectors for inspection available
APPLICATIONS
• Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
• Board-to-board connection in
measuring devices and industrial
equipment, etc.
• Consumer equipment such as
handheld terminals
Information
Connector bottom:
Create any thru-hole and pattern wiring.
Simple lock
mechanism
–80–
ACCTB57E 201602-T
Narrow pitch connectors P4 (0.4mm pitch)
AXK
G
7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket
8: Narrow Pitch Connector P4 (0.4 mm pitch) Header
Number of pins (2 digits)
High current connectors
Mated height
<Socket>
1: For mated height 1.5 mm
2: For mated height 2.0 mm
3: For mated height 2.5 mm and 3.0 mm
4: For mated height 3.5 mm
<Header>
1: For mated height 1.5 mm, 2.0 mm and 2.5 mm
2: For mated height 3.0 mm and 3.5 mm
Narrow pitch connectors
ORDERING INFORMATION
Functions
2: With soldering terminals, without positioning bosses
4: Without soldering terminals, without positioning bosses
Other specifications
<Header>
W: V notch
Packing
G: 3,000 pieces embossed tape and plastic reel × 2∗
Information
MID
Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel × 2.
2. Please note that the models with a soldering terminals (8th digit of part number is “2”) and those without a soldering terminals (8th digit of part number is “4”)
are shaped differently and are not compatible.
Active optical connector
FPC/FFC connectors
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
5: Ni plating on base, Au plating on surface
–81–
ACCTB57E 201602-T
Narrow pitch connectors P4 (0.4mm pitch)
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
PRODUCT TYPES
1. Without soldering terminals
Mated height
1.5 mm
2.0 mm
2.5 mm
MID
3.0 mm
3.5 mm
Number of pins
14
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
14
20
24
26
30
40
50
60
70
80
14
20
24
30
40
50
60
70
80
20
24
30
40
50
60
80
20
30
40
Part number
Packing
Socket
AXK714147G
AXK720147G
AXK722147G
AXK724147G
AXK726147G
AXK730147G
AXK734147G
AXK740147G
AXK744147G
AXK750147G
AXK754147G
AXK760147G
AXK764147G
AXK770147G
AXK780147G
AXK700147G
AXK714247G
AXK720247G
AXK724247G
AXK726247G
AXK730247G
AXK740247G
AXK750247G
AXK760247G
AXK770247G
AXK780247G
AXK714347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK770347G
AXK780347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK780347G
AXK720447G
AXK730447G
AXK740447G
Header
AXK814145WG
AXK820145WG
AXK822145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK834145WG
AXK840145WG
AXK844145WG
AXK850145WG
AXK854145WG
AXK860145WG
AXK864145WG
AXK870145WG
AXK880145WG
AXK800145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK820245WG
AXK824245WG
AXK830245WG
AXK840245WG
AXK850245WG
AXK860245WG
AXK880245WG
AXK820245WG
AXK830245WG
AXK840245WG
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Information
Note: Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
–82–
ACCTB57E 201602-T
Narrow pitch connectors P4 (0.4mm pitch)
2.0 mm
2.5 mm
3.0 mm
3.5 mm
10
34
40
34
12
20
32
40
20
36
60
70
80
60
Header
AXK810125WG
AXK834125WG
AXK840125WG
AXK834125WG
AXK812125WG
AXK820125WG
AXK832125WG
AXK840125WG
AXK820225WG
AXK836225WG
AXK860225WG
AXK870225WG
AXK880225WG
AXK860225WG
70
80
AXK770427G
AXK780427G
AXK870225WG
AXK880225WG
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Note: Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Dielectric strength
Insulation resistance
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Contact resistance
Max. 70mΩ
Composite insertion force
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.0588N/pin contact × pin contacts
(Mated height 1.5 mm without soldering terminals type)
Min. 0.118N/pin contact × pin contacts
All the other types except the above
Composite removal force
Post holding force
–55°C to +85°C
Soldering heat resistance
Storage temperature
Detection current: 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Min. 0.981N/pin contact
Ambient temperature
Conditions
High current connectors
1.5 mm
Packing
Socket
AXK710127G
AXK734127G
AXK740127G
AXK734227G
AXK712327G
AXK720327G
AXK732327G
AXK740327G
AXK720327G
AXK736327G
AXK760327G
AXK770327G
AXK780327G
AXK760427G
FPC/FFC connectors
Part number
Number of pins
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Infrared reflow soldering
Active optical connector
Mated height
Narrow pitch connectors
2. With soldering terminals
Soldering iron
No icing or condensation.
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 70mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
Mated height 1.5mm, 20 pin contacts;
Socket: 0.04g Header: 0.02g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact/Post
Copper alloy
Soldering terminals portion
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
However, upper terminal of Ni barrier production: Exposed over Ni
The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.
Ni plating on base, Sn plating on surface (Except for front terminal)
–83–
ACCTB57E 201602-T
Information
Environmental
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
MID
Conformed to MIL-STD-202F, method 107G
Narrow pitch connectors P4 (0.4mm pitch)
The CAD data of the products with a
CAD Data
1. Without Soldering Terminals
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Dimension table (mm)
B±0.1
Terminal
coplanarity
0.08
1.11
(Suction face)
0.40±0.05
E
4.10
0.15±0.03
3.75
5.10
High current connectors
0.40±0.05
0.80
(0.675)
0.80
FPC/FFC connectors
C
Max. 18 pin contacts
D
5.10
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
6.30
6.70
7.10
7.50
8.30
9.10
10.30
11.10
12.30
13.10
14.30
15.10
16.30
18.30
22.30
A
Mated height/dimension
1.5mm
2.0mm
2.5mm, 3.0mm
3.5mm
General tolerance: ±0.2
B
C
D
2.40
—
2.80
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C
D
E
1.50
1.92
2.42
2.92
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Terminal
coplanarity
0.08
B±0.1
0.40±0.05
(0.42)
3.12
0.10±0.03
(0.42)
0.76
0.76
C
F
(Suction face)
3.96
2.66
0.15±0.03
3.96
E
2.19
0.40±0.05
MID
Number of pins/
dimension
14
Information
Max. 18 pin contacts
Number of pins/
dimension
14
3.90
2.40
—
3.04
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
5.10
5.50
5.90
6.30
7.10
7.90
9.10
9.90
11.10
11.90
13.10
13.90
15.10
17.10
21.10
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
E
1.31
2.26
F
1.20
1.26
A
Mated height/dimension
1.5mm, 2.0mm, 2.5mm
3.0mm, 3.5mm
General tolerance: ±0.2
D
Dimension table (mm)
B
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated
–84–
3.50±0.15
Active optical connector
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
(0.675)
Narrow pitch connectors
DIMENSIONS (Unit: mm)
ACCTB57E 201602-T
Narrow pitch connectors P4 (0.4mm pitch)
Terminal
coplanarity
0.08
0.40±0.05
0.15±0.03
Dimension table (mm)
0.80
C
0.80
Soldering
terminals
(0.675)
1.11
(Suction
face)
3.75
5.10
4.10
F
0.60
(0.675)
A
B±0.1
0.10±0.03
0.50
D
10 and 12 pin contacts
20 pin contacts
E
E
Number of pins/
dimension
10
5.90
1.60
—
4.60
2.00
12
20
32
34
36
40
60
70
80
6.30
7.90
10.30
10.70
11.10
11.90
15.90
17.90
19.90
2.00
3.60
6.00
6.40
6.80
7.60
11.60
13.60
15.60
—
—
3.20
3.60
4.00
4.80
8.80
10.80
12.80
5.00
6.60
9.00
9.40
9.40
10.60
14.60
16.60
18.60
2.40
2.40
—
—
—
—
—
—
—
C
D
E
A
B
Mated height/dimension
1.5mm
2.0mm
2.5mm, 3.0mm
3.5mm
General tolerance: ±0.2
C
D
E
F
1.50
1.92
2.42
2.92
Active optical connector
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Terminal
coplanarity
0.08
B±0.1
0.40±0.05
FPC/FFC connectors
CAD Data
High current connectors
Narrow pitch connectors
2. With Soldering Terminals
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
0.40±0.05
0.10±0.03
C
D
10 and 12 pin contacts
E
20 pin contacts
E
3.10
1.60
—
1.94
1.64
12
20
32
34
36
40
60
70
80
3.50
5.10
7.50
7.90
8.30
9.10
13.10
15.10
17.10
2.00
3.60
6.00
6.40
6.80
7.60
11.60
13.60
15.60
—
—
3.20
3.60
4.00
4.80
8.80
10.80
12.80
2.34
3.94
6.34
6.74
7.14
7.94
11.94
13.94
15.94
2.04
2.80
—
—
—
—
—
—
—
F
1.31
2.26
G
1.20
1.26
A
B
Mated height/dimension
1.5mm, 2.0mm, 2.5mm
3.0mm, 3.5mm
General tolerance: ±0.2
–85–
3.50±0.15
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated.
ACCTB57E 201602-T
MID
3.96
Soldering terminals
Number of pins/
dimension
10
Information
0.76
Dimension table (mm)
(0.42)
0.60
3.12
2.19
G
(Suction face)
2.66
(0.42)
F
0.15±0.03
Narrow pitch connectors P4 (0.4mm pitch)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
D±1
A±0.3
C
Taping reel
Label
B
C
8.0
Top cover tape
4
2
Pull out direction
4
2
1.75
380 dia.
1.75
Pull out direction
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (unit: mm)
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
1.5+0.1
0 dia.
FPC/FFC connectors
Dimension table (mm)
1. Without Soldering Terminals
Number of pins
Socket
Header
Type of taping
A
B
C
D
Quantity per reel
Max. 18
Max. 18
20 to 70
20 to 70
80 to 100
80 to 100
20 to 40
Tape I
Tape I
Tape II
Tape I
16.0
24.0
32.0
24.0
—
—
28.4
—
7.5
11.5
14.2
11.5
17.4
25.4
33.4
25.4
3,000
3,000
3,000
2,000
Number of pins
Socket
Header
Type of taping
A
B
C
D
Quantity per reel
Tape I
Tape I
Tape II
Tape I
Tape II
16.0
24.0
32.0
24.0
32.0
—
—
28.4
—
28.4
7.5
11.5
14.2
11.5
14.2
17.4
25.4
33.4
25.4
33.4
3,000
3,000
3,000
2,000
2,000
Mated height
Common for socket and header:
1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm
Header: 3.5 mm
Socket: 3.5 mm
2. With Soldering Terminals
Active optical connector
Mated height
Common for socket and header:
1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm
Header: 3.5 mm
Max. 18
20 to 60
70 to 80
Max. 18
20 to 70
80
60
70 to 80
Socket: 3.5 mm
3. Connector orientation with respect to direction of progress of embossed tape
1) Without soldering terminals
Type
Common for P4
Direction of
tape progress
Header
MID
Socket
Note: There is no indication on this product regarding top-bottom or left-right orientation.
2) With soldering terminals
Information
Type
Common for P4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–86–
ACCTB57E 201602-T
Header
RoHS compliant
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted. Please avoid using for
applications other than inspection.
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
P4 for inspection
without soldering terminals
P4 for inspection
with soldering terminals
10
✩
12
14
20
22
24
26
30
✩
✩
✩
✩
✩
✩
✩
✩
Number of pins
34
40
✩
✩
✩
✩
44
50
54
60
64
70
80
100
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
Notes: 1. You can use with each mated height in common.
2. Please inquire about number of pins other than those shown above.
3. Please inquire with us regarding availability.
4. Please keep the minimum order quantities no less than 50 pieces per lot.
5. Please inquire if further information is needed.
PRODUCT TYPES
Socket
Specifications
With soldering terminals
Without soldering terminals
Part No.
AXK7E∗∗26G
AXK7E∗∗46G
Header
Specifications
With soldering terminals
Without soldering terminals
Part No.
AXK8E∗∗26WG
AXK8E∗∗46WG
High current connectors
m
m
96
3.
m
1m
5.
Socket
FEATURES
FPC/FFC connectors
P4
Connectors for
inspection usage
(0.4mm pitch)
Active optical connector
For board-to-board For board-to-FPC
Narrow pitch connectors
Narrow pitch connectors P4 (0.4mm pitch)
Information
MID
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
–87–
ACCTB57E 201602-T
Narrow pitch connectors P4 (0.4mm pitch)
1) Without soldering terminals
Socket
Header
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.40±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
2.96±0.05
4.56±0.05
0.115±0.05
0.40±0.05
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 40%)
Metal mask thickness: When 150 μm
(Opening area ratio: 32%)
0.40±0.01
0.35±0.01
(0.30)
(0.30)
3.50±0.01
4.10±0.01
(0.51)
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Opening area ratio: 50%)
Metal mask thickness: When 120 μm
(Opening area ratio: 40%)
0.40±0.01
0.35±0.01
0.20±0.01
0.40±0.01
0.10±0.01
0.35±0.01
0.10±0.01
4.10±0.01
(0.37)
(0.63)
0.20±0.01
(0.37)
Information
MID
(0.63)
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.35±0.01
0.10±0.01
0.20±0.01
(0.51)
Max. 0.03 mm
5.50±0.01
4.48±0.01
Max. 0.03 mm
0.40±0.01
0.10±0.01
5.50±0.01
4.24±0.01
FPC/FFC connectors
0.40±0.05
0.115±0.05
0.40±0.05
0.20±0.01
Active optical connector
0.40±0.05
0.23±0.03
0.40±0.05
0.23±0.03
3.50±0.05
5.70±0.05
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
3.36±0.01
High current connectors
Narrow pitch connectors
NOTES
–88–
ACCTB57E 201602-T
Header
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.40±0.05
0.23±0.03
0.90±0.05
(0.80)
(0.80)
(1.10)
0.40±0.05
0.115±0.05
4.56±0.05
2.96±0.05
0.90±0.05
(1.10)
3.50±0.05
0.80±0.05
2.15±0.05
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 40%)
(Metal portion opening area ratio: 65%)
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 32%)
(Metal portion opening area ratio: 65%)
(0.30)
0.35±0.01
0.10±0.01
0.58±0.01
0.82±0.01
0.82±0.01
0.58±0.01
2.15±0.01
2.15±0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 50%)
(Metal portion opening area ratio: 80%)
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 40%)
(Metal portion opening area ratio: 80%)
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.37)
(0.63)
Recommended metal mask pattern
0.35±0.01
0.10±0.01
0.72±0.01
2.15±0.01
0.72±0.01
0.82±0.01
0.82±0.01
Information
2.15±0.01
MID
(0.63)
(0.37)
4.10±0.01
3.36±0.01
0.80±0.01
0.40±0.01
0.20±0.01
Active optical connector
(0.51)
(0.30)
5.50±0.01
4.48±0.01
0.80±0.01
4.10±0.01
3.50±0.01
0.80±0.01
0.40±0.01
0.20±0.01
FPC/FFC connectors
0.35±0.01
0.10±0.01
(0.51)
0.40±0.01
0.20±0.01
Please refer to the latest product
specifications when designing your
product.
0.80±0.05
0.82±0.05
Recommended metal mask pattern
5.50±0.01
4.24±0.01
0.80±0.01
5.70±0.05
0.40±0.05
0.23±0.03
0.40±0.05
0.115±0.05
Regarding cautions for use, please
refer to page 171.
High current connectors
2) With soldering terminals
Socket
Narrow pitch connectors
Narrow pitch connectors P4 (0.4mm pitch)
–89–
ACCTB57E 201602-T
Narrow pitch connectors P5KF (0.5mm pitch)
P5KF
Narrow pitch connectors
(0.5mm pitch)
Socket
m
3m
3.
m
8m
5.
High current connectors
Narrow pitch connectors
For board-to-board For board-to-FPC
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
Header
5. The lower connector bottom surface
construction prevents contact and
shorts between the PCB and metal
terminals.
Benefits include freedom in pattern
wiring, helping to make PCB’s smaller.
<Socket>
<Header>
Simple lock mechanism
RoHS compliant
Insulation area
Insulation area
Active optical connector
FPC/FFC connectors
Connector bottom:
Create any thru-hole and pattern wiring.
FEATURES
4. Effective mating length 0.55mm
In addition to achieving a low profile of
from 1.5mm between PCBs, the effective
mating length has been extended to
ensure that there is latitude for insertion.
1. Two-piece structure and 0.5mm
pitch.
The product lineup includes mated
heights of 1.5mm, 2.0mm and 2.5mm.
APPLICATIONS
• Digital devices, such as digital still
cameras and digital video cameras.
• Various wireless module units.
0.55mm
ORDERING INFORMATION
AXK
4
7
Y
G
5F: Narrow Pitch Connector P5KF (0.5 mm pitch) Socket
6F: Narrow Pitch Connector P5KF (0.5 mm pitch) Header
MID
Number of pins (2 digits)
Mated height
<Socket>
3: For mated height 1.5 mm
5: For mated height 2.0 mm and 2.5 mm
<Header>
3: For mated height 1.5 mm and 2.0 mm
5: For mated height 2.5 mm
Information
Functions
4: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Ni plating on base, Au plating on surface/Ni plating on base, Au plating on surface (for Ni barrier available)
Contact portion
<Socket> Y: V notch type product
<Header> Y: V notch type product
Packing
G: 2,000 pieces embossed tape and plastic reel × 2
–90–
ACCTB23E 201602-T
Narrow pitch connectors P5KF (0.5mm pitch)
2.5 mm
Outer carton
High current connectors
Packing
Inner carton (1-reel)
2,000 pieces
4,000 pieces
Notes: 1. Regarding ordering units, During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production.
–91–
FPC/FFC connectors
Header
AXK6F10347YG
AXK6F12347YG
AXK6F14347YG
AXK6F16347YG
AXK6F18347YG
AXK6F20347YG
AXK6F22347YG
AXK6F24347YG
AXK6F26347YG
AXK6F30347YG
AXK6F32347YG
AXK6F34347YG
AXK6F40347YG
AXK6F50347YG
AXK6F60347YG
AXK6F70347YG
AXK6F80347YG
AXK6F10347YG
AXK6F12347YG
AXK6F14347YG
AXK6F16347YG
AXK6F18347YG
AXK6F20347YG
AXK6F22347YG
AXK6F24347YG
AXK6F26347YG
AXK6F30347YG
AXK6F34347YG
AXK6F40347YG
AXK6F50347YG
AXK6F60347YG
AXK6F70347YG
AXK6F80347YG
AXK6F00347YG
AXK6F10547YG
AXK6F12547YG
AXK6F14547YG
AXK6F16547YG
AXK6F20547YG
AXK6F22547YG
AXK6F24547YG
AXK6F30547YG
AXK6F34547YG
AXK6F40547YG
AXK6F50547YG
AXK6F60547YG
AXK6F70547YG
AXK6F80547YG
AXK6F00547YG
Active optical connector
2.0 mm
10
12
14
16
18
20
22
24
26
30
32
34
40
50
60
70
80
10
12
14
16
18
20
22
24
26
30
34
40
50
60
70
80
100
10
12
14
16
20
22
24
30
34
40
50
60
70
80
100
Part No.
Socket
AXK5F10347YG
AXK5F12347YG
AXK5F14347YG
AXK5F16347YG
AXK5F18347YG
AXK5F20347YG
AXK5F22347YG
AXK5F24347YG
AXK5F26347YG
AXK5F30347YG
AXK5F32347YG
AXK5F34347YG
AXK5F40347YG
AXK5F50347YG
AXK5F60347YG
AXK5F70347YG
AXK5F80347YG
AXK5F10547YG
AXK5F12547YG
AXK5F14547YG
AXK5F16547YG
AXK5F18547YG
AXK5F20547YG
AXK5F22547YG
AXK5F24547YG
AXK5F26547YG
AXK5F30547YG
AXK5F34547YG
AXK5F40547YG
AXK5F50547YG
AXK5F60547YG
AXK5F70547YG
AXK5F80547YG
AXK5F00547YG
AXK5F10547YG
AXK5F12547YG
AXK5F14547YG
AXK5F16547YG
AXK5F20547YG
AXK5F22547YG
AXK5F24547YG
AXK5F30547YG
AXK5F34547YG
AXK5F40547YG
AXK5F50547YG
AXK5F60547YG
AXK5F70547YG
AXK5F80547YG
AXK5F00547YG
MID
1.5 mm
No. of pins
ACCTB23E 201602-T
Information
Mated height
Narrow pitch connectors
PRODUCT TYPES
Narrow pitch connectors P5KF (0.5mm pitch)
1. Characteristics
Item
Rated current
Rated voltage
Electrical
Dielectric strength
characteristics Insulation resistance
Specifications
0.5A/pin contact (Max. 10 A at total pin contacts)
60V AC/DC
150V AC for 1 minute
Detection current: 1mA
Min. 1,000MΩ (initial)
Using 500V DC megger
Contact resistance
Based on the contact resistance measurement method specified by
JIS C 5402.
Max. 90mΩ
Composite insertion force
Mechanical
Composite removal force
characteristics
Contact holding force
Max. 0.981N/pin contacts × pin contacts (initial)
Min. 0.0588N/pin contacts × pin contacts
Measuring the maximum force.
As the contact & post is axially pull out.
No icing or condensation.
Min. 0.981N/pin contact
Ambient temperature
–55°C to +85°C
Soldering heat resistance
Storage temperature
Conditions
Max. peak temperature of 260°C (on the surface
of the PC board around the connector terminals)
300°C within 5 seconds, 350°C within 3 seconds
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Environmental Thermal shock resistance
characteristics (header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Lifetime
Insertion and removal life
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C, humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C, saltwarter concentration 5%±1%
48 hours,
Bath temperature 40°C±2°C, gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
contact resistance max. 90mΩ
50 times
Repeated insertion and removal speed of max. 200 times/hours
Mated height 1.5mm, 20 pin contacts;
Socket: 0.06g
Header: 0.04g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact/Post
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
The section close to the soldering portion has a nickel barrier.
(The nickel base is exposed.)
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
SPECIFICATIONS
–92–
ACCTB23E 201602-T
Narrow pitch connectors P5KF (0.5mm pitch)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Narrow pitch connectors
DIMENSIONS (Unit: mm)
• Socket (Mated height: 1.5mm, 2.0mm, 2.5mm)
CAD Data
A
A
5.50
6.00
6.50
7.00
7.50
8.00
8.50
9.00
9.50
10.50
11.00
11.50
13.00
15.50
18.00
20.50
23.00
28.00
0.20±0.03
B
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
6.00
7.00
7.50
8.00
9.50
12.00
14.50
17.00
19.50
24.50
(0.80)
1.70
(Suction face) 4.80
4.20
5.80
(0.80)
0.12±0.03
General tolerance: ±0.2
Mated height
1.5 mm
2.0 mm, 2.5 mm
C
1.35
1.85
FPC/FFC connectors
No. of pins
10
12
14
16
18
20
22
24
26
30
32
34
40
50
60
70
80
100
0.10
C
High current connectors
0.50±0.05
Dimension table (mm)
B±0.1
0.50±0.05
Active optical connector
• Header (Mated height: 1.5mm, 2.0mm, 2.5mm)
CAD Data
A
0.10
C
1.80
MID
0.12±0.03
3.30
0.50±0.05
0.20±0.03
B
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
6.00
7.00
7.50
8.00
9.50
12.00
14.50
17.00
19.50
24.50
(Suction
face)
2.50
General tolerance: ±0.2
Mated height
1.5 mm, 2.0 mm
2.5 mm
C
1.25
1.75
• Socket and header are mated
Mated height: 1.5 mm
Mated height: 2.0 mm
2.00±0.15
1.50±0.15
–93–
Mated height: 2.5 mm
2.50±0.15
ACCTB23E 201602-T
Information
A
5.50
6.00
6.50
7.00
7.50
8.00
8.50
9.00
9.50
10.50
11.00
11.50
13.00
15.50
18.00
20.50
23.00
28.00
0.96
No. of pins
10
12
14
16
18
20
22
24
26
30
32
34
40
50
60
70
80
100
(0.75)
0.50±0.05
Dimension table (mm)
(0.75)
B±0.1
Narrow pitch connectors P5KF (0.5mm pitch)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
• Plastic reel dimensions (Conforming to EIAJ ET–7200B)
Tape II
A±0.3
Taping reel
D±1
A±0.3
C
Label
B
C
Pull out direction
4
2
12.0
1.5+0.1
0 dia.
Top cover tape
1.75
380 dia.
1.75
Pull out direction
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (unit: mm)
4
2
Embossed carrier tape
Embossed mounting-hole
12.0
1.5+0.1
0 dia.
FPC/FFC connectors
Dimension table (mm)
Suffix: G (1 reel, 2,000 pieces embossed tape: Plastic reel package)
Mated height
No. of pins
Type of taping
A
B
C
D
Quantity per reel
Socket and header are common:
1.5mm, 2.0mm, 2.5mm
10 to 58
60 to 70
72 to 100
Tape I
Tape II
Tape II
24.0
32.0
44.0
—
28.4
40.4
11.5
14.2
20.2
25.4
33.4
45.4
2,000 pcs.
2,000 pcs.
2,000 pcs.
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P5KF
Active optical connector
Direction of
tape progress
Socket
Header
Information
MID
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–94–
ACCTB23E 201602-T
Narrow pitch connectors P5KF (0.5mm pitch)
0.50±0.05
B±0.05
0.50±0.05
0.25±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
0.125±0.05
0.30±0.05
0.125±0.05
0.30±0.05
Metal mask thickness: When 150 μm
(Opening area ratio: 58%)
4.30±0.01
(0.85)
(0.85)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
(0.85)
(0.85)
5.10±0.01
6.80±0.01
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
2.60±0.01
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 56%)
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Opening area ratio: 69%)
Metal mask thickness: When 120 μm
(Opening area ratio: 72%)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
(1.05)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
(1.05)
4.30±0.01
2.20±0.01
Recommended metal mask pattern
(1.05)
* See the dimension table on page 93 for more information on the B dimension of the socket and header.
Regarding cautions for use, please
refer to page 171.
Please refer to the latest product
specifications when designing your
product.
–95–
ACCTB23E 201602-T
Information
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Recommended metal mask pattern
4.70±0.01
6.80±0.01
Max. 0.03mm
(1.05)
Max. 0.03mm
High current connectors
B±0.05
0.50±0.05
0.25±0.05
1.60±0.05
4.30±0.05
0.50±0.05
Recommended PC board pattern
(TOP VIEW)
FPC/FFC connectors
Recommended PC board pattern
(TOP VIEW)
Active optical connector
• Header
MID
• Socket
4.00±0.05
6.80±0.05
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
Narrow pitch connectors
NOTES
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
FEATURES
1. The product lineup consists of
3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm,
5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm,
7.0 mm, 8.0 mm, and 9.0 mm mated
heights.
• P5K
6m
m
Header
Type
P5K
Mated height
3 mm, 3.5 mm
P5KS
4 mm, 4.5 mm,
5 mm, 5.5 mm,
6 mm, 6.5 mm,
7 mm, 8 mm,
9 mm
5.
m
Socket
0m
FPC/FFC connectors
4.
Socket
• P5KS
m
4m
5.
Active optical connector
P5K/P5KS
Narrow pitch connectors
(0.5mm pitch)
m
8m
5.
High current connectors
Narrow pitch connectors
For board-to-board
Header
Note: The external appearance and PC board pattern
differs between the P5K and P5KS.
RoHS compliant
Type
P5K
P5KS
Suction face
Notes
The external
appearance and
PC board pattern
differs for the P5K
and P5KS.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. The effective mating length has
been extended to ensure that there for
insertion.
With long effective
mating lengths, even
if the connection is
not perfect, the
electrical connection
is more than enough
for normal operations.
Effective mating length
4. Automatic mounting
Suction area for automatic mounting
machines is employed.
P5K Header
P5K Socket
APPLICATIONS
• Digital devices, such as laptop,
digital still cameras and digital video
cameras
• OA equipment, industrial equipment
and measuring devices
Effective mating length
0.65 mm
1.0 mm
ORDERING INFORMATION
1. P5K (Mated height: 3.0 mm and 3.5 mm)
MID
AXK
7
Y
G
5: Narrow Pitch Connector P5K Socket
6: Narrow Pitch Connector P5K Header
Number of pins (2 digits)
Information
Mated height
<Socket>
1: For mated height 3.0 mm and 3.5 mm
<Header>
2: For mated height 3.5 mm
3: For mated height 3.0 mm
Functions
4: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
7: Ni plating on base, Au plating on surface /
Ni plating on base, Au plating on surface (Ni barrier product)
Contact portion
<Socket> Y: V notch type product
<Header> Y: V notch type product
Packing
G: 1,500 pieces embossed tape and plastic reel × 2
–96–
ACCTB22E 201602-T
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
AXK
7
Y
Narrow pitch connectors
2. P5KS (Mated height: 4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm, 7.0 mm, 8.0 mm and 9.0 mm)
G
5S: Narrow Pitch Connector P5KS Socket
6S: Narrow Pitch Connector P5KS Header
Number of pins (2 digits)
High current connectors
Mated height
<Socket>
0: For mated height 4.0 mm, 5.0 mm and 6.0 mm
2: For mated height 4.5 mm, 5.5 mm and 6.5 mm
3: For mated height 7.0 mm, 8.0 mm and 9.0 mm
<Header>
4: For mated height 4.0 mm, 4.5 mm and 7.0 mm
5: For mated height 5.0 mm, 5.5 mm and 8.0 mm
6: For mated height 6.0 mm, 6.5 mm and 9.0 mm
Functions
3: With positioning boss and direction for protection from reverse mating
4: Without positioning boss/with direction for protection from reverse mating
Contact portion
<Socket> Y: V notch type product
<Header> Y: V notch type product
Packing
G: 1,500 pieces embossed tape and plastic reel × 2
Socket: Mated heights 4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm
Header: Mated heights 4.0 mm, 4.5 mm, 7.0 mm
1,000 pieces plastic reel × 2
Socket: Mated heights 7.0 mm, 8.0 mm, 9.0 mm
Header: Mated heights 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm, 8.0 mm, 9.0 mm
PRODUCT TYPES
1. P5K
3.0 mm
P5K
3.5 mm
No. of pins
20
22
30
40
50
60
70
80
100
120
20
22
30
34
40
50
60
70
80
100
120
Part No.
Socket
AXK520147YG
AXK522147YG
AXK530147YG
AXK540147YG
AXK550147YG
AXK560147YG
AXK570147YG
AXK580147YG
AXK500147YG
AXK5A2147YG
AXK520147YG
AXK522147YG
AXK530147YG
AXK534147YG
AXK540147YG
AXK550147YG
AXK560147YG
AXK570147YG
AXK580147YG
AXK500147YG
AXK5A2147YG
Header
AXK620347YG
AXK622347YG
AXK630347YG
AXK640347YG
AXK650347YG
AXK660347YG
AXK670347YG
AXK680347YG
AXK600347YG
AXK6A2347YG
AXK620247YG
AXK622247YG
AXK630247YG
AXK634247YG
AXK640247YG
AXK650247YG
AXK660247YG
AXK670247YG
AXK680247YG
AXK600247YG
AXK6A2247YG
Packing
Inner carton (1 reel)
Outer carton
MID
Mated
height
1,500 pieces
3,000 pieces
Information
Product
name
Notes: 1. Regarding ordering units: During production: Please make orders in 1 reel units.
For samples, please contact our sales office.
2. The standard type comes without positioning bosses.
–97–
Active optical connector
FPC/FFC connectors
Surface treatment (Contact portion / Terminal portion)
7: Ni plating on base, Au plating on surface /
Ni plating on base, Au plating on surface (Ni barrier product)
ACCTB22E 201602-T
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
Product
name
Mated
height
4.0 mm
P5KS
4.5 mm
FPC/FFC connectors
High current connectors
Narrow pitch connectors
2. P5KS
Active optical connector
5.0 mm
5.5 mm
MID
P5KS
Information
6.0 mm
6.5 mm
P5KS
7.0 mm
No. of pins
Part No.
Packing
20
24
30
34
40
50
60
70
80
100
20
24
30
34
36
40
50
60
70
80
100
20
Socket
AXK5S20047YG
AXK5S24047YG
AXK5S30047YG
AXK5S34047YG
AXK5S40047YG
AXK5S50047YG
AXK5S60047YG
AXK5S70047YG
AXK5S80047YG
AXK5S00047YG
AXK5S20247YG
AXK5S24247YG
AXK5S30247YG
AXK5S34247YG
AXK5S36247YG
AXK5S40247YG
AXK5S50247YG
AXK5S60247YG
AXK5S70247YG
AXK5S80247YG
AXK5S00247YG
AXK5S20047YG
Header
AXK6S20447YG
AXK6S24447YG
AXK6S30447YG
AXK6S34447YG
AXK6S40447YG
AXK6S50447YG
AXK6S60447YG
AXK6S70447YG
AXK6S80447YG
AXK6S00447YG
AXK6S20447YG
AXK6S24447YG
AXK6S30447YG
AXK6S34447YG
AXK6S36447YG
AXK6S40447YG
AXK6S50447YG
AXK6S60447YG
AXK6S70447YG
AXK6S80447YG
AXK6S00447YG
AXK6S20547YG
24
30
34
40
50
60
70
80
100
20
24
30
34
40
50
60
70
80
100
20
30
40
50
60
70
80
100
20
30
40
50
60
70
80
100
20
AXK5S24047YG
AXK5S30047YG
AXK5S34047YG
AXK5S40047YG
AXK5S50047YG
AXK5S60047YG
AXK5S70047YG
AXK5S80047YG
AXK5S00047YG
AXK5S20247YG
AXK5S24247YG
AXK5S30247YG
AXK5S34247YG
AXK5S40247YG
AXK5S50247YG
AXK5S60247YG
AXK5S70247YG
AXK5S80247YG
AXK5S00247YG
AXK5S20047YG
AXK5S30047YG
AXK5S40047YG
AXK5S50047YG
AXK5S60047YG
AXK5S70047YG
AXK5S80047YG
AXK5S00047YG
AXK5S20247YG
AXK5S30247YG
AXK5S40247YG
AXK5S50247YG
AXK5S60247YG
AXK5S70247YG
AXK5S80247YG
AXK5S00247YG
AXK5S20347YG
AXK6S24547YG
AXK6S30547YG
AXK6S34547YG
AXK6S40547YG
AXK6S50547YG
AXK6S60547YG
AXK6S70547YG
AXK6S80547YG
AXK6S00547YG
AXK6S20547YG
AXK6S24547YG
AXK6S30547YG
AXK6S34547YG
AXK6S40547YG
AXK6S50547YG
AXK6S60547YG
AXK6S70547YG
AXK6S80547YG
AXK6S00547YG
AXK6S20647YG
AXK6S30647YG
AXK6S40647YG
AXK6S50647YG
AXK6S60647YG
AXK6S70647YG
AXK6S80647YG
AXK6S00647YG
AXK6S20647YG
AXK6S30647YG
AXK6S40647YG
AXK6S50647YG
AXK6S60647YG
AXK6S70647YG
AXK6S80647YG
AXK6S00647YG
AXK6S20447YG
30
40
50
60
70
80
100
AXK5S30347YG
AXK5S40347YG
AXK5S50347YG
AXK5S60347YG
AXK5S70347YG
AXK5S80347YG
AXK5S00347YG
AXK6S30447YG
AXK6S40447YG
AXK6S50447YG
AXK6S60447YG
AXK6S70447YG
AXK6S80447YG
AXK6S00447YG
–98–
Inner carton (1 reel)
Outer carton
1,500 pieces
3,000 pieces
Socket: 1,500 pieces
Header: 1,000 pieces
Socket: 3,000 pieces
Header: 2,000 pieces
Socket: 1,000 pieces
Header: 1,500 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
ACCTB22E 201602-T
9.0 mm
Packing
Header
AXK6S20547YG
AXK6S30547YG
AXK6S40547YG
AXK6S50547YG
AXK6S60547YG
AXK6S70547YG
AXK6S80547YG
AXK6S00547YG
AXK6S20647YG
AXK6S30647YG
AXK6S40647YG
AXK6S50647YG
AXK6S60647YG
AXK6S70647YG
AXK6S80647YG
AXK6S00647YG
Inner carton (1 reel)
Outer carton
1,000 pieces
2,000 pieces
High current connectors
P5KS
20
30
40
50
60
70
80
100
20
30
40
50
60
70
80
100
Part No.
Socket
AXK5S20347YG
AXK5S30347YG
AXK5S40347YG
AXK5S50347YG
AXK5S60347YG
AXK5S70347YG
AXK5S80347YG
AXK5S00347YG
AXK5S20347YG
AXK5S30347YG
AXK5S40347YG
AXK5S50347YG
AXK5S60347YG
AXK5S70347YG
AXK5S80347YG
AXK5S00347YG
Notes: 1. Regarding ordering units: During production: Please make orders in 1 reel units.
For samples, please contact our sales office.
2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production.
SPECIFICATIONS
1. Characteristics
Item
Rated current
Electrical
characteristics
Mechanical
characteristics
Specifications
4mm, 4.5mm, 5mm,
5.5mm, 6mm, 6.5mm type
3mm, 3.5mm type
0.5A/pin contact (Max.
10A at total pin contacts)
Rated voltage
Dielectric strength
Insulation resistance
Conditions
7mm, 8mm, 9mm type
0.5A/pin contact (Max. 16A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1000MΩ
Contact resistance
Max. 60mΩ
Max. 80mΩ
Composite insertion
force
Composite removal
force
Max. 0.785N/pin contact × pin contacts (initial)
Contact holding force
Min. 0.98N/pin contact
Ambient temperature
–55°C to +85°C
Max. peak temperature of 260°C
(on the surface of the PC board around the connector terminals)
300°C within 5 sec., 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Detection current: 1mA
Using 500V DC megger
Based on the contact resistance
measurement method specified
by JIS C 5402.
Min. 0.0588N/pin contact × pin contacts
Soldering heat
resistance
Storage temperature
Measuring the maximum force.
As the contact & post is axially
pull out.
No icing or condensation.
FPC/FFC connectors
8.0 mm
No. of pins
Active optical connector
Mated
height
Infrared reflow soldering
Soldering iron
No icing or condensation.
MID
Product
name
Narrow pitch connectors
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
Thermal shock
resistance (header
and socket mated)
5 cycles,
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 60mΩ
Environmental
characteristics
Humidity resistance
(header and socket
mated)
Saltwater spray
resistance (header
and socket mated)
Lifetime
characteristics
Unit weight
H2S resistance
(header and socket
mated)
Insertion and removal
life
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 60mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 60mΩ
48 hours,
contact resistance max. 60mΩ
insulation resistance
min. 100MΩ,
contact resistance
max. 80mΩ
120 hours, insulation resistance
min. 100MΩ,
contact resistance
max. 80mΩ
24 hours, insulation resistance
min. 100MΩ,
contact resistance
max. 80mΩ
48 hours,
50 times
contact resistance
max. 80mΩ
Order
1
2
3
4
Temperature
Time
(°C)
(minutes)
0
30
–55 −3
Max. 5
30
85 +30
Max. 5
0
–55 −3
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwarter concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal
speed of max. 200 times/hours
P5K h = 3mm 30 pin contacts Socket: 0.17g Header: 0.09g
P5KS h = 4mm 30 pin contacts Socket: 0.18g Header: 0.16g
–99–
ACCTB22E 201602-T
Information
Conformed to MIL-STD-202F,
method 107G
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
High current connectors
Narrow pitch connectors
2. Material and surface treatment
Mated height 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 8mm, 9mm
Material
Surface treatment
Heat-resistant resin (UL94V-0)
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
Copper alloy
The section close to the soldering portion has a nickel barrier.
(The nickel base is exposed.)
Part name
Molded portion
Contact/post
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
P5K: Mated height 3mm, 3.5mm type
• Socket
CAD Data
Terminal coplanarity
0.10
A
B±0.1
0.5±0.05
0.2±0.03
0.5±0.05
2.35
2.15
(0.9)
Active optical connector
FPC/FFC connectors
Dimension table (mm)
No. of pins
20
22
30
34
40
50
60
70
80
100
120
A
8.20
8.70
10.70
11.70
13.20
15.70
18.20
20.70
23.20
28.20
33.20
5 Suction
face 1.44
B
4.50
5.00
7.00
8.00
9.50
12.00
14.50
17.00
19.50
24.50
29.50
(0.9)
0.17±0.03
General tolerance: ±0.2
• Header
CAD Data
Terminal coplanarity
0.10
A
B±0.1
0.5±0.05
C
D
0.5±0.05
0.2±0.03
MID
Dimension table (mm)
Information
5.8
4
No. of pins
20
22
30
34
40
50
60
70
80
100
120
A
8.20
8.70
10.70
11.70
13.20
15.70
18.20
20.70
23.20
28.20
33.20
(1.4)
B
4.50
5.00
7.00
8.00
9.50
12.00
14.50
17.00
19.50
24.50
29.50
Suction 1.44
face
1.8
3.8
4.6
(1.4)
0.20±0.03
General tolerance: ±0.2
Mated height
3.0 mm
3.5 mm
C
2.40
2.90
D
0.85
1.35
• Socket and header are mated
A +0.2
–0.1
Mated height
3.0 mm
3.5 mm
A
3.00
3.50
Note: P5KS (mated heights 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 6.5mm, 7.0mm, 8.0mm, and 9.0mm) cannot be mated to this type.
–100–
ACCTB22E 201602-T
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
A
B±0.1
0.50±0.05
0.20±0.03
1.82
(Suction face)
Dimension table (mm)
No. of pins
20
24
30
34
36
40
50
60
70
80
100
A
8.20
9.20
10.70
11.70
12.20
13.20
15.70
18.20
20.70
23.20
28.20
C
(1.10)
5.4
4.6
B
4.50
5.50
7.00
8.00
8.50
9.50
12.00
14.50
17.00
19.50
24.50
3.20
(1.10)
0.15±0.03
General tolerance: ±0.2
Mated height
4.0 mm, 5.0 mm, 6.0 mm
4.5 mm, 5.5 mm, 6.5 mm
7.0 mm, 8.0 mm, 9.0 mm
C
3.05
3.55
6.05
CAD Data
Terminal coplanarity
0.10
C
B±0.1
A
2.8
B
4.50
5.50
7.00
8.00
8.50
9.50
12.00
14.50
17.00
19.50
24.50
0.20±0.03
General tolerance: ±0.2
(1.1)
A
8.20
9.20
10.70
11.70
12.20
13.20
15.70
18.20
20.70
23.20
28.20
1.72
(Suction face)
4.2
Dimension table (mm)
5.0
C
(1.1)
D
9
0.50±0.05
0.20±0.03
0.
0.50±0.05
No. of pins
20
24
30
34
36
40
50
60
70
80
100
FPC/FFC connectors
• Header
High current connectors
0.50±0.05
Terminal coplanarity
0.10
Mated height
4.0 mm, 4.5 mm, 7.0 mm
5.0 mm, 5.5 mm, 8.0 mm
6.0 mm, 6.5 mm, 9.0 mm
C
0.95
1.95
2.95
D
3.30
4.30
5.30
Active optical connector
CAD Data
Narrow pitch connectors
P5KS: Mated height 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 6.5mm, 7.0mm, 8.0mm, 9.0mm type
• Socket
• Socket and header are mated
Note: P5K (mated heights 3.0mm, 3.5mm) cannot be
mated to this type.
MID
A
4.00
4.50
5.00
5.50
6.00
6.50
7.00
8.00
9.00
Information
A +0.2
–0.1
Mated height
4.0 mm
4.5 mm
5.0 mm
5.5 mm
6.0 mm
6.5 mm
7.0 mm
8.0 mm
9.0 mm
–101–
ACCTB22E 201602-T
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
• Plastic reel dimensions (Conforming to EIAJ ET–7200B)
Taping reel
D±1
A±0.3
C
Label
B
1.75
C
4
2
Pull out direction
4
2
12.0
Top cover tape
380 dia.
1.75
Pull out direction
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (unit: mm)
Embossed carrier tape
Embossed mounting-hole
12.0
1.5+0.1
0 dia.
1.5+0.1
0 dia.
FPC/FFC connectors
Dimension table (mm)
Suffix: G (1 reel, 1,500 pieces or 1,000 pieces embossed tape and plastic reel package)
Type
P5K
Mated height
No. of pins
Type of taping
A
B
C
D
Quantity per reel
Socket and header are common
3.0mm, 3.5mm
20 to 50
60 to 70
80 to 100
120
Tape I
Tape II
Tape II
Tape II
24.0
32.0
44.0
56.0
—
28.4
40.4
52.4
11.5
14.2
20.2
26.2
25.4
33.4
45.4
57.4
1,500 pcs.
20 to 50
60 to 70
80 to 100
20 to 50
60 to 70
80 to 100
Tape I
Tape II
Tape II
Tape I
Tape II
Tape II
24.0
32.0
44.0
24.0
32.0
44.0
—
28.4
40.4
—
28.4
40.4
11.5
14.2
20.2
11.5
14.2
20.2
25.4
33.4
45.4
25.4
33.4
45.4
Socket: 4.0mm, 4.5mm, 5.0mm,
5.5mm, 6.0mm, 6.5mm
Header: 4.0mm, 4.5mm, 7.0mm
Active optical connector
P5KS
Socket: 7.0mm, 8.0mm, 9.0mm
Header: 5.0mm, 5.5mm, 6.0mm,
6.5mm, 8.0mm, 9.0mm
1,500 pcs.
1,000 pcs.
Connector orientation with respect to direction of progress of embossed tape
Type
P5K
Direction
of tape progress
P5KS
Socket
Socket
This corner is oriented on the C side.
This corner is oriented on the C side.
Header
MID
Header
This corner is oriented on the C side.
Information
This corner is oriented on the C side.
–102–
ACCTB22E 201602-T
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
Recommended PC board pattern
(TOP VIEW)
B±0.05
0.50±0.05
0.50±0.05
0.25±0.05
0.125±0.05
0.75±0.05
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 56%)
Metal mask thickness: When 150 μm
(Opening area ratio: 62%)
2.50±0.01
5.60±0.01
(1.55)
6.80±0.01
4.60±0.01
(1.10)
Chamfered corner
0.115±0.01
0.35±0.01
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Opening area ratio: 69%)
Metal mask thickness: When 120 μm
(Opening area ratio: 78%)
0.115±0.01
0.35±0.01
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
6.80±0.01
(1.35)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
5.60±0.01
0.115±0.01
0.35±0.01
(1.35)
0.115±0.01
0.35±0.01
* See the dimension table on page 100 for more information on the B dimension of the socket and header.
Information
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
(1.10)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
(1.55)
Recommended metal mask pattern
4.10±0.01
Mating state
Active optical connector
0.125±0.05
0.75±0.05
1.70±0.01
Chamfered corner
(1.95)
Chamfered corner
Chamfered corner
1.00±0.05
3.20±0.05
Chamfered corner
6.80±0.05
Outline (top view)
5.60±0.05
B±0.05
0.50±0.05
0.50±0.05
0.25±0.05
High current connectors
Recommended PC board pattern
(TOP VIEW)
FPC/FFC connectors
• P5K Header
MID
• P5K Socket
(1.95)
1. Prevention of reverse mating
The socket and header are protected
from reverse mating by a molded resin
key. Excessive mating force may damage
the key, so be sure to match chamfered
corners when mating.
Narrow pitch connectors
NOTES
–103–
ACCTB22E 201602-T
P5KS: Mated height 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 6.5mm, 7.0mm, 8.0mm, 9.0mm type
• Socket
Recommended PC board pattern
(TOP VIEW)
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 60%)
Metal mask thickness: When 120 μm
(Opening area ratio: 76%)
B±0.05
0.75±0.05
(1.65)
(1.30)
6.40±0.05
0.115±0.01
0.35±0.01
0.125±0.05
6.40±0.01
(1.30)
0.50±0.01
0.23±0.01
3.80±0.01
6.40±0.01
0.23±0.01
2.40±0.05
0.25±0.05
B±0.01
0.50±0.01
0.50±0.01
(1.65)
B±0.01
0.50±0.01
3.10±0.01
0.50±0.05
0.50±0.05
High current connectors
Narrow pitch connectors
Narrow pitch connectors P5K/P5KS (0.5mm pitch)
0.115±0.01
0.35±0.01
* See the dimension table on page 101 for more information on the B dimension.
• Header
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 69%)
Metal mask thickness: When 120 μm
(Opening area ratio: 87%)
B±0.05
0.115±0.01
0.35±0.01
6.00±0.01
(1.90)
Active optical connector
0.125±0.05
0.75±0.05
0.50±0.01
6.00±0.01
0.23±0.01
2.20±0.01
0.23±0.01
(1.90)
0.50±0.01
6.00±0.05
0.25±0.05
B±0.01
B±0.01
0.50±0.01
0.50±0.01
(1.50)
0.50±0.05
(1.50)
3.00±0.01
0.50±0.05
2.00±0.05
FPC/FFC connectors
Recommended PC board pattern
(TOP VIEW)
0.115±0.01
0.35±0.01
* See the dimension table on page 101 for more information on the B dimension.
Regarding cautions for use, please
refer to page 171.
Information
MID
Please refer to the latest product
specifications when designing your
product.
–104–
ACCTB22E 201602-T
A35US
With Power Terminal
4. Power terminal type means power line is ensured without
having to use signal line. Contributes to space savings
New
High current connectors
Power terminals
Specification:
3 A in two locations
2.2
mm
Socket
2.
m
1.8
mm
2m
1.
Socket
8m
m
Header
Header
Example; Charging current: Max. 3.0 A (0.3 A/pin, Pitch: 0.35 mm)
Product without
power terminals
RoHS compliant
20 pins signal
terminals used
With power
terminal
3.5mm
3 A power terminals
20 pins signal
terminals can
be reduced.
–3.5mm
FEATURES
1. 0.6 mm Mated Height with 2.2 mm width.
2. Supports 3A power terminals
3. “
” structure provides a slim and
low-profile design resistant to various environmental
conditions.
APPLICATIONS
Multiple connection of power signal between USB and
battery in portable terminals such as smartphones and
tablet PCs
Active optical connector
High Current Connectors
FPC/FFC connectors
For board-to-FPC
Narrow pitch connectors
High current connectors A35US with power terminal (0.35mm pitch)
ORDERING INFORMATION
0
J
MID
AXG
7: Socket
8: Header
Number of pins (2 digits)
Mated height
<Socket>/<Header>
0: 0.6 mm
Information
Functions
J: 3A type Power terminal
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
–105–
ACCTB78E 201602-T
High current connectors A35US with power terminal (0.35mm pitch)
High current connectors
Narrow pitch connectors
PRODUCT TYPES
Mated height
Number of pins
0.6mm
10
12
16
20
24
30
34
40
44
50
60
Part number
Socket
AXG7100J7
AXG7120J7
AXG7160J7
AXG7200J7
AXG7240J7
AXG7300J7
AXG7340J7
AXG7400J7
AXG7440J7
AXG7500J7
AXG7600J7
Packing
Header
AXG8100J4
AXG8120J4
AXG8160J4
AXG8200J4
AXG8240J4
AXG8300J4
AXG8340J4
AXG8400J4
AXG8440J4
AXG8500J4
AXG8600J4
Inner carton (1-reel)
Outer carton
10,000 pieces
20,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
FPC/FFC connectors
1. Characteristics
Item
Rated voltage
Specifications
3.0A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 5 A at total
pin contacts
60V AC/DC
Dielectric strength
150V AC for 1 min.
Rated current
Electrical
characteristics
Insulation resistance
Active optical connector
Contact resistance
Mechanical
characteristics
Composite insertion force
Composite removal force
Contact holding force
(Socket signal terminal,
Header power terminal)
Ambient temperature
Storage temperature
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Min. 1,000MΩ (initial)
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
1.300N/pin contacts × pin contacts
0.165N/pin contacts × pin contacts
Based on the contact resistance measurement method
specified by JIS C 5402.
Min. 0.20N/pin contacts
Measuring the maximum force.
As the contact is axially pull out.
–55°C to +85°C
No icing or condensation.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(header and socket mated)
MID
Environmental
characteristics
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Information
Conditions
Lifetime
characteristics
Insertion and removal life
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
48 hours,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
30 times
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically
Unit weight
60 pin contacts: Socket 0.02g Header 0.01g
Infrared reflow soldering: Peak temperature: 260°C or less
(on the surface of the PC board
around the connector terminals)
Soldering iron: 300°C within 5 sec.
350°C within 3 sec.
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Power terminals: Sockets: Base: Ni plating, Surface: Au plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating
–106–
ACCTB78E 201602-T
High current connectors A35US with power terminal (0.35mm pitch)
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Narrow pitch connectors
The CAD data of the products with a
Socket (Mated height: 0.6 mm)
The degree of terminal flat
A
B±0.1
0.35±0.05
0.12±0.03
0.59
Power terminal
Signal terminal
(0.68)
0.66
Z (Note)
0.30±0.03
C±0.1
Number of pins/
dimension
10
A
B
C
4.25
1.40
3.45
12
16
20
24
30
34
40
44
50
60
4.60
5.30
6.00
6.70
7.75
8.45
9.50
10.20
11.25
13.00
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
10.15
3.80
4.50
5.20
5.90
6.95
7.65
8.70
9.40
10.45
12.20
B
C
FPC/FFC connectors
2.20
Dimension table (mm)
2.20
Y (Note)
0.08
(Contact and Power terminal)
1.96
0.60 (Suction face)
CAD Data
High current connectors
DIMENSIONS (Unit: mm)
General tolerance: ±0.2
Note: Since power terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 0.6 mm)
0.08
(Post and Power terminal)
1.42
0.08±0.03
C±0.1
0.48
0.32
0.28
(Power terminal)
Signal terminal
Power terminal
Dimension table (mm)
Number of pins/
dimension
10
3.55
1.40
3.17
12
16
20
24
30
34
40
44
50
60
3.90
4.60
5.30
6.00
7.05
7.75
8.80
9.50
10.55
12.30
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
10.15
3.52
4.22
4.92
5.62
6.67
7.37
8.42
9.12
10.17
11.92
A
Active optical connector
0.46
MID
The degree of terminal flat
A
B±0.1
0.35±0.05
0.12±0.03
1.80
0.80 (Suction face)
CAD Data
General tolerance: ±0.2
0.60±0.1
Header
Information
Socket and Header are mated
Socket
–107–
ACCTB78E 201602-T
High current connectors A35US with power terminal (0.35mm pitch)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(A +0.3
−0.1 )
(C±1)
Label
380 dia.
Top cover tape
(4.0)
Leading direction after packaging
(B)
(1.75)
Embossed carrier tape
(2.0)
Embossed mounting-hole
4.0
Taping reel
.1
+0 0
5
1.
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
a.
di
FPC/FFC connectors
• Dimension table (Unit: mm)
Socket
Header
Number of pins
Max. 30
34 to 60
Type of taping
Tape I
Tape I
A
16.0
24.0
B
7.5
11.5
C
17.4
25.4
Quantity per reel
10,000
10,000
Number of pins
Max. 34
40 to 60
Type of taping
Tape I
Tape I
A
16.0
24.0
B
7.5
11.5
C
17.4
25.4
Quantity per reel
10,000
10,000
• Connector orientation with respect to embossed tape feeding direction
Common for A35US with power terminal
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Information
MID
Active optical connector
Type
Direction
of tape progress
–108–
ACCTB78E 201602-T
High current connectors A35US with power terminal (0.35mm pitch)
(0.39)
0.20±0.01
0.885±0.01
Regarding cautions for use, please
refer to page 171.
Information
MID
Please refer to the latest product
specifications when designing your
product.
FPC/FFC connectors
1.42±0.01
(0.39)
(0.39)
0.35±0.01
0.18±0.01
Active optical connector
0.60±0.01
1.325±0.01
1.48±0.01
15
0.
C
8×
0.35±0.01
0.18±0.01
0.70±0.01
Metal mask thickness: When 100μm
(Signal terminal opening ratio: 70%)
(Power terminal opening ratio: 77%)
(0.39)
1.82±0.01
2.60±0.01
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
2.50±0.01
1.80±0.01
(0.35)
Recommended metal mask pattern
High current connectors
: Insulatin
area
0.26±0.03
1.045±0.03
: Insulatin
area
(0.50)
0.90±0.03
1.20±0.03
2.20±0.03
0.35±0.03
0.20±0.03
2.20±0.01
0.60±0.03
1.325±0.03
1.48±0.03
15
0.
×C
0.35±0.03
0.20±0.03
0.70±0.03
Recommended PC board pattern (TOP VIEW)
(0.50)
0.20±0.03
1.60±0.03
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
2.50±0.03
1.04±0.03
(0.73)
• Socket (Mated height: 0.6 mm)
12
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Narrow pitch connectors
NOTES
–109–
ACCTB78E 201602-T
High current connectors A35P (0.35mm pitch)
• Rated current
Number of power
contacts
Max. 4 pins
Max. 8 pins
New
Rated current
Signal contact
Total
0.5 A/pin
Max. 12 A
3. Increased design freedom (pin layout and multiple high
current lines)
Any pin contact can be used as a power contact.
Any layout is possible for the power supply line.
m
Socket
0m
2.
m
5m
FPC/FFC connectors
Power contact
1.5 A/pin
1.25 A/pin
Number of power contacts: 1.5 A/pin x 4 pins or 1.25 A/pin x 8 pins can be used
Header
Sample layout
RoHS compliant
1.5A
1.5A
FEATURES
1. High current rating 5 A (using 1.25 A/pin × 8 pins)
2. Support of high current means number of pins can be
reduced and design with space saving requirements.
• Reduced space with decrease in number of pins used for
power contacts.
Example: Power line Max. 3 A (Pitch: 0.35 mm)
Active optical connector
A35P
High Current Connectors
2.
High current connectors
Narrow pitch connectors
For board-to-FPC
Previous
product
Required number of pins
3 A: 0.25 A/pin × 24 pins
3A
(12 pins)
A35P
3A
(2 pins)
Max. 0.25 A/pin
MID
4. Terminal pitch: 0.35 mm, width: 2.5 mm and Mated height:
0.8 mm
• Connections between PC boards where there is a
tendency for increased number of pins with the increase in
charging current.
• Connection section of all modules where power
consumption increases.
Max. 0.5 A/pin
Space
reduction
3A
(2 pins)
1.5A
APPLICATIONS
Max. 0.25 A/pin
3A
(12 pins)
1.5A
* For 1.5 A/pin power contact
Other pin contacts can be up to max. 0.5 A
(total of pin is max. 12 A).
Required number of pins
3 A: 1.5 A/pin × 4 pins
Max. 0.5 A/pin
ORDERING INFORMATION
AXF
1
2
Information
5A: Socket
6A: Header
Number of pins (2 digits)
Mated height
<Socket> / <Header>
1: 0.8 mm
Functions
2: Without positioning bosses
–110–
ACCTB81E 201602-T
High current connectors A35P (0.35mm pitch)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Item
Rated voltage
Specifications
1.5 A/pin contact × 4 pin contacts or
1.25 A/pin contact × 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
30V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 30mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.165N/pin contact × pin contacts
Rated current
Electrical
characteristics
Mechanical
characteristics
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of
1 mA when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.20N/pin contact
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 30mΩ
Insertion and removal life
30 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
60 pin contact Socket 0.03 g Header 0.02 g
–111–
High current connectors
Inner carton (1-reel)
FPC/FFC connectors
Packing
Header
AXF6A1012
AXF6A1212
AXF6A1612
AXF6A2012
AXF6A2412
AXF6A3012
AXF6A3412
AXF6A4012
AXF6A4412
AXF6A5012
AXF6A5412
AXF6A6012
AXF6A6412
AXF6A7012
AXF6A8012
AXF6A0012
Active optical connector
0.8mm
10
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
Part number
Socket
AXF5A1012
AXF5A1212
AXF5A1612
AXF5A2012
AXF5A2412
AXF5A3012
AXF5A3412
AXF5A4012
AXF5A4412
AXF5A5012
AXF5A5412
AXF5A6012
AXF5A6412
AXF5A7012
AXF5A8012
AXF5A0012
MID
Number of pins
ACCTB81E 201602-T
Information
Mated height
Narrow pitch connectors
PRODUCT TYPES
High current connectors A35P (0.35mm pitch)
Narrow pitch connectors
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Copper alloy
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
0.70 (Suction face)
CAD Data
Terminal coplanarity
A
0.77
B±0.1
(Contact and soldering terminals)
2.50
0.12±0.03
(0.90)
2.50
Y note
1.06
Z note
0.30±0.03
C±0.1
General tolerance: ±0.2
Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected.
Dimension table (mm)
Number of pins/
dimension
10
4.10
1.40
3.00
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
4.45
5.15
5.85
6.55
7.60
8.30
9.35
10.05
11.10
11.80
12.85
13.55
14.60
16.35
19.85
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
10.85
11.90
13.65
17.15
3.35
4.05
4.75
5.45
6.50
7.20
8.25
8.95
10.00
10.70
11.75
12.45
13.50
15.25
18.75
A
B
C
Header (Mated height: 0.8 mm)
CAD Data
0.70 (Suction face)
Terminal coplanarity
0.65
A
B±0.1
0.08
(Post and soldering terminals)
0.35±0.05
0.12±0.03
2.00
Dimension table (mm)
0.84
0.12±0.03
(0.31)
Information
1.46
Soldering terminals
Soldering terminals
MID
1.42
Active optical connector
0.08
0.35±0.05
2.20
FPC/FFC connectors
High current connectors
Socket (Mated height: 0.8 mm)
C±0.1
General tolerance: ±0.2
Number of pins/
dimension
10
A
B
C
3.40
1.40
2.80
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
3.75
4.45
5.15
5.85
6.90
7.60
8.65
9.35
10.40
11.10
12.15
12.85
13.90
15.65
19.15
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
10.85
11.90
13.65
17.15
3.15
3.85
4.55
5.25
6.30
7.00
8.05
8.75
9.80
10.50
11.55
12.25
13.30
15.05
18.55
Header
0.80±0.1
• Socket and Header are mated
Socket
–112–
ACCTB81E 201602-T
High current connectors A35P (0.35mm pitch)
(D±1)
Label
Top cover tape
Embossed mounting-hole
8.0
8.0
Taping reel
1.
1.
5 +0
5 +0
0 .1
0 .1
di
di
a.
a.
• Dimension table (Unit: mm)
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for sockets and headers
0.8mm
10 to 24
30 to 80
100
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
5,000
5,000
5,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for A35P
Direction
of tape progress
Socket
Header
Information
MID
Note: There is no indication on this product regarding top-bottom or left-right orientation.
High current connectors
Embossed carrier tape
(2.0)
(4.0)
(C)
(1.75)
(2.0)
Leading direction after packaging
(C)
(1.75)
FPC/FFC connectors
(A±0.3)
(B)
380 dia.
Tape II
(A +0.3
−0.1 )
(4.0)
Tape I
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Active optical connector
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
–113–
ACCTB81E 201602-T
High current connectors A35P (0.35mm pitch)
• Header (Mated height: 0.8 mm)
2.40±0.03
(0.65)
1.10±0.03
0.35±0.03
0.20±0.03
(0.53)
0.60±0.03
Recommended PC board pattern (TOP VIEW)
1.66±0.03
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
0.45±0.03
0.70±0.03
• Socket (Mated height: 0.8 mm)
Recommended metal mask pattern
2.40±0.01
(0.61)
0.18±0.01
1.18±0.01
0.35±0.01
(0.53)
1.66±0.01
0.60±0.01
Metal mask thickness: When 100μm
(Terminal opening ratio: 84%)
(Metal-part opening ratio: 100%)
1.90±0.03
(0.50)
0.35±0.03
0.20±0.03
0.20±0.03
1.06±0.03
(0.92)
Recommended PC board pattern (TOP VIEW)
2.90±0.03
High current connectors
Narrow pitch connectors
NOTES
C
FPC/FFC connectors
: insulation
area
0.45±0.01
0.70±0.01
Recommended metal mask pattern
2.90±0.01
(0.47)
0.18±0.01
1.96±0.01
1.92±0.01
(0.49)
0.35±0.01
Regarding cautions for use, please refer to page 171.
Please refer to the latest product specifications when
designing your product.
30
0.
0.90±0.01
1.35±0.01
Information
MID
2.90±0.01
Metal mask thickness: When 100μm
(Terminal opening ratio: 85%)
(Metal-part opening ratio: 50%)
C
Active optical connector
30
0.
0.90±0.03
1.35±0.03
–114–
ACCTB81E 201602-T
High Current Connectors
B01
FEATURES
3. High removal force.
4. Helps make mobile devices thinner
thanks to its low profile height of
0.6 mm/0.8 mm.
1. High current rating: 6 A
(3 A/pin × 2 pins)
New
6A
6A
3A
3A
APPLICATIONS
Battery section of miniature mobile
devices such as smartphones,
wearable terminals and tablet PCs
1.8
0m
0m
m
Socket
m
Header
3A
3A
2. Miniature design provides spacesaving benefits.
RoHS compliant
FPC/FFC connectors
2.4
High current connectors
For board-to-FPC
Narrow pitch connectors
High current connectors B01
Socket
m
5m
4.4
2.4
0m
Active optical connector
m
Header
m
6m
3.7
1.8
0m
m
ORDERING INFORMATION
6
5
0
0
MID
AXF
3: Socket
4: Header
Number of contacts (1 digit)
6: 6 contacts (Power contact and signal contact)
Information
Stacking height
<Socket>/<Header>
1: 0.6 mm
3: 0.8 mm
Current capacity
5: 3.0 A/Power pin
Function
0: No polarity
–115–
ACCTB71E 201602-T
High current connectors B01
Narrow pitch connectors
PRODUCT TYPES
Stacking height
Number of contacts
0.6mm
0.8mm
6
6
Part number
Socket
AXF361500
AXF363500
Packing
Header
AXF461500
AXF463500
Inner carton (1-reel)
15,000 pieces
15,000 pieces
Outer carton
30,000 pieces
30,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
High current connectors
SPECIFICATIONS
1. Characteristics
Item
Specifications
Rated voltage
Insulation resistance
3.0 A/pin contact (Power terminal)
0.3 A/pin contact (Signal terminal)
30V AC/DC
Min. 1,000MΩ (Initial stage)
Dielectric strength
150V AC for 1 minute
Rated current
Electrical
characteristics
Active optical connector
FPC/FFC connectors
Contact resistance
Mechanical
characteristics
Composite insertion force
Composite removal force
Ambient temperature
Storage temperature
MID
Using 250V DC megger (applied for 1 minute)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
According to the contact resistance measurement method of
JIS C 5402
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Max. 40 N
Min. 10 N (H: 0.6, Initial stage)
–55°C to +85°C
No icing or condensation.
–55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(Header and socket mated)
Environmental
characteristics
Humidity resistance
(Header and socket mated)
Salt water spray resistance
(Header and socket mated)
H2S resistance
(Header and socket mated)
Lifetime
characteristics
Insertion and removal life
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
After 48 hours
Contact resistance
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7 N
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
Humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
Salt water concentration 5%±1%
Conformed to JEIDA-38-1984
Bath temperature 40°C±2°C,
Gas concentration 3 ppm ±1 ppm,
Humidity 75% to 80% R.H.
Repeated insertion and removal cycles of max. 200 times/
hour
Infrared reflow soldering: Max. peak temperature of 260°C
(PC board surface temperature near connector terminals)
Soldering iron:
300°C within 5 sec.
350°C within 3 sec.
6 pin contact Socket h = 0.6 mm: 0.010 g h = 0.8 mm: 0.013 g
Header h = 0.6 mm: 0.004 g h = 0.8 mm: 0.005 g
The initial specification must be satisfied electrically
and mechanically
Soldering heat resistance
Unit weight
Information
Conditions
2. Material and surface treatment
Part name
Material
Surface treatment
Molded portion
Heat resistant plastic (LCP resin)
(UL94V-0)
—
Contact and Post
Copper alloy
Contact portion (Main): Au plating (Min. 0.1μm) over nickel
Contact portion (Sub): Au plating (Min. 0. 05μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
–116–
ACCTB71E 201602-T
High current connectors B01
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Narrow pitch connectors
DIMENSIONS (Unit: mm)
Socket (Mated height: 0.6 mm and 0.8 mm)
CAD Data
0.50 (Suction face)
A
B±0.1
0.14±0.03
0.58±0.03
The degree of terminal flat
E
0.08
High current connectors
2.16
(Contact and soldering terminals)
C±0.1
D±0.1
Z (Note 1)
Signal contact (2 pins)
Mated height/
dimension
0.6mm
0.59
0.8mm
0.79
E
Dimension table (mm)
Number of pins/
dimension
6
A
B
C
D
4.45
1.60
3.85
3.12
A
B
C
3.76
1.60
3.26
FPC/FFC connectors
0.86
2.40
0.18±0.03
0.20±0.03
Y (Note 1)
Power contact (4 pins)
General tolerance: ±0.2
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Header (Mated height: 0.6 mm and 0.8 mm)
A
B±0.1
0.14±0.03
0.70±0.03
Active optical connector
0.70 (Suction face)
CAD Data
The degree of terminal flat
D
0.08
1.80
(Post and soldering terminals)
Signal contact (2 pins)
Power contact (4 pins)
Mated height/
dimension
0.6mm
0.47
0.8mm
0.65
D
Dimension table (mm)
Number of pins/
dimension
6
MID
(0.34)
0.88
1.51
(Soldering
terminal)
C±0.1
0.20±0.03
General tolerance: ±0.2
Socket
Information
Header
0.80±0.1
Header
0.60±0.1
Socket and Header are mated
Socket
–117–
ACCTB71E 201602-T
High current connectors B01
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(A +0.3
−0.1 )
(C±1)
Label
Top cover tape
380 dia.
(4.0)
Leading direction after packaging
(B)
(1.75)
Embossed carrier tape
(2.0)
Embossed mounting-hole
Taping reel
4.0
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
1.
5
+0
0 .1
di
a.
FPC/FFC connectors
• Dimension table (Unit: mm)
Type/Mated height
Common for socket and headers
0.6mm and 0.8mm
Number of pins
Type of taping
A
B
C
Quantity per reel
6
Tape I
16.0
7.5
17.4
15,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for B01
Direction
of tape progress
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Information
MID
Active optical connector
Socket
–118–
ACCTB71E 201602-T
High current connectors B01
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
• Header (Mated height: 0.6 mm and 0.8 mm)
Recommended PC board pattern (TOP VIEW)
3.30±0.03
1.60±0.03
2.20±0.03
: Insulation area
: Insulation area
0.80±0.03
1.08±0.03
2.80±0.03
1.71±0.03
0.74±0.03
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Power contact opening ratio: 88%)
(Signal contact opening ratio: 83%)
(Metal-part opening ratio: 100%)
Metal mask thickness: When 100μm
(Power contact opening ratio: 73%)
(Signal contact opening ratio: 75%)
(Metal-part opening ratio: 100%)
2.20±0.03
Active optical connector
1.80±0.03
1.80±0.03
0.20±0.03
0.76±0.03
1.28±0.03
1.36±0.03
0.32±0.03
2.80±0.03
2.80±0.03
1.70±0.03
Regarding cautions for use, please
refer to page 171.
Please refer to the latest product
specifications when designing your
product.
Information
0.70±0.03
3.30±0.03
1.60±0.03
0.20±0.03
0.64±0.03
1.71±0.03
0.74±0.03
3.56±0.03
1.60±0.03
MID
0.20±0.03
0.22±0.03
0.78±0.03
0.32±0.03
1.70±0.03
2.80±0.03
1.70±0.03
0.70±0.03
0.22±0.03
0.66±0.03
0.20±0.03
3.56±0.03
1.60±0.03
Recommended PC board pattern (TOP VIEW)
FPC/FFC connectors
• Socket (Mated height: 0.6 mm and 0.8 mm)
High current connectors
Narrow pitch connectors
NOTES
–119–
ACCTB71E 201602-T
High current connectors L2
Narrow pitch connectors
For Wire connection type
High Current Connectors
L2
FEATURES
High current connectors
1. Easy connecting with vertical
mating structure a click feed back.
The structure design prevents loose
mating and makes it easy to visually
check the mating.
Lock part
Single wire
(Part of contact step) (Core)
3. More design ability of your board by
small, low profile, and 1 pin connection.
4. The high capacity 3 A, 250 V allows
the connector to serve a wide variety
of connection purposes.
5. Dedicated mating jig available.
APPLICATIONS
RoHS compliant
FPC/FFC connectors
Mating set position
Mating complete
When the wire goes through the lock part, click feedback is given,
and the structure design prevents loose mating.
2. Original terminal shape provides
strong pull strength and less concern
on half mating.
• Wire connection for power supply
and between PC boards connection of
LED light bulbs, LED down-light and
line lighting, etc.
• Power supply connection in the
devices
Active optical connector
Securing of the wire in the direction of
tension is possible by edge contact.
Single wire
(AWG#24)
ORDERING INFORMATION
AYL 2
1
1
0
0
MID
2: L2
Product type
1: Receptacle
9: Mating jig
Wire type
1: Solid wire
Information
Wire range
1: #24
–120–
ACCTB59E 201602-T
High current connectors L2
Product height
Part No.
1.35mm
AYL211100
Packing
Inner carton (1-reel)
12,000 pieces
Outer carton
24,000 pieces
Note: Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
■ Mating jig
Part
Part No.
Mating jig
AYL291100
Packing
Outer carton (Individual packaging)
10 pieces
Note: Order unit:
For volume production: Outer carton (10 pieces) units
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Specifications
Max. 30N (Initial)
Wire retention force (Vertically) Min. 4N (Initial)
Wire retention force (Axial)
Min. 5N (Initial)
Insertion and removal life
3 times (Containing initial mating)
Use a new wire.
Must be inserted and removed by the designated method.
Ambient temperature
(Operating temperature)
–40°C to +115°C
No icing or condensation.
Storage temperature
–40°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(Receptacle and wire mated)
200 cycles,
contact resistance max. 45mΩ
Humidity resistance
(Receptacle and wire mated)
500 hours,
contact resistance max. 45mΩ
Saltwater spray resistance
(Receptacle and wire mated)
24 hours,
contact resistance max. 45mΩ
H2S resistance
(Receptacle and wire mated)
48 hours,
contact resistance max. 45mΩ
Order Temperature (°C)
1
–40 −30
2
3
115 +30
4
–40 −30
Environmental
characteristics
Soldering temperature resistance (Receptacle)
Solder paste thickness
The initial specification must be satisfied electrically
and mechanically
The initial specification must be satisfied electrically
and mechanically
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 85°C±2°C,
humidity 80% to 85% R.H.
IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Reflow soldering: Max. peak temperature of 260°C
(PC board surface temperature near the receptacle)
Recommendation t = 0.12 mm
2. Material and plating
1) Receptacle
Part
Contact
Material
Copper alloy
Color
—
Plating
Sn plating over Ni
Material
Polycarbonate resin
Color
Transparence
Plating
—
Wire range
Number of conductors/Diameter of conductor
(Number of conductors/mm)
Diameter of insulation (mm)
Wire core
AWG #24
1/0.511±0.010
Max. 1.35
Note) Max. 1.00 when using the mold cover
Tin plating annealed copper wire (Min. 0.3μm)
2) Mating jig
Part
Mating jig
3. Applicable wires
Note: This product is not designed to be used for stranded wires (including spare solder).
–121–
Active optical connector
Wire insertion force
Include the conductor resistance of 30 mm long applicable
wire.
Based on the contact resistance measurement method
specified by JIS C 5402.
Mating a wire to the receptacle, so that a wire and PC board
are kept parallel.
Measure using mating jig or mold cover.
Unmating a wire from the receptacle, so that a wire and PC
board are kept parallel.
Measure using mold cover.
Apply an axial pull-off load to wire.
MID
Initial: Max. 30mΩ
After environmental examination: Max. 45mΩ
ACCTB59E 201602-T
Information
Contact resistance
FPC/FFC connectors
Max. 3.0A
Max. 250V AC/DC
Electrical
characteristics
Mechanical
characteristics
Conditions
High current connectors
■ Receptacle
Narrow pitch connectors
PRODUCT TYPES
High current connectors L2
Receptacle
1.56
R0
.3
0
5.40
Terminal coplanarity
0.10
Su
cti
on
)
Narrow pitch connectors
DIMENSIONS (Unit: mm)
00
0.72
1.60
1.
General tolerance: ±0.2
(1.65)
Mated height of the jig
MID
(0.96)
Max. 1.35
0.511±0.010 dia.
Receptacle and Wire are mated
Active optical connector
FPC/FFC connectors
High current connectors
dia
.(
1.35
00
3.
0
.0
30
3.00
6.00
A
40.0°
.00
R2
5.25
7.50
Note 1)
Setting figure of jig
3.50
Information
12.00
Mating jig
Detail A
Note 1) Please mate the wire after confirming the position of the receptacle from the jig hole.
General tolerance: ±0.5
–122–
ACCTB59E 201602-T
High current connectors L2
• Tape packed status
Receptacle
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(7.5)
(17.4±1)
Label
Top cover tape
380 dia.
(4.0)
Embossed carrier tape
Embossed mounting-hole
High current connectors
Taping reel
+0
0 .1
dia
.
• Connector orientation with respect to embossed tape feeding direction
Type
L2
Direction
of tape progress
Regarding cautions for use, please
refer to page 175.
Information
MID
Please refer to the latest product
specifications when designing your
product.
FPC/FFC connectors
1.5
(4.0)
(2.0)
(1.75)
Active optical connector
Leading direction after packaging
(16.0 +0.3
−0.1 )
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
–123–
ACCTB59E 201602-T
FPC connectors Y2B (0.2mm pitch)
Narrow pitch connectors
For FPC
FPC connectors
(0.2mm pitch)
Back lock
FEATURES
0.9
High current connectors
1. Slim (width: 3.15 mm, including the
lever) and low profile design (height:
0.9 mm)
5
3.1
Unit: mm
2. Mechanical design freedom is
achieved with double top and bottom
contacts.
Top and bottom double contacts
eliminate the need of using different
connectors (with either top or bottom
contacts) depending on the FPC wiring
conditions.
3. FPC insertion displacement
prevention
Constructed to make positional
displacement difficult
by surrounding the
four sides on the FPC
inlet side with wall
molding
RoHS compliant
Active optical connector
FPC/FFC connectors
Y2B
4. Easy-to-handle back lock design
5. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
6. Wiring patterns can be placed
underneath the connector.
7. Ni barrier helps resist solder
creepage.
APPLICATIONS
Mobile devices, such as cellular
phones, smartphones, digital still
cameras and digital video cameras.
MID
ORDERING INFORMATION
AYF 2
1
3
5
21: FPC Connector Y2B (0.2 mm pitch)
Back lock
Number of pins (2 digits)
Information
Contact direction
3: Top and bottom double contacts
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
–124–
ACCTB15E 201602-T
FPC connectors Y2B (0.2mm pitch)
Part number
0.9 mm
23
31
41
51
61
AYF212335
AYF213135
AYF214135
AYF215135
AYF216135
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit;
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.20 mm)
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
Specifications
0.2A/pin contact (Max. 5A at total pin contacts)
50V AC/DC
Min. 1,000MΩ (initial)
Dielectric strength
150V AC for 1 min.
Contact resistance
Max. 100mΩ
FPC holding force
Min. 0.13N/pin contact × pin contacts (initial)
Ambient temperature
–55°C to +85°C
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Storage temperature
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No icing or condensation.
High current connectors
Number of pins
FPC/FFC connectors
Height
Narrow pitch connectors
PRODUCT TYPES
Environmental
characteristics
Time (minutes)
30
Max. 5
30
Max. 5
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 100mΩ
Soldering heat resistance
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Reflow soldering
Soldering iron
20 times
Repeated insertion and removal: min. 10 sec./time
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
Lifetime
characteristics
Unit weight
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Insertion and removal life
MID
Thermal shock resistance
(with FPC mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Active optical connector
Conformed to MIL-STD-202F, method 107G
51 pin contacts: 0.07 g
2. Material and surface treatment
Molded portion
Contact
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Copper alloy
Surface treatment
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Information
Part name
–125–
ACCTB15E 201602-T
FPC connectors Y2B (0.2mm pitch)
A
1.35 (Suction area)
Narrow pitch connectors
DIMENSIONS (Unit: mm)
0.40±0.10 (Terminal pitch)
High current connectors
0.20±0.10 (Contact pitch)
(3.15)
(1.84)
0.90±0.10
0.40±0.10 (Terminal pitch)
Terminal
coplanarity
0.1
(Contact)
(0.40)
FPC/FFC connectors
2.95
B±0.20
(0.10)
General tolerance: ±0.3
Each mentioned sizes are at the stage
of initial delivery.
(0.30)
(0.10)
Active optical connector
(1.35)
(FPC insertion depth)
C±0.20
Number of pins/
dimension
23
6.20
4.40
4.00
31
41
51
61
7.80
9.80
11.80
13.80
6.00
8.00
10.00
12.00
5.60
7.60
9.60
11.60
A
B
C
A
B
C
RECOMMENDED FPC DIMENSIONS
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
A±0.05
0.20±0.05
0.20±0.05
Information
0.06
+0.01
−0.03
+0.04
0.20 −0.02 (Width of contact area)
0.40±0.015 (pitch) (*2) 0.10±0.02
0.40±0.05
3.00±0.50 (Reinforcing board)
0.20±0.03
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Conductor exposed area)
0.15 max.
05
.
±0
20
MID
0.
R
2-
0.40±0.015 (pitch)
0.06 +0.01
−0.03
0.20±0.015 (pitch)
+0.04
0.20 −0.02(Width of contact area)
0.65±0.10
0.75±0.10
B±0.02
C±0.02
Cutting direction (*1)
0.40±0.05
Number of pins/
dimension
23
4.80
4.40
4.00
31
41
51
61
6.40
8.40
10.40
12.40
6.00
8.00
10.00
12.00
5.60
7.60
9.60
11.60
(*1) Cut FPC from the copper foil side to the reinforcing plate side.
(*2) Please note if this dimension is too narrow, pattern crack due
to FPC bending is more likely to occur.
–126–
ACCTB15E 201602-T
FPC connectors Y2B (0.2mm pitch)
• Specifications for taping
)
(B)
Leading direction after packaging
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(1.75)
(C±1)
(2.0)
(4.0)
Taping reel
Top cover tape
(8.0)
380 dia.
Embossed carrier tape
Embossed mounting-hole
1.5
Label
.1
+0 .0
00
dia
.
• Dimension table (Unit: mm)
Number of pins
23
31 to 61
A
16.0
24.0
B
7.5
11.5
C
17.4
25.4
Quantity per reel
5,000
5,000
High current connectors
(A
+0.3
−0.1
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Type
Y2B
Direction
of tape progress
NOTES
0.40±0.03
0.23±0.03
0.34±0.03
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
Please refer to the latest product
specifications when designing your
product.
0.23±0.03
0.40±0.03
MID
0.44±0.03
3.15±0.03
0.20±0.03
Regarding cautions for use, please
refer to page 178.
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Front terminal portion opening area ratio: 80%)
(Back terminal portion opening area ratio: 96%)
0.40±0.01
0.21±0.01
–127–
0.44±0.01
0.22±0.01
0.40±0.01
Information
(2.41)
3.15±0.01
0.20±0.01
0.30±0.01
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of contact pitch 0.4 mm,
0.5 mm or 0.6 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use our
recommended patterns basically.
Active optical connector
FPC/FFC connectors
• Connector orientation with respect to embossed tape feeding direction
ACCTB15E 201602-T
FPC connectors Y3BL (0.3mm pitch)
Narrow pitch connectors
For FPC
FEATURES
High current connectors
1. Low profile (height: 0.6 mm) and
slim design (width: 3.35 mm, including
the lever)
2. Compatible with FPC 0.2 mm
thickness
The connector has a 0.6 mm low-profile;
however, it is compatible with FPCs that
are 0.2 mm thick, facilitating assembly
work.
3. High durability assured with
proprietary soldering terminal
construction
Housing damage is prevented when FPC
is inserted incorrectly thanks to the two
walls on the FPC inlet side being metal
(soldering terminal).
Metal wall
(soldering
terminal)
RoHS compliant
0.60
5
2.9
Active optical connector
FPC/FFC connectors
Y3BL
FPC connectors
(0.3mm pitch)
Back lock
5
3.3 ding )
clu ver
(in e le
th
4. Assembly time is reduced when
connector levers are received open.
5. Wiring patterns can be placed
underneath the connector.
6. Ni barrier with high resistance to
solder creepage
Unit: mm
APPLICATIONS
Compact mobile devices such as
wearable devices, smartphones, tablet
PCs, DSCs, and DVCs.
MID
ORDERING INFORMATION
AYF 3
5
2
5
35: FPC Connector Y3BL (0.3 mm pitch)
Back lock
Number of pins (2 digits)
Information
Contact direction
2: Top contact
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
–128–
ACCTB52E 201602-T
FPC connectors Y3BL (0.3mm pitch)
Number of pins
Part number
0.6 mm
7
11
15
23
25
27
31
39
45
51
AYF350725
AYF351125
AYF351525
AYF352325
AYF352525
AYF352725
AYF353125
AYF353925
AYF354525
AYF355125
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
High current connectors
Height
Narrow pitch connectors
PRODUCT TYPES
Notes: 1. Order unit;
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
150V AC for 1 min.
Contact resistance
Max. 160mΩ
FPC holding force
Min. 0.10N/pin contact × pin contacts (initial)
Ambient temperature
–55°C to +85°C
Storage temperature
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(with FPC mated)
Environmental
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 160mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 160mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 160mΩ
Soldering heat resistance
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Reflow soldering
Soldering iron
Insertion and removal life
20 times
Repeated insertion and removal: min. 10 sec./time
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
Lifetime
characteristics
Unit weight
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 160mΩ
51 pin contacts: 0.05 g
2. Material and surface treatment
Part name
Molded portion
Active optical connector
Dielectric strength
Conditions
MID
Mechanical
characteristics
Specifications
0.2A/pin contact
50V AC/DC
Min. 1,000MΩ (initial)
Material
Surface treatment
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
—
Contact
Copper alloy
Soldering terminal
Copper alloy
–129–
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Ni on base, Pd + Au flash plating
ACCTB52E 201602-T
Information
Electrical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
FPC/FFC connectors
1. Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.20 mm)
FPC connectors Y3BL (0.3mm pitch)
(1.25)
(FPC insertion depth)
1.00 (Suction area)
Narrow pitch connectors
DIMENSIONS (Unit: mm)
A
0.60±0.10 (Terminal pitch)
(3.35)
High current connectors
0.30±0.10 (Contact pitch)
The shape of this portion may differ depending
on No. of pins and the mold.
(1.43)
0.60±0.08
0.60±0.10 (Terminal pitch)
Terminal coplanarity
0.1
(0.10)
(0.10)
Each mentioned dimension is at the stage of initial
delivery.
Number of pins/
dimension
7
3.60
1.80
1.20
3.20
11
15
23
25
27
31
39
45
51
4.80
6.00
8.40
9.00
9.60
10.80
13.20
15.00
16.80
3.00
4.20
6.60
7.20
7.80
9.00
11.40
13.20
15.00
2.40
3.60
6.00
6.60
7.20
8.40
10.80
12.60
14.40
4.40
5.60
8.00
8.60
9.20
10.40
12.80
14.60
16.40
A
B
C
(0.05)
(0.33)
General tolerance: ±0.3
(0.69)
(0.10)
B±0.20
(0.10)
Active optical connector
2.95
D±0.20
(0.34)
FPC/FFC connectors
(Contact and Soldering terminal)
C±0.20
A
B
C
D
RECOMMENDED FPC DIMENSIONS
0.10 max.
0.20±0.02
0.30 +0.04
−0.03 (Contact width)
0.60±0.02 (Pitch)
0.30±0.07
0.60±0.07
0.20±0.02
3.00±0.50
(Reinforcing plate)
Information
0.15 max.
2-R0.20±0.05
A±0.05
B±0.03
C±0.03
0.60±0.02 (Pitch)
0.30±0.02 (Pitch)
0.30 +0.04
−0.03 (Contact width)
0.10 max.
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Exposed part of the conductor)
0.30±0.07
0.60±0.07
0.65±0.10
0.75±0.10
MID
(Finished thickness: t = 0.2±0.02)
The conductive parts should be based by Ni plating and then Au plating.
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing plate side.
–130–
Number of pins/
dimension
7
2.40
1.80
1.20
11
15
23
25
27
31
3.60
4.80
7.20
7.80
8.40
9.60
3.00
4.20
6.60
7.20
7.80
9.00
2.40
3.60
6.00
6.60
7.20
8.40
39
45
51
12.00
13.80
15.60
11.40
13.20
15.00
10.80
12.60
14.40
ACCTB52E 201602-T
FPC connectors Y3BL (0.3mm pitch)
• Specifications for taping
(C±1)
(1.75)
Taping reel
(2.0)
(4.0)
Top cover tape
380 dia.
Embossed carrier tape
(8.0)
Embossed mounting-hole
Label
di
.1
+0 .0
00
.1
+0 0.0
50
1.5
High current connectors
(8.0)
(2.0)
(4.0)
Leading direction after packaging
(B)
1.
Leading direction after packaging
(A±0.3)
(28.4)
(1.75)
a.
dia
.
• Dimension table (Unit: mm)
Number of pins
7 to 15
23 to 45
51
Type of taping
Tape I
Tape I
Tape II
A
16.0
24.0
32.0
B
7.5
11.5
14.2
C
17.4
25.4
33.4
Quantity per reel
5,000
5,000
5,000
• Connector orientation with respect to embossed tape feeding direction
Type
Y3BL
Direction
of tape progress
NOTES
0.34±0.03
0.30±0.03
3.15±0.03
0.60±0.03
0.23±0.03
Regarding cautions for use, please
refer to page 178.
0.23±0.03
0.60±0.03
MID
0.28±0.03
0.70±0.03
Please refer to the latest product
specifications when designing your
product.
0.44±0.03
0.84±0.03
0.075±0.03
Recommended PC board pattern
(mounting layout)
Recommended metal mask pattern
Information
0.30±0.03
0.22±0.01
0.70±0.01
–131–
0.22±0.01
0.60±0.01
0.34±0.01
(2.47)
3.15±0.01
0.60±0.01
0.22±0.01
0.34±0.01
Metal mask thickness: When 120μm
(Front terminal portion opening area ratio: 74%)
(Back terminal portion opening area ratio: 96%)
(Soldering terminal portion opening area ratio: 54%)
0.58±0.01
0.245±0.01
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of contact pitch 0.4 mm,
0.5 mm or 0.6 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use our
recommended patterns basically.
FPC/FFC connectors
(A +0.3
−0.1 )
(B)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape II
Active optical connector
Tape I
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
ACCTB52E 201602-T
FPC connectors Y3B/Y3BW (0.3mm pitch)
FPC connectors
(0.3mm pitch)
Back lock
1. Slim (width: 3.15 mm, including the
lever) and low profile design (height:
0.9 mm)
Y3B
5
3.1
Unit: mm
2. Mechanical design freedom is
achieved with double top and bottom
contacts.
Top and bottom double contacts
eliminate the need of using different
connectors (with either top or bottom
contacts) depending on the FPC wiring
conditions.
3. Easy-to-handle back lock structure
4. FPC insertion displacement
prevention
Constructed to make positional
displacement difficult
by surrounding the
four sides on the FPC
inlet side with wall
molding
Y3BW
RoHS compliant
Active optical connector
FPC/FFC connectors
Y3B/Y3BW
FEATURES
0.9
High current connectors
Narrow pitch connectors
For FPC
6. Wiring patterns can be placed
underneath the connector.
7. Ni barrier with high resistance to
solder creepage.
8. Y3BW features lock holding type,
including a structure to temporarily
hold the FPC and a higher holding
force.
The FPC holding contacts located on
both ends of the connector facilitate
positioning of FPC and further enhance
the FPC holding force.
Structure to lock
notches on both
ends of the
FPC with
holding
contacts
Applicable
FPC shapes
(1) The inserted FPC can be temporarily
held until the lever is closed.
(2) When the lever is closed, the holding
contacts lock the FPC by its notches,
enhancing the FPC holding force.
APPLICATIONS
Mobile devices, such as cellular
phones, smartphones, digital still
cameras and digital video cameras.
MID
5. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
ORDERING INFORMATION
AYF 3
3
5
33: FPC Connector Y3B/Y3BW (0.3 mm pitch)
Back lock
Information
Number of pins (2 digits)
Function
3: Top and bottom double contacts (Y3B)
6: Top and bottom double contacts, lock holding type (Y3BW)
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
–132–
ACCTB47E 201602-T
FPC connectors Y3B/Y3BW (0.3mm pitch)
Number of pins
Part number
0.9 mm
7
8
9
11
13
15
17
21
23
25
27
31
33
35
37
39
41
45
51
61
71
AYF330735
AYF330835
AYF330935
AYF331135
AYF331335
AYF331535
AYF331735
AYF332135
AYF332335
AYF332535
AYF332735
AYF333135
AYF333335
AYF333535
AYF333735
AYF333935
AYF334135
AYF334535
AYF335135
AYF336135
AYF337135
Height
Number of pins
Part number
0.9 mm
11
25
51
AYF331165
AYF332565
AYF335165
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Y3BW
Packing
Outer carton
5,000 pieces
10,000 pieces
Active optical connector
Inner carton (1-reel)
High current connectors
Height
FPC/FFC connectors
Y3B
Narrow pitch connectors
PRODUCT TYPES
Information
MID
Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units.
For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
–133–
ACCTB47E 201602-T
FPC connectors Y3B/Y3BW (0.3mm pitch)
Narrow pitch connectors
SPECIFICATIONS
1. Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.20 mm)
Item
Rated current
Electrical
characteristics
Rated voltage
Insulation resistance
Dielectric strength
High current connectors
Contact resistance
Mechanical
characteristics
FPC holding force
Ambient temperature
Storage temperature
FPC/FFC connectors
150V AC for 1 min.
Max. 100mΩ
Y3B: Min. 0.13N/pin contact × pin contacts (initial)
Y3BW: Min. 0.13N/pin contact × pin contacts + 1.00N
(initial)
–55°C to +85°C
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(with FPC mated)
Active optical connector
Specifications
0.2A/pin contact
(For min. 61 pins: Max. 12 A at total contacts)
50V AC/DC
Min. 1,000MΩ (initial)
Environmental
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 100mΩ
Soldering heat resistance
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Reflow soldering
Soldering iron
20 times
Repeated insertion and removal: min. 10 sec./time
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
Lifetime
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Insertion and removal life
Y3B 61 pin contacts: 0.10 g
Y3BW 51 pin contacts: 0.09 g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Copper alloy
Holding contact (Only Y3BW)
Copper alloy
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Contact portion; Base: Ni plating, Surface: Au plating
Information
MID
Contact
Surface treatment
–134–
ACCTB47E 201602-T
FPC connectors Y3B/Y3BW (0.3mm pitch)
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Y3B
CAD Data
A
0.60±0.10 (Terminal pitch)
0.90±0.10
0.30±0.10 (Contact pitch)
0.60±0.10 (Terminal pitch)
(3.15)
(1.84)
2.95
(1.35)
(FPC
insertion
depth)
Terminal
coplanarity
0.1
(0.40)
(Contact)
B±0.20
(0.10)
(0.30)
(0.10)
C±0.20
A
B
C
3.60
1.80
1.20
9
11
13
15
17
21
23
25
27
31
33
35
37
39
41
45
51
61
71
4.20
4.80
5.40
6.00
6.60
7.80
8.40
9.00
9.60
10.80
11.40
12.00
12.60
13.20
13.80
15.00
16.80
19.80
22.80
2.40
3.00
3.60
4.20
4.80
6.00
6.60
7.20
7.80
9.00
9.60
10.20
10.80
11.40
12.00
13.20
15.00
18.00
21.00
1.80
2.40
3.00
3.60
4.20
5.40
6.00
6.60
7.20
8.40
9.00
9.60
10.20
10.80
11.40
12.60
14.40
17.40
20.40
CAD Data
3.90
0.30±0.10 (Contact pitch)
0.60±0.10
(Terminal pitch)
(3.15)
(1.84)
0.60±0.10 (Terminal pitch)
0.90±0.10
1.35 (Suction area)
No. of pins: Even number (8 pin contacts)
Number of pins/
dimension
7
Active optical connector
1.35 (Suction area)
No. of pins: Odd number
Narrow pitch connectors
CAD Data
High current connectors
The CAD data of the products with a
FPC/FFC connectors
DIMENSIONS (Unit: mm)
The degree of
terminal flat
0.1
2.95
MID
(0.40)
1.80±0.20
(0.10)
(Contact) (1.35)
(FPC
insertion
depth)
General tolerance: ±0.3
Each mentioned dimension is at the stage
of initial delivery.
Information
(0.30)
(0.10)
1.80±0.20
–135–
ACCTB47E 201602-T
FPC connectors Y3B/Y3BW (0.3mm pitch)
Y3B
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
No. of pins: Odd number
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Exposed part of the conductor)
3.00±0.50
(Reinforcing plate)
2.40
1.80
1.20
9
11
13
15
17
21
23
25
27
31
33
35
37
39
41
45
51
61
71
3.00
3.60
4.20
4.80
5.40
6.60
7.20
7.80
8.40
9.60
10.20
10.80
11.40
12.00
12.60
13.80
15.60
18.60
21.60
2.40
3.00
3.60
4.20
4.80
6.00
6.60
7.20
7.80
9.00
9.60
10.20
10.80
11.40
12.00
13.20
15.00
18.00
21.00
1.80
2.40
3.00
3.60
4.20
5.40
6.00
6.60
7.20
8.40
9.00
9.60
10.20
10.80
11.40
12.60
14.40
17.40
20.40
A
B
C
0.30±0.07
0.10 max.
0.20±0.03
0.30 +0.04
−0.03
(Width of contact area)
0.60±0.07
3.00±0.50
(Reinforcing board)
0.10 max.
0.20±0.02
0.60±0.07
0.60±0.02 (pitch)
2.70±0.05
1.80±0.03
1.80±0.03
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Conductor exposed area)
0.10 max.
0.20±0.02
0.60±0.07
0.20±0.03
0.30±0.07
0.60±0.02 (pitch)
0.30±0.02 (pitch)
0.30 +0.04
−0.03
(Width of contact area)
2-R0
.20±
0.05
0.75±0.10
0.65±0.10
0.15 max.
0.30±0.07
0.30 +0.04
−0.03
(Width of contact area)
3.00±0.50
(Reinforcing board)
0.30 +0.04
−0.03
(Width of contact area)
0.60±0.07
0.60±0.02 (pitch)
Number of pins/
dimension
7
For Bottom Contacts
2.70±0.05
1.80±0.03
1.80±0.03
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Conductor exposed area)
0.30±0.07
0.60±0.02 (pitch)
0.30±0.02 (pitch)
0.10 max.
2-R
0.20
±0.0
5
0.20±0.03
0.60±0.07
Cutting direction*
0.10 max.
*Cut FPC from the copper foil side
0.20±0.02
to
the reinforcing plate side.
0.30+0.04
–0.03 (Contact width)
No. of pins: Even number (8 pin contacts)
For Top Contacts
0.75±0.10
0.65±0.10
0.15 max.
FPC/FFC connectors
0.10 max.
0.30+0.04
–0.03 (Contact width)
0.60±0.07
0.60±0.02 (Pitch)
Active optical connector
0.30±0.07
0.15 max.
High current connectors
5
.0
±0
20
0.
A±0.05
B±0.03
C±0.03
0.60±0.02 (Pitch)
0.30±0.02 (Pitch)
0.65±0.10
0.75±0.10
0.30±0.07
R
2-
Narrow pitch connectors
RECOMMENDED FPC DIMENSIONS
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing board side.
Information
MID
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing board side.
–136–
ACCTB47E 201602-T
FPC connectors Y3B/Y3BW (0.3mm pitch)
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Narrow pitch connectors
The CAD data of the products with a
A
0.60±0.10 (Terminal pitch)
High current connectors
0.30±0.10 (Contact pitch)
0.60±0.10 (Terminal pitch)
(3.15)
(1.84)
0.90±0.10
Holding contacts
(The holding contacts cannot be used as conductors.)
Terminal coplanarity
(1.35) (FPC insertion depth)
0.1
(0.40)
B±0.20
(0.10)
General tolerance: ±0.3
Each mentioned dimension is at the stage of initial
delivery.
(0.10)
A
B
C
D
5.40
3.00
2.40
3.60
25
51
9.60
17.40
7.20
15.00
6.60
14.40
7.80
15.60
A
B
C
(0.30)
C±0.20
(0.10)
Number of pins/
dimension
11
D±0.20
RECOMMENDED FPC DIMENSIONS
Y3BW
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
.20
±0
R0
.20
±0
.05
.05
0.90±0.07
0.45 +0.03
−0.05
0.90±0.07
0.60±0.02 (Pitch)
0.10 max.
0.20±0.02
0.30 +0.04
−0.03 (Contact width)
–137–
Cutting direction*
* Cut FPC from the copper foil side
to the reinforcing plate side.
MID
05
.
±0
R0
0.20±0.03
3.00±0.50 (Support plates)
20
0.
R
2-
1.45±0.10
0.75±0.05
0.15 max.
0.60±0.07
0.65±0.10
0.75±0.10
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Exposed part of the conductor)
0.60±0.07
A±0.05
B±0.03
C±0.03
0.60±0.02 (Pitch)
0.30±0.02 (Pitch)
0.30 +0.04
−0.03 (Contact width)
0.10 max.
FPC/FFC connectors
(2.95)
(Contact and holding contact)
Active optical connector
CAD Data
1.35 (Suction area)
Y3BW
Number of pins/
dimension
11
4.20
3.00
2.40
25
51
8.40
16.20
7.20
15.00
6.60
14.40
ACCTB47E 201602-T
Information
DIMENSIONS (Unit: mm)
FPC connectors Y3B/Y3BW (0.3mm pitch)
Tape I
(A +0.3
−0.1 )
(A±0.3)
28.40
(B)
(C±1)
Taping reel
Top cover tape
Embossed carrier tape
380 dia.
(2.0)
(4.0)
(8.0)
(1.75)
(2.0)
(4.0)
(1.75)
(8.0)
Leading direction after packaging
(B)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape II
Embossed mounting-hole
Label
1.5
.1
+0 .0
00
.1
+0 .0
00
dia
dia
.
.
FPC/FFC connectors
• Specifications for taping
1.5
High current connectors
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Y3B Dimension table (Unit: mm)
Number of pins
7 to 17
21 to 45
51, 61
71
Type of taping
Tape I
Tape I
Tape II
Tape II
A
16.0
24.0
32.0
44.0
B
7.5
11.5
14.2
20.2
C
17.4
25.4
33.4
45.4
Quantity per reel
5,000
5,000
5,000
5,000
A
16.0
24.0
32.0
B
7.5
11.5
14.2
C
17.4
25.4
33.4
Quantity per reel
5,000
5,000
5,000
• Y3BW Dimension table (Unit: mm)
Number of pins
11
25
51
Type of taping
Tape I
Tape I
Tape II
• Connector orientation with respect to embossed tape feeding direction
Y3B
Y3BW
Information
MID
Active optical connector
Type
Direction
of tape progress
–138–
ACCTB47E 201602-T
FPC connectors Y3B/Y3BW (0.3mm pitch)
• Y3BW
0.30±0.03
0.60±0.03
0.23±0.03
0.60±0.03
0.23±0.03
: Insulation
0.30±0.03
0.30±0.03
0.23±0.03
0.60±0.03
0.23±0.03
0.60±0.03
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
Metal mask thickness: When 120μm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.30±0.01
Metal mask thickness: When 120μm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.60±0.01
0.22±0.01
0.30±0.01
0.22±0.01
0.60±0.01
0.22±0.01
0.60±0.01
Regarding cautions for use, please
refer to page 178.
Please refer to the latest product
specifications when designing your
product.
MID
0.22±0.01
0.60±0.01
Information
0.60±0.01
0.22±0.01
0.34±0.01
0.44±0.01
3.15±0.01
Recommended metal mask pattern
0.34±0.01
0.44±0.01
3.15±0.01
Recommended metal mask pattern
0.30±0.01
0.60±0.01
0.22±0.01
0.23±0.03
0.60±0.03
0.34±0.01
0.44±0.01
3.15±0.01
0.30±0.03
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.34±0.03
0.44±0.03
3.15±0.03
0.60±0.03
0.23±0.03
0.34±0.03
0.44±0.03
3.15±0.03
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.34±0.03
0.44±0.03
3.15±0.03
No. of pins: Even number
(8 pin contacts)
FPC/FFC connectors
• Y3B
No. of pins: Odd number
Active optical connector
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of contact pitch 0.4 mm,
0.5 mm or 0.6 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use our
recommended patterns basically.
High current connectors
Narrow pitch connectors
NOTES
–139–
ACCTB47E 201602-T
For FPC
Y3BC
FPC connectors
(0.3mm pitch)
Back lock
FEATURES
New
1. Slim (width: 3.20 mm, including the
lever) and low profile design (height:
1.0 mm)
1.0
Y3BC
3.
20
High current connectors
Narrow pitch connectors
Y3BC (0.3mm pitch)
2. Mechanical design freedom is
achieved with double top and bottom
contacts.
Top and bottom double contacts
eliminate the need of using different
connectors (with either top or bottom
contacts) depending on the FPC wiring
conditions.
3. Easy-to-handle back lock structure
4. FPC insertion displacement
prevention
Constructed to make positional
displacement difficult
by surrounding the
four sides on the FPC
inlet side with wall
molding
RoHS compliant
Active optical connector
FPC/FFC connectors
Unit: mm
5. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
6. While featuring back lock structure,
lever open/close operation is possible
without an FPC inserted.
Breakage troubles during transport of
modules or setting devices are
prevented.
Without an FPC inserted
*Opening and closing of lever is limited to five
times under same conditions and removal life.
Please do not perform reflow heating when
lever is closed or partly closed.
7. Wiring patterns can be placed
underneath the connector.
8. Ni barrier with high resistance to
solder creepage.
APPLICATIONS
Mobile devices, such as cellular
phones, smartphones, digital still
cameras and digital video cameras.
MID
ORDERING INFORMATION
AYF 3
6
3
5
36: FPC Connector Y3BC (0.3 mm pitch)
Back lock
Number of pins (2 digits)
Information
Function
3: Top and bottom double contacts
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
–140–
ACCTB77E 201602-T
Y3BC (0.3mm pitch)
1.0 mm
25
31
39
AYF362535
AYF363135
AYF363935
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units.
For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.20 mm)
Electrical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
Dielectric strength
Contact resistance
Mechanical
characteristics
FPC holding force
Ambient temperature
Storage temperature
Specifications
0.2A/pin contact
50V AC/DC
Min. 1,000MΩ (Initial)
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
150V AC for 1 min.
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
Max. 100mΩ
specified by JIS C 5402.
25 pins: Min. 0.20N/pin contact × pin contacts (Initial) Measurement of the maximum force applied until the
31, 39 pins: Min. 0.18N/pin contact × pin contacts
inserted compatible FPC is pulled out in the insertion axis
(Initial)
direction while the connector lever is closed
–55°C to +85°C
No icing or condensation.
–55°C to +85°C (Products only)
–40°C to +50°C (Emboss packaging)
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(with FPC mated)
Environmental
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 100mΩ
Soldering heat resistance
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Reflow soldering
Soldering iron
Insertion and removal life
20 times
Repeated insertion and removal: min. 10 sec./time
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
Lifetime
characteristics
Unit weight
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Y3BC 25 pin contacts: 0.05 g
High current connectors
Part number
FPC/FFC connectors
Number of pins
Active optical connector
Height
MID
Y3BC
Narrow pitch connectors
PRODUCT TYPES
2. Material and surface treatment
Contact
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Copper alloy
Surface treatment
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Information
Part name
Molded portion
–141–
ACCTB77E 201602-T
Y3BC (0.3mm pitch)
(1.70) (FPC insertion depth)
1.67 (Suction area)
A
0.60±0.10 (Terminal pitch)
High current connectors
(3.50)
0.30±0.10 (Contact pitch)
0.60±0.10 (Terminal pitch)
Terminal coplanarity
(1.47)
1.00±0.10
Narrow pitch connectors
DIMENSIONS (Unit: mm)
Y3BC
3.20
B±0.02
Each mentioned dimension is at the stage
of initial delivery.
(0.08)
C±0.20
(0.30)
(0.10)
Number of pins/
dimension
25
8.40
7.20
6.60
31
39
10.20
12.60
9.00
11.40
8.40
10.80
A
B
C
A
B
C
Y3BC RECOMMENDED FPC DIMENSIONS
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
0.30±0.10
2-R0.20 max.
A±0.05
0.30±0.07
B±0.03
0.60±0.07
C±0.03
0.60±0.02 (Pitch)
0.30±0.02 (Pitch)
0.30+0.04
–0.03 (Contact width)
0.10±0.02
0.20±0.03
3.50 min.
(Reinforcing plate)
MID
0.30±0.07
0.60±0.07
Information
(0.34)
General tolerance: ±0.3
1.00±0.10
1.10±0.10
2.10±0.10
2.25±0.10
2.50±0.30
(Exposed part of the conductor)
Active optical connector
FPC/FFC connectors
0.1
0.30+0.04
–0.03 (Contact width)
Cutting direction*
0.10±0.02
*Cut FPC from the copper foil side
0.20±0.02
to the reinforcing plate side.
0.60±0.02 (Pitch)
–142–
Number of pins/
dimension
25
7.80
7.20
6.60
31
39
9.60
12.00
9.00
11.40
8.40
10.80
ACCTB77E 201602-T
Y3BC (0.3mm pitch)
• Specifications for taping
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(A +0.3
−0.1 )
(C±1)
(1.75)
Taping reel
Top cover tape
(2.0)
(4.0)
(8.0)
380 dia.
Embossed carrier tape
Embossed mounting-hole
Label
.1
+0 .0
00
1.5
.
dia
• Y3BC Dimension table (Unit: mm)
Number of pins
25 to 39
Type of taping
Tape I
A
24.0
B
11.5
C
25.4
Quantity per reel
5,000
High current connectors
Leading direction after packaging
(B)
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
FPC/FFC connectors
Type
Y3BC
Direction
of tape progress
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of contact pitch 0.4 mm,
0.5 mm or 0.6 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use our
recommended patterns basically.
0.30±0.01
–143–
Information
(2.59)
3.60±0.01
0.23±0.01
0.60±0.01
0.55±0.01
0.30±0.03
0.60±0.03
Regarding cautions for use, please
refer to page 178.
Please refer to the latest product
specifications when designing your
product.
3.60±0.03
0.30±0.03
Metal mask thickness: When 120μm
(Front terminal portion opening area ratio: 53%)
(Back terminal portion opening area ratio: 54%)
0.60±0.01
0.23±0.01
0.80±0.03
0.60±0.03
0.30±0.03
0.65±0.03
(TOP VIEW)
Recommended metal mask pattern
0.46±0.01
Recommended PC board pattern
(mounting layout)
MID
Active optical connector
NOTES
ACCTB77E 201602-T
For FPC
FEATURES
New
1. Differential impedance matching
(100, 90, 85 Ω) compliant with various
high-speed transmission standards.
Differential impedance, Ω
■ FPC connector for high-speed
transmission.
By matching the differential impedance,
this FPC connector offers excellent highspeed differential transmission
characteristics and supports all highspeed transmission standards.
(when pin assignments are GSSG).
RoHS compliant
Active optical connector
FPC/FFC connectors
Y4BH
FPC connectors
(0.4mm pitch)
Back lock
High current connectors
Narrow pitch connectors
FPC connectors Y4BH (0.4mm pitch)
120
110
Connector
80
Tr = 40ps (20-80%)
200
300
400
Time, ps
0
3.2
Unit: mm
90
60
100
1.00
FPC
100
70
■ More freedom in mechanical design
With top and bottom contact construction
and no pin assignments, this FPC
connector contributes to customer design
freedom.
500
600
2. Mechanical design freedom is
achieved with 0.4 mm pitch, 1.0 mm
height and double top and bottom
contacts.
■ FPC insertion displacement
prevention
Constructed to make positional
displacement difficult
by surrounding the
four sides on the FPC
inlet side with wall
molding
3. Easy-to-handle back lock structure.
4. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
APPLICATIONS
MID
Compact electronic devices such as
PCs, tablet PCs, digital still cameras
and digital video cameras.
ORDERING INFORMATION
Information
AYF
3
5
41: FPC Connector Y4BH (0.4 mm pitch) Back lock
100Ω matched Differential impedance
42: FPC Connector Y4BH (0.4 mm pitch) Back lock
85Ω and 90Ω matched Differential impedance
Number of pins (2 digits)
Contact direction
3: Top and bottom double contacts
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
–144–
ACCTB67E 201602-T
FPC connectors Y4BH (0.4mm pitch)
AYF424035
AYF425035
AYF414035
AYF415035
1.0 mm
100Ω type
5,000 pieces
Outer carton
10,000 pieces
Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units.
For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.30 mm)
Electrical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
Specifications
0.3A/pin contact
50V AC/DC
Min. 1,000MΩ (initial)
Dielectric strength
250V AC for 1 min.
Contact resistance
Max. 100mΩ
85Ω and 90Ω types
85Ω±10Ω (Connector part)
90Ω±10Ω (Connector part)
100Ω type
100Ω±15Ω (Connector part)
Differential impedance
Mechanical
characteristics
FPC holding force
Min. 0.10N/pin contact × pin contacts (initial)
Ambient temperature
–55°C to +85°C
Storage temperature
–55°C to +85°C (Product only)
–40°C to +50°C (Emboss packaging)
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Differential signal
Rise times (Tr): 40 ps (20% to 80%)
(FPC and PC board: Differential impedance 85Ω or 90Ω
controlled.)
Differential signal
Rise times (Tr): 40 ps (20% to 80%)
(FPC and PC board: Differential impedance 100Ω
controlled.)
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(with FPC mated)
Environmental
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 100mΩ
Soldering heat resistance
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Reflow soldering
Soldering iron
Insertion and removal life
20 times
Repeated insertion and removal: min. 10 sec./time
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
Lifetime
characteristics
Unit weight
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
50 pin contacts: 0.10 g
2. Material and surface treatment
Part name
Molded portion
Contact
High current connectors
40
50
40
50
85Ω and 90Ω types
Packing
Inner carton (1-reel)
FPC/FFC connectors
Part number
Active optical connector
Number of pins
MID
Differential impedance
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Copper alloy
–145–
Surface treatment
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
ACCTB67E 201602-T
Information
Height
Narrow pitch connectors
PRODUCT TYPES
FPC connectors Y4BH (0.4mm pitch)
The CAD data of the products with a
CAD Data
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
A
0.40±0.10
(3.70)
1.00±0.10
(1.60) (Suction area)
(1.73)
High current connectors
Narrow pitch connectors
DIMENSIONS (Unit: mm)
Terminal coplanarity
(0.30)
0.1
(Contact and
soldering terminals)
(0.50)
(1.50) (FPC insertion depth)
2.90
B±0.20
3.20
(0.35)
(0.10)
C±0.20
Each mentioned dimension is at the stage
of initial delivery.
B
C
17.32
15.60
50
22.00
21.32
19.60
Impedance matching FPC
(A+0.8)±0.05
A±0.03
0.40±0.07
0.40±0.03
R0.20±0.05
0.27 +0.04
−0.03
0.10 max.
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing plate side.
0.30±0.03
2.50 min.
(Reinforcing plate)
0.30±0.03
2.50 min.
(Reinforcing plate)
0.27±0.03
1.50 min.
(Exposed part of the conductor)
R0.20±0.05
1.25±0.15
1.285±0.15
Normal FPC
0.40±0.07
0.40±0.03
MID
A
18.00
Recommended FPC dimensions
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
(A+0.8)±0.05
A±0.03
Information
Number of pins/
dimension
40
0.515 ±0.15
0.60 ±0.15
Active optical connector
FPC/FFC connectors
(0.15)
Please match
100, 90 and 85Ω
differential
impedances.
Please inquire separately for details about impedance
matching FPC.
–146–
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing plate side.
Number of pins/
dimension
40
15.60
50
19.60
A
ACCTB67E 201602-T
FPC connectors Y4BH (0.4mm pitch)
Specifications for taping
Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(A±0.3)
(C)
(B)
(1.75)
(D±1)
(2.0)
(4.0)
Taping reel
Top cover tape
(8.0)
380 dia.
Embossed carrier tape
1.
50 +
Embossed mounting-hole
0
0. .1
0
di
a.
High current connectors
Leading direction after packaging
Narrow pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Label
Dimension table (Unit: mm)
Number of pins
40
50
A
32.0
44.0
B
14.2
20.2
C
28.4
40.4
D
33.4
45.4
Quantity per reel
5,000
5,000
Connector orientation with respect to embossed tape feeding direction
Type
NOTES
1. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of
contact pitch 0.4 mm, 0.5 mm or 0.6 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use our recommended patterns basically.
0.50±0.05
Recommended PC board pattern (mounting layout)
0.40±0.05
0.86±0.05
0.80±0.05
3.20±0.05
0.40±0.05
0.23±0.05
Active optical connector
FPC/FFC connectors
Y4BH
Direction
of tape progress
MID
0.86±0.05
Recommended metal mask pattern
0.40±0.01
0.86±0.01
0.86±0.01
Regarding cautions for use, please refer to page 178.
Please refer to the latest product specifications when
designing your product.
–147–
ACCTB67E 201602-T
0.80±0.01
3.20±0.01
0.40±0.01
0.23±0.01
Information
0.43±0.01
Metal mask thickness: When 120μm
(Terminal portion opening area ratio: 86%)
(Terminal portion opening area ratio: 100%)
FPC connectors Y5B/Y5BW (0.5mm pitch)
Narrow pitch connectors
For FPC/FFC*
3. FPC insertion displacement
prevention
Constructed to make positional
displacement difficult
by surrounding the
four sides on the FPC
inlet side with wall
molding
High current connectors
FPC/FFC connectors
Active optical connector
Y5B/Y5BW
FPC connectors
(0.5mm pitch)
Back lock
Applicable FPC shape
With notches
(1) The inserted FPC can be temporarily held until the lever is
closed.
(2) When the lever is closed, the holding contacts lock the
FPC by its notches, enhancing the FPC holding force.
Y5B/Y5BW
* (Y5BW is compatible with FPC only.)
*
7. Supports V-by-One® HS.
RoHS compliant
FEATURES
1. Low profile (height: 1.0 mm), space
saving back lock type with improved
lever operability.
2. Mechanical design freedom
achieved by top and bottom double
contacts.
4. Wiring patterns can be placed
underneath the connector.
5. Man-hours for assembly can be
reduced by delivering the connectors
with their levers opened.
6. Y5BW features lock holding type,
including a structure to temporarily
hold the FPC and a higher holding
force.
The FPC holding contacts located on
both ends of the connector facilitate
positioning of FPC and further enhance
the FPC holding force.
Structure to lock
notches on both ends
of the FPC with
holding contacts
1.00
APPLICATIONS
A wide range of digital equipment,
including mobile phones,
smartphones, PCs, digital still camera,
and digital video camera. Ideal for
touch panels and LCD backlights,
which require connectors with a small
number of pins.
*V-by-One®HS: An interface for the next-generation
high-speed signals developed by THine Electronics,
Inc.
V-by-One® is a registered trademark of THine
Electronics, Inc.
Unit: mm
0
3.2
4 pin contacts (Y5B: minimum)
MID
ORDERING INFORMATION
Y5B
AYF 5
3
3
5
3
6
5
53: FPC Connector Y5B (0.5 mm pitch)
Back lock
Number of pins (2 digits)
Information
Function
3: Top and bottom double contacts
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
Y5BW
AYF 5
T
53: FPC Connector Y5BW (0.5 mm pitch)
Back lock
Number of pins (2 digits)
Function
6: Top and bottom double contacts, lock holding type
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
T: Suction area expansion type
–148–
ACCTB1E 201602-T
FPC connectors Y5B/Y5BW (0.5mm pitch)
Number of pins
2
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
Part number
AYF530265T
AYF530365T
AYF530465T
AYF530665T
AYF530865T
AYF531065T
AYF531265T
AYF531465T
AYF532265T
AYF532665T
AYF532865T
AYF533065T
AYF533265T
AYF533865T
AYF534065T
AYF534865T
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit;
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.30 mm)
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
Specifications
0.5A/pin contact (Except for holding contact)
50V AC/DC
Min. 1,000MΩ (initial)
Dielectric strength
250V AC for 1 min.
Contact resistance
Max. 100mΩ
FPC holding force
Ambient temperature
Storage temperature
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Y5B: Min. 0.2N/pin contact × pin contacts (initial)
Y5BW: Min. 0.2N/pin contact × pin contacts + 2.0N
(initial)
–55°C to +85°C
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
High current connectors
1.0 mm
Y5BW
Part number
AYF530435
AYF530535
AYF530635
AYF530835
AYF531035
AYF531235
AYF531435
AYF531635
AYF532435
AYF532835
AYF533035
AYF533235
AYF533435
AYF534035
AYF534235
AYF535035
FPC/FFC connectors
Number of pins
4
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No icing or condensation.
Active optical connector
Y5B
Height
Narrow pitch connectors
PRODUCT TYPES
Environmental
characteristics
Time (minutes)
30
Max. 5
30
Max. 5
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 100mΩ
Soldering heat resistance
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Reflow soldering
Soldering iron
20 times
Repeated insertion and removal: min. 10 sec./time
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
Lifetime
characteristics
Unit weight
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Insertion and removal life
Y5B 50 pin contacts: 0.16 g
2. Material and surface treatment
Part name
Molded portion
Material
Surface treatment
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
—
Contact
Copper alloy
Holding contact (Only Y5BW)
Soldering terminals
Copper alloy
Copper alloy
–149–
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Base: Ni plating, Surface: Au plating
ACCTB1E 201602-T
Information
Thermal shock resistance
(with FPC mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
MID
Conformed to MIL-STD-202F, method 107G
FPC connectors Y5B/Y5BW (0.5mm pitch)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Y5B
A
CAD Data
General tolerance: ±0.3
0.50±0.10
Each mentioned dimension is at the stage of
initial delivery.
(3.70)
1.00±0.10
High current connectors
1.60
(Suction
area)
Terminal coplanarity
(0.30)
0.1
(0.50)
(Contact and
soldering terminals)
B±0.20
Number of pins/
dimension
4
4.00
3.36
1.50
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
4.50
5.00
6.00
7.00
8.00
9.00
10.00
14.00
16.00
17.00
18.00
19.00
22.00
23.00
27.00
3.86
4.36
5.36
6.36
7.36
8.36
9.36
13.36
15.36
16.36
17.36
18.36
21.36
22.36
26.36
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
(1.76)
Narrow pitch connectors
DIMENSIONS (Unit: mm)
2.90
3.20
(0.15)
(1.50)
(FPC
insertion
depth)
(0.32)
(0.15)
Y5B RECOMMENDED FPC/FFC DIMENSIONS
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
(A+1)±0.05
A±0.03
0.50±0.07
0.50±0.03
0.
1.50 min.
(Exposed part
of the conductor)
Active optical connector
MID
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
5
R
0.30±0.03
Cutting direction*
* Cut FPC from the copper foil side
to the reinforcing plate side.
Y5BW
C
1.50
.0
±0
20
(FPC) 0.35±0.03
(FFC) 0.30±0.03
B
Number of pins/
dimension
4
2.50 min.
(Reinforcing plate)
FPC/FFC connectors
C±0.20
A
A
A
0.50±0.10
CAD Data
General tolerance: ±0.3
Information
Holding contacts
(The holding contacts cannot be used as conductors.)
3.70
1.60
(Suction
area)
(1.76)
1.00±0.10
Each mentioned dimension is at the stage of initial
delivery.
Terminal coplanarity
B±0.20
0.1
(0.30)
(Contact, holding
(0.50)
contact and
soldering terminals)
2.90
3.20
(0.15)
D±0.20
C±0.20
(0.32)
(0.15)
(0.32)
(0.15)
–150–
(1.50)
(FPC
insertion
depth)
Number of pins/
dimension
2
4.00
3.36
1.50
0.50
3
4
6
8
10
12
4.50
5.00
6.00
7.00
8.00
9.00
3.86
4.36
5.36
6.36
7.36
8.36
2.00
2.50
3.50
4.50
5.50
6.50
1.00
1.50
2.50
3.50
4.50
5.50
14
22
26
28
30
32
38
40
48
10.00
14.00
16.00
17.00
18.00
19.00
22.00
23.00
27.00
9.36
13.36
15.36
16.36
17.36
18.36
21.36
22.36
26.36
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
6.50
10.50
12.50
13.50
14.50
15.50
18.50
19.50
23.50
A
B
C
D
ACCTB1E 201602-T
Notches type
(A+2)±0.05
A±0.03
0.50±0.03 (Pitch) 0.35±0.03
*1
0.70±0.05
.05
R0.20R±0
0.20±0
.0
5
R0
.25
ma
x.
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
1.00
1.50
2.50
3.50
4.50
5.50
6.50
10.50
12.50
13.50
14.50
15.50
18.50
19.50
23.50
0.30±0.03
R0.20±0.05
0.80±0.05
1.30±0.10
1.50 min.
(Conductor
exposed area)
x.
ma
.25
R0
0.50
*1
Not interfere
conductor
2.50 min.
(Reinforcing plate)
1.00±0.07
Number of pins/
dimension
2
Cutting direction (*2)
(*2) Cut FPC from the copper foil side
to the reinforcing plate side.
A
High current connectors
Y5BW RECOMMENDED FPC DIMENSIONS
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Narrow pitch connectors
FPC connectors Y5B/Y5BW (0.5mm pitch)
• Specifications for taping
Tape I
Tape II
(A +0.3
−0.1 )
(A±0.3)
(C)
(B)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(B)
(1.75)
(D±1)
(1.75)
Taping reel
Embossed carrier tape
380 dia.
(2.0)
(4.0)
(2.0)
(4.0)
Leading direction after packaging
Top cover tape
FPC/FFC connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Label
1.5
.1
+0 0.0
50
1.
0 +00.1
.0
dia
a.
di
.
• Y5B Dimension table (Unit: mm)
Number of pins
4 to 10
12 to 30
32 to 34
40 to 50
Type of taping
Tape I
Tape I
Tape II
Tape II
A
16.0
24.0
32.0
44.0
B
7.5
11.5
14.2
20.2
C
–
–
28.4
40.4
D
17.4
25.4
33.4
45.4
Quantity per reel
5,000
5,000
5,000
5,000
A
16.0
24.0
32.0
44.0
B
7.5
11.5
14.2
20.2
C
–
–
28.4
40.4
D
17.4
25.4
33.4
45.4
Quantity per reel
5,000
5,000
5,000
5,000
Active optical connector
(8.0)
(8.0)
Embossed mounting-hole
Number of pins
2 to 8
10 to 28
30 to 32
38 to 48
Type of taping
Tape I
Tape I
Tape II
Tape II
MID
• Y5BW Dimension table (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
Type
Y5B/Y5BW
Information
Direction
of tape progress
–151–
ACCTB1E 201602-T
FPC connectors Y5B/Y5BW (0.5mm pitch)
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of contact pitch 0.4 mm,
0.5 mm or 0.6 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use our
recommended patterns basically.
Regarding cautions for use, please
refer to page 178.
Please refer to the latest product
specifications when designing your
product.
• Y5B/Y5BW
0.80±0.05
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.40±0.05
1.00±0.05
0.80±0.05
3.30±0.05
0.50±0.05
0.30±0.05
1.00±0.05
Recommended metal mask pattern
0.55±0.01
Metal mask thickness: When 120μm
(Terminal portion opening area ratio: 57%)
(Soldering terminal portion opening area ratio: 100%)
0.40±0.01
1.00±0.01
1.00±0.01
0.80±0.01
3.30±0.01
0.50±0.01
0.25±0.01
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
NOTES
–152–
ACCTB1E 201602-T
V Series
FEATURES
1. Plug connector is equipped with electrical/optical conversion function
(bi-direction, Max. 6 Gbps transmission).
[Transmitter]
Optical fiber
<E/O Converter>
Laser diode
IC
Electrical signal
(Differential signal)
[Receiver]
Optical signal
<O/E Converter>
Electrical signal
(Differential signal)
Receptacle
Photo diode
IC
O/E: Optical/Electrical
conversion
E/O: Electrical/Optical
conversion
2. High speed and wide data rate transmission possible: 20 Mbps to 6 Gbps
3. Integration is possible to a small apparatus with compact, bi-directional
transmission device.
4. Noise reduction and electrical isolation easily achieved.
APPLICATIONS
Recommended for the following high speed device transmission or electrical
isolation applications
• Measuring equipment
• Image processing instrument
• Printer
• Medical equipment
• Industrial robots, etc.
FPC/FFC connectors
Plug
(E/O conversion)
Active optical connector
Active Optical Connector
High current connectors
Vertical insertion type
Narrow pitch connectors
Active Optical Connector V Series
The differential input signal is converted to an optical signal by the Laser Diode Driver (LDD) and Laser Diode (LD) in the
plug.
The optical signal is transmitted through the optical fiber and reproduced as differential output signal by the Photo Diode
(PD) and Trans Impedance Amplifier (TIA).
Differential output
TIA
LD
LD
LDD
Differential input
Differential input
LDD
LD
PD
TIA
Differential output
Information
Optical fiber
LDD: Laser Diode Driver, LD: Laser Diode, TIA: Trans Impedance Amplifier, PD: Photo Diode
–153–
MID
BLOCK DIAGRAM
ACCTB69E 201602-T
Active Optical Connector V Series
Narrow pitch connectors
PRODUCT TYPES
1. Integrated cable and plug
Transmission rate
20 Mbps to 6 Gbps
Transmission specifications
Cable length
50 mm
300 mm
1m
50 mm
300 mm
1m
Bi-direction, 1 channel
Part No.
AYG4V10565M1
AYG4V13065M1
AYG4V1A065M1
AYG4V10565M3
AYG4V13065M3
AYG4V1A065M3
Packing quantity
10 pieces
100 pieces
Active optical connector
FPC/FFC connectors
High current connectors
2. Receptacle (PC board side)
Receptacle
Packing quantity
20 pieces
200 pieces (reel)
SPECIFICATIONS
1. Rated specifications
Item
Supply voltage
Power consumption
Transmission rate
Input/output characteristic impedance
Differential input voltage
Input common mode voltage
Input total jitter
Input rise-time
Input fall-time
Differential output voltage
Output common mode voltage
Output rise-time
Output fall-time
Output total jitter
Min.
3.2
—
0.02
80
200
150
—
—
—
150
150
—
—
—
Typical
3.3
—
—
100
—
—
—
—
—
220
250
—
—
—
Max.
3.4
230
6
125
1200
340
0.24
0.30
0.30
275
275
0.50
0.50
0.60
Unit
V
mW
Gbps
Ω
mV
mV
UI
UI
UI
mV
mV
UI
UI
UI
Condition
—
Bi-direction 1channel
8b/10b coding
—
—
Note 1)
Note 2)
—
—
Note 2)
Note 2)
Note 2)
Note 2)
Note 2), Dj + Rjpp
Notes: 1. When performing AC coupling, the input common mode voltage is 0 to 1.8 V.
2. Input data pattern is PRBS 27-1.
Rjpp is equivalent to BER 10-12.
2. Use conditions
Item
Operating ambient temperature
Performance
Remarks
0°C to +70°C
Relative humidity
-20°C to +50°C (Packaged form)
-20°C to +85°C (Product only)
20% to 80%RH
Electrical static discharge
2kV
Immunity
Electromagnetic interference
Conformed to IEC61000-6-2 standard
Conformed to VCCI class B standard
Storage temperature
No icing or condensation.
No icing or condensation.
No condensation.
Applied 3 times on the external shell
C = 100pF, R = 1.5kΩ
C = 150pF, R = 330Ω
—
—
Information
MID
Part No.
AXK6S20447M1
AXK6S20447M3
–154–
ACCTB69E 201602-T
Active Optical Connector V Series
TERMINAL LAYOUT
Receptacle terminal No.
1 2 3 4 5 6 7 8 9 10
Optical fiber side
Receptacle
11 12 13 14 15 16 17 18 19 20
Name
Open
GND
Differential output −
Differential output +
GND
Open
Open
Power Supply
Power Supply
GND
Open
GND
Differential input −
Differential input +
GND
GND
Power Supply
Power Supply
Power Supply
GND
Wiring
No connection
—
Differential output
Differential output
—
No connection
No connection
3.3V DC
3.3V DC
—
No connection
—
Differential input
Differential input
—
—
3.3V DC
3.3V DC
3.3V DC
—
Information
MID
Terminal layout diagram
(Viewed from the top, receptacle as transparent)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
High current connectors
Specifications and Remarks
Nickel plating
Black
Cross section: 0.4 × 0.6 mm, 2 cores
Terminal (Au-plating on Ni-base)
—
—
—
—
FPC/FFC connectors
Materials
Copper alloy
Elastomer
Silica, UV-cured resin
LCP resin, copper alloy
Glass-fibered epoxy, epoxy resin, etc.
CMOS
GaAs
GaAs
Active optical connector
Component name
Shell
Bushing
Optical fiber
Connector
Photoelectric conversion PC board
IC
LD
Photo diode
Narrow pitch connectors
3. Materials specifications
–155–
ACCTB69E 201602-T
DIMENSIONS (Unit: mm)
1. Integrated cable and plug
External dimensions
12.7
L
9.1
0.60
(3.9)
5.9
0.40
High current connectors
Narrow pitch connectors
Active Optical Connector V Series
L: Cable length
Unit
50
mm
300
mm
1
m
Tolerance
(mm)
+10
−0
+50
−0
+100
−0
Part No.
AYG4V10565
AYG4V13065
AYG4V1A065
2. Receptacle
External dimensions
0.20±0.03
0.95
0.
C
2.80
5.00
3.30
90
0.50±0.05
(1.10)
0.10
0.50±0.05
1.72
(Suction face)
4.20
Active optical connector
FPC/FFC connectors
General tolerance: ±0.3
Lot No. marking
MID
8.20
0.20±0.03
(1.10)
Note 1
4.50±0.1
Note 1: The terminal close to the portion to be soldered have nickel barriers (except nickel portions).
3. Plug and receptacle are mated
6.5
Information
General tolerance: ±0.2
Mated height of plug and receptacle
–156–
ACCTB69E 201602-T
24.0±0.3
11.5
25.4±1
1.75
Leading direction after packaging
• Specifications for the plastic reel (In accordance with EIAJ ET7200B.)
Label
Top cover tape
380 dia.
4
2
Embossed carrier tape
Embossed mounting-hole
Taping reel
12.0
1.5 +0.1
0 dia.
High current connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Receptacle: Embossed tape packaging
• Specifications for taping (In accordance with JIS C 0806:1990.
However, not applied to the mounting-hole pitch of some
connectors.)
Narrow pitch connectors
Active Optical Connector V Series
Receptacle orientation with respect to embossed tape feeding direction
Type
Regarding cautions for use, please
refer to page 181.
Information
MID
Please refer to the latest product
specifications when designing your
product.
Active optical connector
FPC/FFC connectors
Receptacle
Direction
of tape progress
–157–
ACCTB69E 201602-T
Narrow pitch connectors
High current connectors
FPC/FFC connectors
Active optical connectors
MID
Information
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–158–
© Panasonic Corporation 2016
3D Packaging Devices
MID Solutions
Technology introduction
MID Solutions
MIPTEC 3D Packaging Devices
LDS 3D Packaging Devices
MID Package AAM11 Series for IR LED Module
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–159–
© Panasonic Corporation 2016
ACCTB93E 201602-T
Two MID technologies contribute to the creation of
added value in a multitude of devices.
We offer our proprietary “MIPTEC” and “LDS” MID (Three-dimensional injection molded circuit
component) technologies to form circuits on the surfaces of injection molded components. We do this
through custom orders to meet the diverse needs of our customers who seek “miniaturization”, “feature
advancement” and “improve efficiency” in their devices.
FPC/FFC connectors
High current connectors
Narrow pitch connectors
MID Solutions
Active optical connector
Automotive
Medical
Mobile
MID
for Proximity Sensor
Measurement
Information
for Camera Module
MEMS
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–160–
© Panasonic Corporation 2016
ACCTB94E 201602-T
 Feature integration
(mechanical parts +
electrical circuits)
 Component and device
miniaturization
 Reduction in number of
parts and substrates
 Reduced assembly time
Molded component
3D-MID
Circuit
We have achieved 3D packaging devices in which
fine patterning and bare chip mounting is possible
through the advancement of our proprietary
surface activation technology, laser patterning
process, and other methods.
Conductive particles in molded components are
exposed to laser to form fine patterns. Selecting a
molding material that differs from MIPTEC, we can
produce larger molded components.
LDS
Narrow pitch connectors
MID: Molded Interconnect Devices
High current connectors
Molded components with an electrical circuit directly formed on 3D surfaces.
FPC/FFC connectors
 What is MID?
We offer the best solution to match component size and required
specifications.
Miniaturization, fine circuit components, and easy
bare chip mounting
Large components, much freedom in material
selection (PA, LCP, PC, etc.)
MIPTEC
LDS
Pattern width
(μm)
Active optical connector
 MIPTEC and LDS use differentiation
Product chass
1000
(Large components, etc.)
MID
Coarse
300
Proximity sensor
Gyro sensor
Microprojector
Gesture sensor
Camera module
Information
LDS
150
Flash module
MIPTEC
50
Dense
0
2
5
10
30
50
Small
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
400
Size
(mm)
Large
–161–
© Panasonic Corporation 2016
ACCTB94E 201602-T
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
MIPTEC 3D Packaging Devices
What is
?
( Microscopic Integrated Processing Technology )
Through the advancement of MID technology using our proprietary
surface activation technology and laser patterning, among others,
we have achieved 3D packaging devices that make fine patterning
and bare chip mounting a possibility.
 Three achievable merits
Fine patterning and rapid pattern changes.
1 Fine circuit pattern
Laser patterning process
New technology enables fine pattern
electrical circuits on six molded surfaces.
Line/Space = 50μm/50μm patterning is possible.
Also, patterns can be changed by simply changing the
program.
50μm
Component image
2 Improves mounting
Wire-bonding and flip-chip mounting, etc.
Direct mounting of chips is achieved
Extra smoothness in the pattern
section
MID
Achieved by surface activation processing
and original material development
MIPTEC
(Ra0.1μm)
Wire-bonding mounting
Possessing high reflection characteristics, it can be used as an
optical reflection surface.
MIPTEC
Reflection characteristic
250
200
Radiation intensity:
%
30
UP
300
(with the same making current)
Other MID product
150
25
50
DOWN
Radiation intensity:
approx.
%
100
0
Other MID example
(Ra0.8μm)
(N = 5, average values)
350
Radiation intensity, μW
Information
3 Improves reflectance
(with the same radiation intensity)
5
10
15
20
25
30
35
40
Making current, mA
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–162–
© Panasonic Corporation 2016
ACCTB94E 201602-T
Integrate
Miniaturization through
the integration of multiple
components
Receiving section
Positioning
Bend
Positioning bosses and
structure of ribs
Form circuits on folding
and step structure
Curved surface
FPC/FFC connectors
Emitting section
Retain
Tab for securing, etc.
Active optical connector
Form circuits on curved
surfaces
 Added value with circuit pattern using proprietary technology
Smaller, thinner, and more detailed
Point
Improves reflectance and mounting
• Miniaturization by component internalization
• Miniature shapes are possible using fine
patterns (from 50 μm) that were not possible
using previous construction methods.
Camera modules for
medical endoscopes
• Integration of component mounted
circuits with structures (reflectors and
snap fit structures, etc.).
• Wire-bonding mounting
Inductive proximity sensor
for smartphone
Information
Camera modules
for smartphone
Point
MID
For example,
even these
shapes can
be designed!
Narrow pitch connectors
Achieve mechanisms designs that were unthinkable using previous methods.
High current connectors
 Greater variety of device shapes with 3D molding circuits
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–163–
© Panasonic Corporation 2016
ACCTB94E 201602-T
High current connectors
Narrow pitch connectors
LDS 3D Packaging Devices
What is
LDS?
( Laser Direct Structuring )
It was difficult with MIPTEC to meet the following needs:
 Need for increased selection of molding materials
 Need for larger molded components
 Need to form isolated circuits
Now covering these needs, we can offer devices that satisfy customer’s diverse requirements.
 Abundant variation in materials
Active optical connector
FPC/FFC connectors
Various molding materials are available from material manufacturers, such as PA, LCP, and PC.
PA
 Reflow heat resistance
 High circuit adhesion force
(Polyamide)
Material
variation
 Low shrinkage ratio
 Superior dimensional
stability
PC
(Polycarbonate)
LCP
(Liquid crystal polymer)
 High frequency
characteristics
 Reflow heat resistance
MID
Please consult us regarding what is possible or not.
 Also supports large components
Supports a maximum of 200 mm × 400 mm × 150 mm.
Information
Building a process that also supports large components,
we have made it possible to form circuits on product
chassis, etc., which has been very difficult up to now.
 Supports isolated circuits
Isolated circuits and be formed using a nonelectrolytic plating process.
Feeder circuit
If the circuit thickness is thin (down to 10 μm), isolated
circuits can be formed using the nonelectrolytic plating
process.
*Since electroplating does not thicken the membrane, a feeder
circuit is not required for plating.
With feeder circuit (electroplating)
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–164–
No feeder circuit (nonelectrolytic plating)
© Panasonic Corporation 2016
ACCTB94E 201602-T
 Proposed solutions made possible by LDS
Direct circuit formation onto inner side of product chassis
Previously difficult, free and direct circuit formation onto curved surfaces is possible. This greatly
increases product design freedom.
Point
High current connectors
pplication example (automotive)
• Cut component count (molded component and FPC is achieved with LDS units)
• Improved ability to design (circuit wiring possible on complex curved surfaces)
• Reduced assembly steps
On-vehicle antenna
FPC/FFC connectors
Soldered joint
Soldered joint
Thanks to integral structure,
simplification and abbreviation
of assembly and soldered joint
processes are possible.
Soldering joint required
with PC boards held at
a right angle.
Before (image)
Partial shaving and bending of rigid
flexible PC boards or PC boards
Necessary to embed into chassis
with structure that enabled
holding of the PC board angle
Holding of PC board angle and
assembly not required thanks to
integration with chassis.
Before (image)
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–165–
After (image)
© Panasonic Corporation 2016
ACCTB94E 201602-T
Information
MID
Shift lever
After (image)
Active optical connector
A
Narrow pitch connectors
LDS
Narrow pitch connectors
High current connectors
 Comparison of MID processes
Process name
Panasonic
supported
Circuit forming process and characteristics
 Circuit
 Fine
MIPTEC
pattern can be changed by simply changing the CAD data.
patterns are possible by selectively removing only metalized part. (L/S = 50/50 μm)
Primary molding
Metalizing and laser patterning
Plating and etching
Molds one set
 Circuit
Information
MID
Active optical connector
FPC/FFC connectors
 The
LDS
pattern can be changed by simply changing the CAD data.
metal particles in the molded component are made conductive and a circuit pattern is formed. (L/S = 150/200 μm)
Primary molding
Laser patterning
Plating
Molds one set
 Die
correction/re-construction is required for the secondary molding in order to change the circuit pattern.
width is limited by the working surface of the die. (L/S = 150/150μm)
 Pattern
2-shot method
Primary molding
Secondary molding
(Forming the shapes other than the pattern)
the secondary molded part Plating on the catalyst
Catalyst application Melting
(Catalyst remains in the pattern)
Molds two sets
 From Inquiries to Mass Production
1
Technical explanations about MIPTEC and LDS (design rules, restrictions)
8
Prototype die production and prototype sample submission preparation lead-time: Approx. 1 month
2
(NDA signing)
9
Prototype sample evaluation
3
Conceptual drawing and quantity information (Customer  Panasonic)
10
Mass production specifications determination (Specifications and drawing submission)
4
Feasibility study
11
Mass production price quotation
5
Prototype price quotation and brief price quotation of mass-production
12
Mass production die manufacturing
6
Starting specific reviews (Both parties)
13
Start mass production process, evaluation of mass production products
7
Submission of prototype drawing and specifications (Panasonic  Customer)
14
Mass production commencement
Prototype die manufacturing and sample
Mass production die manufacturing
lead-time: Approx. 2 months
*Please contact our sales office for more details.
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–166–
© Panasonic Corporation 2016
ACCTB94E 201602-T
 Specifications
 General process
Process
MIPTEC
LDS
Resin (PPA)
Resin (PA/LCP/PC, etc.)
30 × 65mm/ 50 × 70mm/ 63 × 55.7mm
Possible even without sheet shape
70 × 70 × 20mm
200 × 400 × 150mm
Molding material
Basic sheet size (L × W)
Max. component size (L × W × t)
Normal mode: ±0.05mm or less, High accuracy mode: ±0.03mm or less
±0.05mm or less
Possible by changing the laser patterning data (However, mold modification is required when changing component shape.)
Pattern change
Pattern pitch
Line / Space = 50/50μm
Plating specifications (standard)
Line / Space = 150/200μm
Cu: 10μm, Ni: 6μm, Au: 0.1μm *Thickness can be changed. For this and other conditions, please consult us.
Circuit surface roughness
Ra 0.1 to 0.4μm
Ra 0.8 to 2.0μm
○ Possible
○ Possible
Wire bonding ability
○ Possible
△ Possible with limitations to specifications
Flip chip mountability
○ Possible
× Not possible
FPC/FFC connectors
Solderability
 Molding material
Circuit adhesion strength (initial)
Specific gravity
Molding material for MIPTEC
Unit
Polyphthalamide (PPA)
N/mm
0.39 or higher
−
1.63
Mass%
0.2
Resistance to soldering heat
°C
260
Deflection temperature under loading (1.82MPa)
°C
260
Linear coefficient of thermal expansion (MD/TD)
X10-5°C
1.5/4.5
%
0.42/1.00
MPa
110
Moisture absorption rate
Molding shrinkage rate (MD/TD)
Tensile strength
Elongation
%
2.3
Bending strength
MPa
180
Bending elasticity
GPa
12.5
Specific dielectric constant
−
3.9 (3GHz)
Dielectric loss tangent
−
0.007 (3GHz)
Active optical connector
Item
High current connectors
One set (Molded die only)
Number of required molding dies
Positional accuracy of mold and circuit
Narrow pitch connectors
Specifications
MID
* The values shown above are typical values, not guaranteed values. The values vary by molding condition etc.
* Please consult us for other molding and plating materials.
 Design guidelines
øc
 Cross section of
through hole
øc
øc
(A) Singular cone
(B) Dual cone
*If plating will not be performed, straight through-holes are possible. Please
consult us.
MIPTEC
LDS
Min pattern width (a)
50µm
150µm
Min. pattern spacing (b)
50µm
200µm
0.25mm
0.25mm
2
(A) Singular cone 1 (B) Dual cone 2
Min pin diameter (e)
0.1mm
0.1mm (Plating e’: from 0.1 mm to 30° taper)
Max pattern angle (f)
90°
90°
Min.0.3mm (Partly 0.15 mm)
Min.0.3mm (Partly 0.15 mm)
Min through-hole diameter (c)
Max aspect ratio (d/c)
Min molding thickness
*The values shown above are typical values. Please consult us for concrete form.
*A circuit pattern can be formed on the bottom surface via a through-hole. *Delivery is made in sheet form or individual pieces.
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–167–
© Panasonic Corporation 2016
ACCTB94E 201602-T
Information
d
MID Package AAM11
AAM11
MID Package
FEATURES
1. Realization of small, low-profile
reflector package through application
of our unique MID* technology
(MIPTEC).
Individual piece: 2.3 × 1.95 × 0.9 mm
<Cross section of package>
IR LED chip
Concave reflector
structure (Au-plating)
Enabled
reduction
in profile to
under 1 mm
Individual piece
(cut shape)
Resin molded component (Black)
RoHS compliant
Note: LED chip to be prepared and mounted separately
by the customer.
2. A concave reflector structure with
good directivity and increased light
extraction efficiency due to bright
plating specifications contributes to
decreased module power
consumption
* The graph below uses typical values, and details will
vary according to the LED chip specifications.
MIPTEC
(N = 5, average values)
350
Radiation intensity, μW
FPC/FFC connectors
High current connectors
Narrow pitch connectors
For Infrared Ray LED Module
300
250
200
When the same making current
Radiation intensity:
approx. 30% rise
150
Other MID product
100
When the same radiation intensity
Making current:
approx. 25% decrease
50
0
5
* MID (Molded Interconnect Devices): Molded
components with an electrical circuit formed on 3D
surfaces.
10
15
20
25
30
35
40
Making current, mA
Active optical connector
APPLICATIONS
1. Light projection type Inductive
proximity sensor package
• Smartphone display control
• Finder control of single-lens reflex
2. IR LED lighting for surveillance
camera
ORDERING INFORMATION
MID
AAM 1
1
0
1
0
6
Molding material/Size of sheet
1: PPA (Black)
50 × 70 mm
Unit size (2 digits)
01: 2.3 × 1.95 × 0.9 mm
Information
Focal length (2 digits)
06: 0.06 mm*
Au-plating thickness
1: 0.1±0.05 μm
2: 0.2±0.1 μm
3: 0.3±0.1 μm
* For requests of products with different focal lengths, please contact our sales office.
–168–
ACCTB54E 201602-T
MID Package AAM11
Focal length
0.06 mm
Focus
Polyphthalamide
(PPA) Black
2.3 × 1.95 mm
h = 0.9 mm
(436 pieces/sheet)
50 × 70 mm
Distance from the bottom
surface of the mounted LED
chip to the focal section
Au-plating
thickness
(μm)
Part number
(Delivered in sheet form)
0.1±0.05
AAM1101061
0.2±0.1
AAM1101062
0.3±0.1
AAM1101063
Packing
(one carton)
6 trays
(Contains 432 sheets)
Notes: 1. This product is delivered in sheet form, and customers are required to mount the LED chips and cut the sheet into individual pieces.
2. For requests of focal lengths other than those mentioned above, please contact our sales office.
3. For requests of evaluation samples, please contact our sales office.
SPECIFICATIONS
Product specifications (Measurement conditions: 25±3°C unless stated otherwise)
Item
Specifications
13±7 μm
6±4 μm
0.1±0.05 μm (AAM1101061)
0.2±0.1 μm (AAM1101062)
0.3±0.1 μm (AAM1101063)
19±11 μm
0.39 N/m or higher (initial) Measured after Au-plating
Cu-plating
Ni-plating
Plating thickness
Au-plating
Total thickness
Plating adhesion strength (Measurement area refer to product drawing)
–20°C to 50°C
Maximum temperature when applying an electrical current: 85°C
15% to 85%RH
86 kPa to 106 kPa
Temperature
Ambient environment
(No icing and condensation at low
temperatures)
Humidity
Pressure
Active optical connector
DIMENSIONS (Unit: mm)
1. Sheet dimensions (Delivered form)
50±0.3
1.5
46.5±0.3
2.05 (Bowl pitch)
2.525
R0
.7
High current connectors
Appearance of
individual piece
FPC/FFC connectors
Material of molding
sheet
Appearance of sheet
Narrow pitch connectors
PRODUCT TYPES
2.05 (Bowl pitch)
2.525
B
MID
2.91 (Bowl pitch)
A
.
dia
Information
1.5
1.5
70±0.3
66.8±0.3
2
.
2-1
dia
B
B-B cross section
(TOP VIEW)
(BOTTOM VIEW)
–169–
ACCTB54E 201602-T
MID Package AAM11
Narrow pitch connectors
2. Individual piece (cut shape)
0.1
(Cut width)
0.1
(Cut width)
1.95
C
0.227
(WB area)
0.366
(WB area)
High current connectors
(2.28)
(0.17)
(2.3)
2.3
(Including pattern)
0.075 (Gap distance)
0.
7
di
a.
C
0.3 (TOP-WB)
H (TOP-DB)
0.9
(Including individual piece height and pattern)
Detail drawing A
Taper 0.5°
C-C cross section
NOTES
1. Handling during storage
1) Although the outermost surface is coated in Au-plating, if
exposed to atmospheres containing corrosive gases, humidity or
at high temperature, the underlying nickel or copper may corrode
causing discoloration of the plated surface, decreasing
reflectance, and this may lead to decreased mountability or joint
reliability of LED components or soldering. Therefore, please
pay close attention to the atmosphere used for storage.
Recommended soldering temperature conditions
2) Storage conditions (“After opening” refers to after opening the
packing bag)
The following conditions must be followed in order to maintain
plating adhesive strength and external performance.
Temperature
Humidity
Pressure
Storage life (*2)
Before opening
15°C to 35°C
RH25% to 75%
86 kPa to 106 kPa
3 months
After opening
23°C±3°C
RH50% or less
86 kPa to 106 kPa
1 month (*1)
10 sec or less
260
250
200
180
130
~150
40 sec or less
60 to
110 sec
70 sec or less
40
Times, sec
Please refer to the latest product specifications when
designing your product.
*1: Please keep it in desiccator set into the clean room.
*2: The storage life means the length from the date (lot number) printed on
packaging.
Information
MID
2. Soldering
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please contact us
before using a temperature profile other than that described
below.
Surface temperature of molded
components (package), °C
Active optical connector
FPC/FFC connectors
General tolerance: ±0.1
–170–
ACCTB54E 201602-T
Continued usage in a state of degraded
condition may cause the deteriorated
insulation, thus result in abnormal heat,
smoke or firing. Please carry out safety
design and periodic maintenance
including redundancy design, design for
fire spread prevention, and design for
malfunction prevention so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of failure of the
products or ending life of the products.
Regarding the design of devices and PC board patterns
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) PC board
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Connector
Spacer
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) When mounting connectors on a FPC
board:
• When the connector soldered to FPC is
mated or unmated, solder detachment
may occur by the force to the terminals.
Connector handling is recommended in
the condition when the reinforcing plate is
attached to the backside of FPC where
the connector is mounted. The external
dimension of the reinforcing plate is
recommended to be larger than the
dimension of “PC board recommended
process pattern” (extended dimension of
one side is approximately 0.5 to 1.0 mm).
The materials and thickness of the
reinforcing plate are glass epoxy or
polyimide (thickness 0.2 - 0.3 mm) or
SUS (thickness 0.1 - 0.2 mm).
• As this connector has temporary locking
structure, the connector mating may be
separated by the dropping impact
depend on the size, weight or bending
force of the FPC. Please consider the
measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the chucking force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
–171–
6) In case of dry condition, please note
the occurrence of static electricity.
The product may be adhered to the
embossed carrier tape or the cover tape
in dry condition.
Recommended humidity is from 40%RH
to 60%RH and please remove static
electricity by ionizer in manufacturing
process.
ACCTB48E 201602-T
High current connectors
Corporation cannot guarantee the quality
and reliability.
3) Panasonic Corporation is consistently
striving to improve quality and reliability.
However, the fact remains that electrical
components and devices generally cause
failures at a given statistical probability.
Furthermore, their durability varies with
use environments or use conditions. In
this respect, please check for actual
electrical components and devices under
actual conditions before use.
FPC/FFC connectors
1) Do not use these connectors beyond
the specification sheets. The usage
outside of specified rated current,
dielectric strength, and environmental
conditions and so on may cause circuitry
damage via abnormal heating, smoke,
and fire.
2) In order to avoid accidents, your
thorough specification review is
appreciated.
Please contact us if your usage is out of
the specifications. Otherwise, Panasonic
Active optical connector
About safety Remarks
MID
Notes on Using Narrow pitch Connectors/
High Current Connectors
Information
For board-to-board/board-to-FPC
Narrow pitch connectors
Notes on Using Narrow pitch Connectors/High Current Connectors
Notes on Using Narrow pitch Connectors/High Current Connectors
Information
MID
Active optical connector
■ Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
Terminal
8) Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
Peak temperature
25 sec.
60 to 120 sec.
• Narrow pitch connector (P8)
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Temperature
245°C max.
Apply the solder
wire here
Peak temperature
200°C
155 to 165°C
Preheating
Terminal
Paste
solder
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
70 sec.
Time
60 to 120 sec.
PC board
foot pattern
220°C
200°C
Preheating
■ Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Regarding soldering
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
9) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
10) Consult us when using a screenprinting thickness other than that
recommended.
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
■ Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
–172–
ACCTB48E 201602-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Press-fitting while the mating
inlets of the socket and
header are not matched.
Strongly pressed and twisted
High current connectors
Tilted mating
Cleaning flux from PC board
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
FPC/FFC connectors
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
Handling the PC board after mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Product failures due to condensation
are not covered by warranty.
MID
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Active optical connector
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown right.
Narrow pitch connectors
Precautions for mating
–173–
Information
Other Notes
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
ACCTB48E 201602-T
Notes on Using Narrow pitch Connectors/High Current Connectors
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Regarding sample orders to confirm proper mounting
–174–
ACCTB48E 201602-T
Notes on Using High Current Connector L2
–175–
Upper limit (Solder heat resistance)
Lower limit (Solder wettability)
220°C
200°C
70 sec.
Time
• Infrared reflow soldering is able to passed two times.
• The temperature is measured on the PC board surface near
the receptacle.
• The condition of solder or flux creepage and wettability depend
on the type of solder and flux. Please set the reflow temperature
and oxygen level by considering the solder and flux
characteristics.
• When the coating material is used for preventing PC board
isolation deterioration after soldering, please assure the coating
material is not adhered on any part of receptacle.
• Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
(Unit: mm)
Recommended PC board Pattern
(mounting pad layout)
(TOP VIEW)
5.40±0.03
2.90±0.03
Note 1)
Jig area
(1.56)
High current connectors
25 sec.
60 to 120 sec.
FPC/FFC connectors
180°C
150°C
Peak temperature
Preheating
Active optical connector
Temperature
260°C
230°C
0.72±0.03
Notes: 1) Do not mount any parts in the jig area.
2)
Pad area (Two pads must be connected.)
3)
Resist processing on the copper foil. (For solder outflow prevention.)
4) The open window area of solder screen is the same as pad area.
[t = 0.12 mm (Screen thickness)]
• As the excessive force on the receptacle may cause the
deformation and the integrity of solderability will be lost during
reflow soldering, please avoid dropping or rough handling of the
receptacle.
• When cutting the PC board after mounting the receptacle,
please avoid the stress at the soldering portion.
ACCTB76E 201602-T
MID
(8.00)
Information
■ Mounting of receptacle
1) PC board design
• Refer to the recommended PC board pattern for keeping the
strength of soldering.
2) Receptacle mounting
• When mounting, if there is too much suction nozzle pressure,
the receptacle might deform and break. Please check
beforehand.
• To mount the receptacle, place the adsorption nozzle within the
adsorption range shown in the specification diagram and pay
careful attention not to cause the receptacle to deform.
• In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity
is from 40%RH to 60%RH and please remove static electricity
by ionizer in manufacturing process.
3) Soldering
(1) Manual soldering
This product is not designed to be mounted by manual
soldering.
(2) Reflow soldering
• When cream solder printing is used, screen method is
recommended.
• The relation between the screen opening area and PC board
foot pattern area should be referred to “Recommended PC
board Pattern”.
• Please avoid the excessive solder. Because the excessive
solder makes contact failure by creepage.
• When applying the different thickness of a screen, please
contact us.
• There may be a case of difficult self-alignment depending on
the connector positions.
In that case, please be careful to align terminals and solder
pads.
• The following diagram shows the recommended reflow
soldering temperature profile.
(4.00)
■ Safety precautions
Observe the following safety precautions to prevent accidents
and injuries.
1) Do not use these connectors beyond the specification sheets.
The usage outside of specified rated current, dielectric strength,
and environmental conditions and so on may cause circuitry
damage via abnormal heating, smoke, and fire.
2) In order to avoid accidents, your thorough specification review
is appreciated.
Please contact us if your usage is out of the specifications.
Otherwise, Panasonic Corporation cannot guarantee the quality
and reliability.
3) Panasonic Corporation is consistently striving to improve
quality and reliability.
However, the fact remains that electrical components and
devices generally cause failures at a given statistical probability.
Furthermore, their durability varies with use environments or use
conditions. In this respect, please check for actual electrical
components and devices under actual conditions before use.
Continued usage in a state of degraded condition may cause the
deteriorated insulation, thus result in abnormal heat, smoke or
firing. Please carry out safety design and periodic maintenance
including redundancy design, design for fire spread prevention,
and design for malfunction prevention so that no accidents
resulting in injury or death, fire accidents, or social damage will
be caused as a result of failure of the products or ending life of
the products.
Narrow pitch connectors
Notes on Using High Current Connector L2
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Notes on Using High Current Connector L2
■ Remarks
1) This product has simple lock structure for mating. However,
applying load to the wire or drop impact may cause the wire to
be disconnected. Please take countermeasures at the
equipment for preventing removal of wire.
2) Provide a sufficient insulation distance between receptacles
and between the ground and receptacle. Make sure that the
insulation distance is based on the safety standards of each
country.
3) Design the line to have redundancy by leaving some extra
length for the wire so as not to cause the tensile force of the wire
generated by the thermal expansion and contraction of PC
board to apply load to the receptacle.
X
■ Mating of wire
1) When mating the wire, use the recommended mating jig.
(1) Positioning of wire
Position the wire so that it will come to the center of the
receptacle.
Min. 1.5mm Min. 1.5mm
X
Y
(2) Setting of the mating jig
Check the positions of the receptacle through the hole in the jig,
and then push the jig in the receptacle side.
When pushing the jig in the receptacle side, pay careful attention
not to cause the jig to become misaligned. Misalignment of the
jig will damage the receptacle.
Y
4) Do not use the wire at the movable part. Doing so will cause
the receptacle to become deformed or the wire to be
disconnected.
X
Y
Check the positions of the receptacle.
X
Active optical connector
Y
5) If the wire needs to be bent at the edge of the PC board,
mount the receptacle so that the wire will bend at its insulation
portion. Bending the wire at its core portion may cause the wire
to get broken.
X
Y
Push the jig in the receptacle side.
Z
Z
Y
Y
6) Do not remove or insert the electrified wire (in the state of
carrying current or applying voltage).
Z
MID
Y
Z
■ Applicable wires
1) The following diagram shows wire strip length for stripping the
wire in order to use a mating jig. (Consult us when using the
mold cover.)
Information
7.5mm
Min. 8.4mm
(3) Mating state
Ensure that the wire is connected to the given position.
(The core must be lower than the receptacle lock part.)
Min. 8.4mm
Core
5.4mm
Insulation
2) To strip the insulation, keep the core straight and protect it
from any flaw and deformation. Deformation of the core will
cause the receptacle to be deformed.
Receptacle lock part
Z
Z
Y
X
2) Do not twist the jig to insert it. Doing so will cause the
receptacle to be deformed or broken down, or the soldered
portion to be peeled off.
3) This product is not designed to be used for stranded wires
(including spare solder).
X
Y
–176–
ACCTB76E 201602-T
Pay attention to the position of the jig and do not apply an
excessive load to the wire. Otherwise, the receptacle may be
deformed.
Z
Y
Z
4) When the soldering is not completed, do not connect the wire
to the receptacle. And the external compulsory force to the
receptacle may cause the coplanarity failures.
5) Secure jig areas shown in the recommended PC board
pattern.
X
(3) Removal way of wire
Remove the wire by lifting the jig straight up at a vertical angle to
the receptacle. Lifting the jig at a slant may cause the
deformation of receptacle.
■ Removal of wire
1) Prepare for a removal jig by reference to drawing and follow
the steps for removal as shown below.
(For a removal jig drawing, please contact our sales office.)
High current connectors
3) Do not use the receptacle in a half-mating state. Doing so will
result in a conduction failure. Ensure that the wire is completely
connected.
Narrow pitch connectors
Notes on Using High Current Connector L2
Y
X
Z
X
Removal jig
2) Reuse of disconnected wire is not allowed. The disconnected
wire has a scratch and a deformed shape.
Z
FPC/FFC connectors
Z
(1) Setting of removal jig
Insert the tip of the removal jig under the wire from the side of
receptacle.
Y
Active optical connector
X
(2) Positioning of removal jig
Make sure that the tip of the removal jig is under the wire.
Z
Y
MID
X
Z
Y
X
Information
Z
–177–
ACCTB76E 201602-T
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Notes on Using FPC Connectors
Notes on Using FPC Connectors
■ About safety Remarks
• Do not use these connectors beyond the specification sheets.
The usage outside of specified rated current, dielectric strength,
and environmental conditions and so on may cause circuitry
damage via abnormal heating, smoke, and fire.
• In order to avoid accidents, your thorough specification review
is appreciated.
Please contact us if your usage is out of the specifications.
Otherwise, Panasonic Corporation cannot guarantee the quality
and reliability.
• Panasonic Corporation is consistently striving to improve
quality and reliability.
However, the fact remains that electrical components and
devices generally cause failures at a given statistical probability.
Furthermore, their durability varies with use environments or use
conditions. In this respect, please check for actual electrical
components and devices under actual conditions before use.
Continued usage in a state of degraded condition may cause the
deteriorated insulation, thus result in abnormal heat, smoke or
firing. Please carry out safety design and periodic maintenance
including redundancy design, design for fire spread prevention,
and design for malfunction prevention so that no accidents
resulting in injury or death, fire accidents, or social damage will
be caused as a result of failure of the products or ending life of
the products.
■ PC board design
• Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
• In order to facilitate the connector mount, make sure to design
the board with reduced warpage.
• Please design and pay attention to the distance from the board
edge to the pattern. When cutting the board, do not give an
excessive stress to the connector, which risks damaging the
connector.
(Y3BW/Y5BW)
• Depending on FPC dimension and FPC insertion location,
there is a possibility that the holding contact and an FPC pattern
of both end of signal contacts are in short-circuited.
Please design the equipment not to be affected even if a board
pattern of holding contacts and an FPC pattern of both end of
signal contacts are in short-circuited.
(For example: Do not connect a board pattern of holding
contacts and GND. If connect a board pattern of holding
contacts and GND, also connect board pattern of both end of
signal contacts.)
■ FPC and equipment design
• Design the FPC based with recommended dimensions to
ensure the required connector performance.
• When back lock type is used, secure enough space for closing
the lever and for open-close operation of the lever.
• Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
• Due to the FPC size, weight, or the reaction force of the routed
FPC, FPC removed and connector deformation may occur by a
fall, vibration, or other impact.
When using FPC connector for smart phones, cellular phones
and other applications which require falling resistance, please
pay attention to precautions.
• Carefully check the equipment design and take required
measures to prevent the FPC removed.
• If the shock of falling, vibration is applied to the FPC, please
design the equipment not to be applied a load to connector, such
as fixing the FPC.
• Make sure to design the FPC insertion part with reduced
warpage. Otherwise, the warpage may adversely affect the FPC
insertion.
(Y4BH)
When using in high-speed transmission applications,
please take care when designing the FPC, because the
differential impedance values may be uneven depending on
FPC dimensions settings, uneven dimensions, and layering
composition.
(Y3BW/Y5BW)
■ The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the
connector, and the shape of the soldered portions is the
same as that of the signal contacts.
Use caution to ensure connect identification.
(Y3BL)
■ Soldering terminal structure
• Since soldering terminals touch FPC, note that the short
circuit may occur when the metal parts exposed on side of
FPC.
• Depending on FPC dimension, there is a possibility that
soldering terminals and an FPC pattern of both end of signal
contacts are in short-circuited.
Please design the equipment not to be affected even if a
board pattern of soldering terminals and an FPC pattern of
both end of signal contacts are in short-circuited.
(For example: Do not connect a board pattern of soldering
terminals and GND. If connect a board pattern of soldering
terminals and GND, also connect board pattern of both end of
signal contacts.)
■ Connector mounting
• Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
• In case of dry condition, please note the occurrence of static
electricity.
The product may be adhered to the embossed carrier tape or
the cover tape in dry condition.
Recommended humidity is from 40%RH to 60%RH and please
remove static electricity by ionizer in manufacturing process.
–178–
ACCTB13E 201602-T
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Temperature
260°C
230°C
180°C
Peak temperature
Preheating
220°C
200°C
■ When cutting or bending the PC board after mounting the
connector, please avoid the stress at the soldering portion.
No stress here
■ PC board
As thick coverlay / solder resist and adhesive may cause poor
soldering, please set thickness of coverlay and adhesive as thin
as possible.
■ Precautions for insertion/removal of FPC
(Except for Y3BC)
• Avoid touching the lever (applying any external force) until
an FPC is inserted.
Do not open/close the lever without an FPC inserted. Failure
to follow this instruction will cause the contacts to warp,
leading to the contact tips to interfere with the insertion of an
FPC, deforming the terminals. Failure to follow this
instruction may cause the lever to be removed, terminals to
be deformed, and/or the FPC insertion force to increase.
High current connectors
■ When the soldering is not completed, do not open/ close
the lever or insert/ remove an FPC.
And the external compulsory force to the terminal may
cause the fixing force lowering between the terminal and
the molding or the coplanarity failures.
In addition, do not insert an FPC into the connector before
soldering the connector.
FPC/FFC connectors
■ As the excessive force on the terminals may cause the
deformation and the integrity of solderability will be lost
during reflow soldering, please avoid dropping or rough
handling of the product.
Active optical connector
3) Rework of soldering portion.
• Rework shall be only one time.
• Please avoid the supplementary flux in case of rework for
soldering bridge, as this may cause flux creepage to contact
portion.
When adding the solder for reworking, do not add an excessive
solder.
• Please use the soldering iron under specified temperature.
MID
■ Soldering
1) Manual soldering
• As this product is compact size, please avoid the excessive
solder. Because the excessive solder makes creepage and flux
wicking at contact portion, or impact contact by soldering
interference.
• Please use the soldering iron under specified temperature and
times.
• Soldering flux may contaminate the contact portion, please
check the contact portion after soldering with a magnifying
glass. If the contamination is found, please clean the
contamination before use.
• As excessive force to terminal by manual soldering has some
possibilities of contact portion deformation, please be careful to
the force by hand.
• Please clean soldering iron tip.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any flux solder use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• When cream solder printing is used, screen method is
recommended.
• To achieve the appropriate soldering state, make sure that the
reflow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes flux climbing up.
• A screen thickness of 120μm is recommended during cream
solder printing.
• When applying the different thickness of a screen, please
contact us.
• There may be a case of difficult self-alignment depending on
the connector size. In that case, please be careful to align
terminals and solder pads.
• The following diagram shows the recommended reflow
soldering temperature profile.
Narrow pitch connectors
Notes on Using FPC Connectors
25 sec.
150°C
60 to 120 sec.
Without an FPC inserted
70 sec.
• Infrared reflow soldering is able to passed two times.
• The temperature is measured on the PC board surface near
connector terminals.
• The condition of solder or flux creepage and wettability depend
on the type of solder and flux. Please set the reflow temperature
and oxygen level by considering the solder and flux
characteristics.
• Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
• When performing reflow soldering on the back of the PC board
after reflow soldering the connector, secure the connector using,
for example, an adhesive.
(Double reflow soldering on the same side is possible.)
Do not apply reflow heating while a lever is closing (or on the
way of closing). The terminals may be deformed by reflow
heating with a lever is closing (or on the way of closing).
–179–
• These connectors are of the back lock type, which has the FPC
insertion section on the opposite side of the lever.
Be careful not to make a mistake in the FPC insertion position or
the lever opening/closing position. Otherwise, a contact failure or
connector breakage may occur.
• Do not insert an FPC upside down. Inserting an FPC in a
direction opposite to that you intended may cause an operation
failure or malfunction.
• Insert an FPC with the lever opened at right angle, that is, in
the factory default position.
ACCTB13E 201602-T
Information
Time
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Notes on Using FPC Connectors
• After checking the position of FPC insertion slot and FPC,
completely insert the FPC horizontally to the full depth of the
connector without altering the angle.
An FPC inserted at an excessive angle to the board may cause
the deformation of metal parts, crack of molding parts, FPC
insertion failures, and FPC circuit breakages.
• Insert the FPC into the connector after checking the position of
FPC insertion slot and FPC. Do not insert the FPC without
positioning the FPC and connector. Otherwise, it may cause
connector breakages. When it is hard to insert the FPC, do not
insert the FPC on that condition. Confirm the FPC and
connector positioning.
• Do not apply an excessive load to the lever in the opening
direction beyond its open position; otherwise, the lever may be
deformed or removed.
• Do not apply an excessive load to the lever in a direction
perpendicular to the lever rotation axis or in the lever opening
direction; otherwise, the terminals may be deformed, and the
lever may be removed.
• To close the lever, turn down the lever by pressing the entire
lever or both sides of the lever with fingers tips. And close the
lever completely. Be careful not to apply partial load to the lever
that may cause its deformation or destruction or lever going back
to initial position.
Close the lever completely to prevent contact failure.
• Avoid applying an excessive load to the top of the lever during
or after closing the lever. Otherwise, the terminals may be
deformed.
• When opening the lever to remove the FPC, rotate the lever to
the initial position. Do not push the lever into the FPC inlet side
and ensure that the lever will not go over the initial position;
otherwise, it may be deformed or broken.
• To open the lever, if pressure to the lever is applied unevenly,
such as to an edge only, it may deform or break.
• Do not open the lever forcefully with something sharp tool,
otherwise, the lever may be deformed.
• Remove the FPC at parallel with the lever fully opened. If the
lever is closed, or if the FPC is forcedly pulled, the product or
FPC may break.
• If a lever is accidentally detached during the handling of a
connector, do not use the connector any longer.
■ After an FPC is inserted, carefully handle it so as not to
apply excessive stress to the base of the FPC. When using
FPC with a bent condition, please pay attention to
precautions below; otherwise, in some conditions it may
cause conduction failure, connector breakage, unlocking
lever or FPC disconnection.
• Design so that a load is not applied to connector directly by
FPC bending.
• Avoid sharp FPC bending at the root of FPC insertion part.
• Design so that a load is not applied to the part of FPC bending.
• If there might be a load on FPC, please fix the FPC.
(Y3BW and Y5BW)
• Fix the FPC if there might be a load to the cut out, do not apply
bending load to the cutout part of FPC. Otherwise, it may cause
FPC disconnection and deformation since the cutout part of
FPC is subjected to bending stress.
FPC cutout part
■ Cleaning treatment
Cleaning this product is not needed basically.
Please note the following points to prevent the negative effect to
the product when cleaning is necessary.
• Please keep the cleanliness of the cleaning fluid to make sure
that the contact surfaces are not contaminated by the cleaning
fluid itself.
• Semi-aqueous cleaning solvent is recommended as some
powerful solvent may dissolve the molding portion or the marked
letters.
Please contact us when other solvent is used.
■ Precautions for operating environment and storage
environment
Panasonic Corporation does not guarantee the failures caused
by condensation.
■ Other precautions
• When the coating material is used for preventing PC board
isolation deterioration after soldering, please assure the coating
material is not adhered on any part of connector.
• Please avoid the usage of connector as electric switching
basically.
• There is no problem on the product quality though the swelling,
the black spot, the small scars and the foreign matter, etc. might
be generated in the molding parts.
• There is no problem on the product quality though the weld line
might be generated in the weld part of molding parts when the
use of product is within the specifications.
• The detailed shape of metal parts and molding parts may differ
depending on the mold.
• Height in FPC mating depends on the way to being used, such
as mounting condition, thickness of FPC, and angle of lever lock
etc. Please check it by actual equipment.
Please refer to the latest product specifications when
designing your product.
–180–
ACCTB13E 201602-T
Ex)
10) Plug removal
For the removal operation, hold both sides of the metal
enclosure and lift the plug upward.
* Do not pull the optical fiber and bushing.
Enclosure
metal side
11) Plug insertion
Because this product has been designed with a thin mating
structure between the plug and receptacle for compact-sizing
purposes, excessive tilting during insertion or removal leads to
product fracture and separation of the solder section of
terminals.
For avoiding breakage of the mating parts, confirm the alignment
before mating.
Securing
with tape
5) Use caution for wiring the optical fiber to avoid getting
entangled or twisting. Also, use adhesive tape for securing the
optical fiber for preventing excessive stress caused by vibration
and impact.
–181–
High current connectors
Enclosure
metal side
Bushing
Optical fiber
FPC/FFC connectors
Insertion
MID
■ Cautions when using the product
Please use the product in accordance with the conditions
described in these specifications.
The product quality cannot be warranted if the product fails
because it is used outside the conditions in these specifications.
1) Cautions about the operating and storage environments
• Product failure due to condensation cannot be warranted.
• Use caution for avoiding dust.
• The following environment may deteriorate the product’s
appearance and affect the product characteristics, and should
thus be avoided.
• An environment in which the possible adherence of
chemicals such as acid and alkali exists.
• In a gaseous atmosphere of salt, sulfide, etc.
2) This product has a structure requiring an insertion force for
mating, but the mating may come off when an external force is
applied to the plug, impact is applied by dropping, or vibration is
applied in equipment. Sufficient caution should be used with the
equipment to avoid such incidents.
3) The product cannot be used in a movable parts while the
optical fiber is bent. Such use may cause deformation of the
receptacle or breakage of the optical fiber.
4) In order to avoid a load on the plug and receptacle applied by
the tensile force of the optical fiber, a redundant design is
required with respect to the optical fiber length.
6) Insertion and removal operations must be performed while the
power is off.
Insertion or removal operations in a live condition (with current
and voltage) may lead to a breakage.
7) Use caution with regard to the generation and handling of
static electricity in the operating environment to protect the plug.
8) Secure sufficient insulation distance between the external
metal enclosure of the plug and the peripheral components. The
plug enclosure, which is connected to the ground, may give rise
to danger from a short-circuit.
9) Mating of plug
• Mating direction
Mating of the plug and receptacle requires orientation. Align
the receptacle shape in the direction of the optical fiber of
plug.
• Mated condition
Make sure the plug is securely inserted into the receptacle.
After mating, a gap remains between the PC board and plug.
Avoid applying excessive pressure.
Information
■ About safety Remarks
1) Do not use these connectors beyond the specification sheets.
The usage outside of specified rated current, dielectric strength,
and environmental conditions and so on may cause circuitry
damage via abnormal heating, smoke, and fire.
2) In order to avoid accidents, your thorough specification review
is appreciated.
Please contact us if your usage is out of the specifications.
Otherwise, Panasonic Corporation cannot guarantee the quality
and reliability.
3) Panasonic Corporation is consistently striving to improve
quality and reliability.
However, the fact remains that electrical components and
devices generally cause failures at a given statistical probability.
Furthermore, their durability varies with use environments or use
conditions. In this respect, please check for actual electrical
components and devices under actual conditions before use.
Continued usage in a state of degraded condition may cause the
deteriorated insulation, thus result in abnormal heat, smoke or
firing. Please carry out safety design and periodic maintenance
including redundancy design, design for fire spread prevention,
and design for malfunction prevention so that no accidents
resulting in injury or death, fire accidents, or social damage will
be caused as a result of failure of the products or ending life of
the products.
Active optical connector
Notes on Using Active Optical Connector V Series
Narrow pitch connectors
Notes on Using Active Optical Connector V Series
12) When the product is used in a different environment and in
accordance with a method other than described in this
document, please consult us.
ACCTB92E 201602-T
Notes on Using Active Optical Connector V Series
0.50±0.01
0.23±0.01
(1.90)
(1.50)
0.50±0.01
6.00±0.01
(1.50)
(2.00)
6.00±0.05
3.00±0.01
6.00±0.01
0.35±0.01
0.115±0.01
2.20±0.01
0.50±0.01
0.23±0.01
0.35±0.01
0.115±0.01
Paste
solder
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
• Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
Peak temperature
Preheating
220°C
200°C
25 sec.
60 to 120 sec.
70 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
–182–
■ Manual soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Apply the solder
wire here
ld
iro erin
n g
■ Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
PC board
foot pattern
MID
Metal mask thickness: When 120μm
(Opening ratio: 87%)
Regarding soldering (for Receptacle)
Terminal
Information
Recommended metal mask pattern
Metal mask thickness: When 150μm
(Opening ratio: 69%)
0.50±0.01
2.00±0.05
0.75±0.05
0.125±0.05
0.50±0.05
0.25±0.05
(2.00)
0.50±0.05
Recommended metal mask pattern
(1.90)
Recommended PC board pattern (TOP VIEW)
So
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
■ Receptacle
Terminal
Small angle as
possible up to
45 degrees
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
■ Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
ACCTB92E 201602-T
Notes on Using Active Optical Connector V Series
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
Narrow pitch connectors
Handling Single Components (for Receptacle)
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
Cleaning flux from PC board (for Receptacle)
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
High current connectors
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
Handling the PC board after mounting the connector (for Receptacle)
The soldered areas should not be subjected to force.
Storage of connectors (for Receptacle)
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
Active optical connector
FPC/FFC connectors
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
7) Product failures due to condensation
are not covered by warranty.
Please refer to the latest product
specifications when designing your
product.
–183–
ACCTB92E 201602-T
Information
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
MID
Other Notes (for Receptacle)
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
Narrow pitch connectors
ISO14001 Certificate of approval
ISO9001 Certificate of approval
Panasonic Electromechanical Control Business Division, which
develops, manufactures and sells such as relays, switches and
sensors is certified according to the ISO 14001 environmental
management system standard established by the International
Standards for Organization (ISO).
Through our business activities, which objectives are to live in
harmony with the global environment and contribute to the
realization of a sustainable society, we have been making efforts
to reduce greenhouse gases and promote recycling of
resources. Furthermore, with due consideration to biodiversity,
we have been working for improving the global environment and
living in harmony with the international community.
Our Electromechanical Control Business Division, which
handles from development to production and marketing for
relays, switches and sensors, has been approved for certification
of the ISO9001 quality assurance standard established by the
International Standards for Organization (ISO).
MID
Active optical connector
FPC/FFC connectors
High current connectors
ISO14001, ISO9001, ISO/TS16949 Certificate of Approval
The Necessity and
Pursuit of ISO Certification
• Expanding to other
overseas bases
• Expanding to affiliated
companies and
cooperating companies
ISO/TS16949 Certificate of approval
Our Electromechanical Control Business Division has been
accredited for ISO/TS16949, covering our quality management
system for an entire spectrum of automotive products for relays,
switches and connectors.
ISO/TS16949 is a standard based on ISO9001 that adds items
necessary for the automobile industry.
It calls for a comprehensive quality management system that
includes CS, cost performance, ongoing improvement, and
many other aspects of quality management.
• Check on how internal quality
audit is being performed.
• ISO9000
Certification Acquisition
AP
C D
• Instructional activities relating to
ISO
• Preparation of quality manuals and
quality planning manuals
• Establishment of new quality
systems and expanding them to
business operations
• Upgrading internal quality
monitoring
Information
Advantages
• Strengthening and upgrading quality assurance
• organizational structures applicable on an international
• basis
• Technology can be accumulated and disseminated
• through documentation and records
• Leads to improved reliability of the manufacturer’s quality
• and improved CS (customer satisfaction)
–184–
AACTB5E 201602-T
AXE1
AXE2
AXE5
AXE6
AXE7
AXE8
Narrow pitch connector
A4US (0.4 mm pitch) Socket.................................... 44
Narrow pitch connector
A4US (0.4 mm pitch) Header ................................... 44
Narrow pitch connector
A4S (0.4 mm pitch) Socket ...................................... 52
Narrow pitch connector
A4S (0.4 mm pitch) Header...................................... 52
Narrow pitch connector
A35S (0.35 mm pitch) Socket .................................. 32
Narrow pitch connector
A35S (0.35 mm pitch) Header.................................. 32
AXK8
AXT
AXT1
AXT2
AXT3
AXT3
AXT4
AXF
AXF3
AXF4
AXF5A
AXF6A
High current connector
B01 Socket............................................................. 115
High current connector
B01 Header ............................................................ 115
High current connector
A35P Socket .......................................................... 110
High current connector
A35P Header.......................................................... 110
AXG
AXG1
AXG2
AXG7
AXG7
AXG8
AXG8
Narrow pitch connector
S35 (0.35 mm pitch) Socket..................................... 20
Narrow pitch connector
S35 (0.35 mm pitch) Header .................................... 20
Narrow pitch connector
A35US (0.35 mm pitch) Socket................................ 27
High current connector
A35US (0.35 mm pitch) with power terminal
Socket .................................................................... 105
Narrow pitch connector
A35US (0.35 mm pitch) Header ............................... 27
High current connector
A35US (0.35 mm pitch) with power terminal
Header ................................................................... 105
AXK5F
AXK5S
AXK6
AXK6F
AXT5
AXT6
AYF
AYF21
AYF33
AYF33
AYF35
AYF36
AYF41
AYF42
AYF53
AYF53
FPC connector Y2B (0.2 mm pitch)........................124
FPC connector Y3B (0.3 mm pitch)........................132
FPC connector Y3BW (0.3 mm pitch) ....................132
FPC connector Y3BL (0.3 mm pitch)......................128
FPC connector Y3BC (0.3 mm pitch) .....................140
FPC connector Y4BH (0.4 mm pitch)
100 Ω type..............................................................144
FPC connector Y4BH (0.4 mm pitch)
85 Ω and 90 Ω types .............................................144
FPC connector Y5B (0.5 mm pitch)........................148
FPC connector Y5BW (0.5 mm pitch) ....................148
AYG
AYG4
Active optical connector
V series ..................................................................153
AYL
AXK
AXK5
AXT4
Narrow pitch connector
P35S (0.35 mm pitch) Socket...................................38
Narrow pitch connector
P35S (0.35 mm pitch) Header..................................38
Narrow pitch connector
P4S (0.4 mm pitch) Socket.......................................66
Narrow pitch connector
P4S Shield type (0.4 mm pitch) Socket....................75
Narrow pitch connector
P4S (0.4 mm pitch) Header......................................66
Narrow pitch connector
P4S Shield type (0.4 mm pitch) Header ...................75
Narrow pitch connector
F4S (0.4 mm pitch) Socket.......................................59
Narrow pitch connector
F4S (0.4 mm pitch) Header ......................................59
AYL21
Narrow pitch connector
P5K (0.5 mm pitch) Socket ...................................... 96
Narrow pitch connector
P5KF (0.5 mm pitch) Socket .................................... 90
Narrow pitch connector
P5KS (0.5 mm pitch) Socket .................................... 96
Narrow pitch connector
P5K (0.5 mm pitch) Header...................................... 96
Narrow pitch connector
P5KF (0.5 mm pitch) Header ................................... 90
–185–
Narrow pitch connectors
AXE
High current connectors
AXK7
Narrow pitch connector
P5KS (0.5 mm pitch) Header ...................................96
Narrow pitch connector
P4 (0.4 mm pitch) Socket .........................................80
Narrow pitch connector
P4 (0.4 mm pitch) Header ........................................80
FPC/FFC connectors
AXK6S
MID Package AAM11 ............................................. 168
Active optical connector
AAM1
AYL29
High current connector
L2 Receptacle ........................................................120
High current connector
L2 Mating jig ...........................................................120
ACCTB45E 201602-T
Information
AAM
MID
INDEX
–186–
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
–187–
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
–188–
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
–189–
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
–190–
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
–191–
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
–192–
AACTB6E 201602-T
Information
MID
Active optical connector
FPC/FFC connectors
High current connectors
Narrow pitch connectors
Please contact ..........
Electromechanical Control Business Division
1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2016
ACCTB89E 201603-3.5YKN
Specifications are subject to change without notice.