Acetic Acid - BYU Cleanroom

Acetic Acid (H3COOH): GaAs; Pb; Ti
Hydrochloric Acid (HCl): Al; Cr; Cu; Fe2 O3 ; Ga; GaAs; GaN; In; Fe; Pb; Ni; NiO, Ni2 O3 ; Sn;
SnO2 ; Ti; Zn
Hydrofluoric Acid (HF): GaAs; Ni; SiO2 ; Ti
Nitric Acid (HNO 3 ): C; Cu; GaAs; In; Fe; Pb; Ni; Ag; Pd; Pt; Sn; Ti; Zn; ZnO
Phosphoric Acid (H3 PO4 ): Al; Cu; GaAs; GaN; Fe; Ni; SiN; ZnO
Potassium Hydroxide (KOH): Al; C; Cu; Ag; GaAs; Si; Ti
Sodium Hydroxide (NaOH): Al; Cu; Ag; Ti; GaAs; GaN
Sulfuric Acid (H 2SO4 ): C; Cu; GaAs; Fe; Pb; Ni; Ti
Aqua Regia (3 HCl : 1 HNO 3 ) etches all metals
Etchant
? Rate
Also etches—
Aluminum (Al)
19 H3 PO4 : 1 HAc : 1 HNO3 : 2 H2 O
40 Å/s SiN, M
10% K3 Fe(CN) 6
100 Å/s
Aluminum Oxide (Al2O3)
1 NH4 OH : 1 H2 O2 : 3 H2 O @ 80 ºC
Al, Poly
Brass (alloy Cu : Zn)
FeCl3
Cu, Ni
20% NH4 SO5
Al
Bronze (alloy Cu : Sn)
1% CrO3
Carbon (C)
H3 PO4 : CrO3 : NaCN
SiN
Chromium (Cr)
2 KMnO4 : 3 NaOH : 12 H2 O
Al
Copper (Cu)
30% FeCl3
Ni
20% KCN
Ag, Au
Gallium Arsenide (GaAs)
5% Br2 in CH3 OH
Fe
1 NH4 OH : 1 H2 O2
Al, Ag, Poly
Gold (Au)
1 I2 : 2 KI : 10 H2 O
Fe
KCN
Ag, Cu
Iron (Fe)
1 I2 : 2 KI : 10 H2 O
Au
Nickel (Ni)
30% FeCl3
Cu
Polymers (e.g.: photoresist, wax, epoxies)
5 NH4 OH : 1 H2 O2 @ 120 ºC
Al
Silicon (Si)
64 HNO3 : 3 NH4 F : 33 H2 O
100 Å/s M
61 EDA : 11 C6 H4 (OH) 2 : 28 H2 O
78 Å/s Poly
Silicon Oxide (SiO 2)
1 HF : 5 NH4 HF : 5 H2 O (BOE)
20 Å/s M, SiO2
Silver (Ag)
1 NH4 OH : 1 H2 O2
Al, Poly
Stainless Steel (alloy Fe : C : Cr)
1 HF : 1 HNO3
M
Tin (Sn)
2 HClO4 : 7 HAc
Doesn’t etch—
SiO2 , Si, PR
ZnO, SiO2 , SiN, Si, M, PR
SiO2 , SiN, Si, M
SiO2 , SiN, Si, M, PR
SiO2 , SiN, Si, M, PR
SiO2 , SiN, Si, PR
SiO2 , Si, PR
SiO2 , SiN, Si, M, PR
SiO2 , SiN, Si, M, PR
Al2 O3 , SiO2, SiN, Si, M, PR
SiO2 , SiN, Si, M
SiO2 , SiN, Si, M
SiO2 , SiN, Si, M, PR
Al2 O3 , SiO2, SiN, Si, M, PR
SiO2 , SiN, Si, M, PR
SiO2 , SiN, Si, M, PR
SiO2 , SiN, Si, M
SiN, PR
SiO2 , SiN, M
SiN, Si
SiO2 , SiN, Si, M
SiN, PR
SiO2 , SiN, Si, PR
H2 O
HCl
HF
HNO3
H2 SO4
H3 PO4
HAc
HClO4
H2 O2
NH4 OH
NH4 F
CH3 OH
EDA
C6 H4 (OH) 2
NaOH
KOH
KCN
NaCN
KFe(CN) 6
KMnO4
FeCl3
NH4 SO5
KI
I2
Br2
CrO3
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deionized (DI) water (l)
hydrochloric acid (38%, aq)
hydrofluoric acid (49%, aq)
nitric acid (70%, aq)
sulfuric acid (96%, aq)
phosphoric acid (85%, aq)
acetic acid (l, H3 COOH)
perchloric acid (68%, aq)
hydrogen peroxide (30%, aq)
ammonium hydroxide (30%, aq)
ammonium fluoride (40%, aq)
methanol (l)
ethylenediamine (l, NH2 O(CH2 ) 2 NH2 )
pyrocatechol (s)
sodium hydroxide (s)
potassium hydroxide (s)
potassium cyanide (s)
sodium cyanide (s)
potassium ferrocyanide (s)
potassium permanganate (s)
ferric chloride (s)
ammonium persulfate (s)
potassium iodide (s)
iodine (s)
bromine (l)
chromic oxide (s)
SiO2
SiN
Si
M
PR
Poly
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silicon oxide
silicon nitride (Si3 N4 , Si9 N12)
mono- or polycrystalline silicon
metals
photoresist (cured)
other polymers